WO2008155967A1 - Board with built-in component and its manufacturing method - Google Patents

Board with built-in component and its manufacturing method Download PDF

Info

Publication number
WO2008155967A1
WO2008155967A1 PCT/JP2008/059165 JP2008059165W WO2008155967A1 WO 2008155967 A1 WO2008155967 A1 WO 2008155967A1 JP 2008059165 W JP2008059165 W JP 2008059165W WO 2008155967 A1 WO2008155967 A1 WO 2008155967A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating layer
component
built
board
manufacturing
Prior art date
Application number
PCT/JP2008/059165
Other languages
French (fr)
Japanese (ja)
Inventor
Satoru Noda
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2009520404A priority Critical patent/JP5007746B2/en
Publication of WO2008155967A1 publication Critical patent/WO2008155967A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/82009—Pre-treatment of the connector or the bonding area
    • H01L2224/8203—Reshaping, e.g. forming vias
    • H01L2224/82035—Reshaping, e.g. forming vias by heating means
    • H01L2224/82039—Reshaping, e.g. forming vias by heating means using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The straightness of via conductors or through-hole conductors for connecting external electrodes of a chip component embedded in an insulating layer of a board with a built-in component to electrode layers on the insulating layer is enhanced. The external electrodes (4a, 4b) of a chip component (3) embedded in an insulating layer (2) have extended portions (42) on the top surface. The extended portions (42) include positions (42a) where via conductors (5) are formed, and are flattened at least in the positions to eliminate the curve of the surface. Consequently, the straightness of the via conductors (5) or the through-hole conductors formed in the insulating layer (2) is enhanced.
PCT/JP2008/059165 2007-06-15 2008-05-20 Board with built-in component and its manufacturing method WO2008155967A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009520404A JP5007746B2 (en) 2007-06-15 2008-05-20 Component built-in board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-158995 2007-06-15
JP2007158995 2007-06-15

Publications (1)

Publication Number Publication Date
WO2008155967A1 true WO2008155967A1 (en) 2008-12-24

Family

ID=40156126

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059165 WO2008155967A1 (en) 2007-06-15 2008-05-20 Board with built-in component and its manufacturing method

Country Status (2)

Country Link
JP (2) JP5007746B2 (en)
WO (1) WO2008155967A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011071111A1 (en) * 2009-12-09 2011-06-16 株式会社村田製作所 Resin substrate with built-in electronic component and electronic circuit module
CN102695366A (en) * 2011-03-23 2012-09-26 揖斐电株式会社 Wiring board with built-in electronic component and method for manufacturing the same
JP2015211097A (en) * 2014-04-25 2015-11-24 国立研究開発法人産業技術総合研究所 Component built-in substrate
JP2016105453A (en) * 2014-09-01 2016-06-09 株式会社村田製作所 Electronic-component-embedded substrate
JP2016149484A (en) * 2015-02-13 2016-08-18 Tdk株式会社 Multilayer capacitor
JP2016149487A (en) * 2015-02-13 2016-08-18 Tdk株式会社 Multilayer capacitor
JP2019117957A (en) * 2019-04-24 2019-07-18 国立研究開発法人産業技術総合研究所 Component built-in substrate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101497192B1 (en) 2012-12-27 2015-02-27 삼성전기주식회사 A printed circuit board comprising embeded electronic component within and a method for manufacturing
WO2015029783A1 (en) * 2013-08-29 2015-03-05 株式会社村田製作所 Method for manufacturing component-integrated sheet, method for manufacturing resin multilayer substrate in which electronic component is incorporated, and resin multilayer substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08144083A (en) * 1994-11-17 1996-06-04 Taiyo Yuden Co Ltd Plating post treatment of electronic parts
JP2002100875A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and capacitor
JP2003282332A (en) * 2002-03-25 2003-10-03 Murata Mfg Co Ltd Ceramic electronic component and method of manufacturing the ceramic electronic component

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4685251B2 (en) * 2000-02-09 2011-05-18 日本特殊陶業株式会社 Wiring board manufacturing method
JP4945842B2 (en) * 2000-04-05 2012-06-06 イビデン株式会社 Printed wiring board and printed wiring board manufacturing method
JP4530605B2 (en) * 2002-02-25 2010-08-25 京セラ株式会社 Multi-layer wiring board with built-in capacitor element
JP2005236067A (en) * 2004-02-20 2005-09-02 Dainippon Printing Co Ltd Wiring substrate, its manufacturing method and semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08144083A (en) * 1994-11-17 1996-06-04 Taiyo Yuden Co Ltd Plating post treatment of electronic parts
JP2002100875A (en) * 1999-09-02 2002-04-05 Ibiden Co Ltd Printed wiring board and capacitor
JP2003282332A (en) * 2002-03-25 2003-10-03 Murata Mfg Co Ltd Ceramic electronic component and method of manufacturing the ceramic electronic component

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011071111A1 (en) * 2009-12-09 2011-06-16 株式会社村田製作所 Resin substrate with built-in electronic component and electronic circuit module
CN102648671A (en) * 2009-12-09 2012-08-22 株式会社村田制作所 Resin substrate with built-in electronic component and electronic circuit module
JP5229401B2 (en) * 2009-12-09 2013-07-03 株式会社村田製作所 Resin substrate with built-in electronic components and electronic circuit module
CN102695366A (en) * 2011-03-23 2012-09-26 揖斐电株式会社 Wiring board with built-in electronic component and method for manufacturing the same
US9113575B2 (en) 2011-03-23 2015-08-18 Ibiden Co., Ltd. Wiring board with built-in electronic component and method for manufacturing the same
JP2015211097A (en) * 2014-04-25 2015-11-24 国立研究開発法人産業技術総合研究所 Component built-in substrate
JP2016105453A (en) * 2014-09-01 2016-06-09 株式会社村田製作所 Electronic-component-embedded substrate
KR20170036772A (en) * 2014-09-01 2017-04-03 가부시키가이샤 무라타 세이사쿠쇼 Electronic-component-embedded substrate
KR101972797B1 (en) * 2014-09-01 2019-04-29 가부시키가이샤 무라타 세이사쿠쇼 Electronic-component-embedded substrate
US10356908B2 (en) 2014-09-01 2019-07-16 Murata Manufacturing Co., Ltd. Electronic component containing substrate
JP2016149484A (en) * 2015-02-13 2016-08-18 Tdk株式会社 Multilayer capacitor
JP2016149487A (en) * 2015-02-13 2016-08-18 Tdk株式会社 Multilayer capacitor
CN105895372A (en) * 2015-02-13 2016-08-24 Tdk株式会社 Multilayer capacitor
CN105895372B (en) * 2015-02-13 2019-03-29 Tdk株式会社 Cascade capacitor
JP2019117957A (en) * 2019-04-24 2019-07-18 国立研究開発法人産業技術総合研究所 Component built-in substrate

Also Published As

Publication number Publication date
JPWO2008155967A1 (en) 2010-08-26
JP5007746B2 (en) 2012-08-22
JP2012019247A (en) 2012-01-26

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