TW200507250A - Semiconductor multipackage module including processor and memory package assemblies - Google Patents

Semiconductor multipackage module including processor and memory package assemblies

Info

Publication number
TW200507250A
TW200507250A TW093109292A TW93109292A TW200507250A TW 200507250 A TW200507250 A TW 200507250A TW 093109292 A TW093109292 A TW 093109292A TW 93109292 A TW93109292 A TW 93109292A TW 200507250 A TW200507250 A TW 200507250A
Authority
TW
Taiwan
Prior art keywords
multipackage module
module including
package assemblies
including processor
memory package
Prior art date
Application number
TW093109292A
Other languages
English (en)
Inventor
Marcos Karnezos
Original Assignee
Chippac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chippac Inc filed Critical Chippac Inc
Publication of TW200507250A publication Critical patent/TW200507250A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06568—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices decreasing in size, e.g. pyramidical stack
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Semiconductor Memories (AREA)
TW093109292A 2003-04-04 2004-04-02 Semiconductor multipackage module including processor and memory package assemblies TW200507250A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46054103P 2003-04-04 2003-04-04
US10/618,933 US7034387B2 (en) 2003-04-04 2003-07-14 Semiconductor multipackage module including processor and memory package assemblies

Publications (1)

Publication Number Publication Date
TW200507250A true TW200507250A (en) 2005-02-16

Family

ID=33101456

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093109292A TW200507250A (en) 2003-04-04 2004-04-02 Semiconductor multipackage module including processor and memory package assemblies

Country Status (6)

Country Link
US (3) US7034387B2 (zh)
EP (1) EP1616350A4 (zh)
JP (1) JP2006522478A (zh)
KR (1) KR101050402B1 (zh)
TW (1) TW200507250A (zh)
WO (1) WO2004095537A2 (zh)

Families Citing this family (140)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7205647B2 (en) * 2002-09-17 2007-04-17 Chippac, Inc. Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
US20040061213A1 (en) * 2002-09-17 2004-04-01 Chippac, Inc. Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
US7064426B2 (en) * 2002-09-17 2006-06-20 Chippac, Inc. Semiconductor multi-package module having wire bond interconnect between stacked packages
US7053476B2 (en) * 2002-09-17 2006-05-30 Chippac, Inc. Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
US7057269B2 (en) * 2002-10-08 2006-06-06 Chippac, Inc. Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
US7034387B2 (en) * 2003-04-04 2006-04-25 Chippac, Inc. Semiconductor multipackage module including processor and memory package assemblies
US6853064B2 (en) * 2003-05-12 2005-02-08 Micron Technology, Inc. Semiconductor component having stacked, encapsulated dice
JP5197961B2 (ja) * 2003-12-17 2013-05-15 スタッツ・チップパック・インコーポレイテッド マルチチップパッケージモジュールおよびその製造方法
TWI283467B (en) * 2003-12-31 2007-07-01 Advanced Semiconductor Eng Multi-chip package structure
US20060138631A1 (en) * 2003-12-31 2006-06-29 Advanced Semiconductor Engineering, Inc. Multi-chip package structure
US7215018B2 (en) * 2004-04-13 2007-05-08 Vertical Circuits, Inc. Stacked die BGA or LGA component assembly
US8552551B2 (en) * 2004-05-24 2013-10-08 Chippac, Inc. Adhesive/spacer island structure for stacking over wire bonded die
US20050258527A1 (en) 2004-05-24 2005-11-24 Chippac, Inc. Adhesive/spacer island structure for multiple die package
US20050269692A1 (en) * 2004-05-24 2005-12-08 Chippac, Inc Stacked semiconductor package having adhesive/spacer structure and insulation
US7253511B2 (en) * 2004-07-13 2007-08-07 Chippac, Inc. Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
US7745918B1 (en) 2004-11-24 2010-06-29 Amkor Technology, Inc. Package in package (PiP)
US7361986B2 (en) * 2004-12-01 2008-04-22 Taiwan Semiconductor Manufacturing Company, Ltd. Heat stud for stacked chip package
JP2006216911A (ja) * 2005-02-07 2006-08-17 Renesas Technology Corp 半導体装置およびカプセル型半導体パッケージ
JP4555119B2 (ja) * 2005-02-22 2010-09-29 アルプス電気株式会社 面実装型電子回路ユニット
US7372141B2 (en) * 2005-03-31 2008-05-13 Stats Chippac Ltd. Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides
KR101213661B1 (ko) * 2005-03-31 2012-12-17 스태츠 칩팩, 엘티디. 칩 스케일 패키지 및 제 2 기판을 포함하고 있으며 상부면및 하부면에서 노출된 기판 표면들을 갖는 반도체 어셈블리
US7364945B2 (en) 2005-03-31 2008-04-29 Stats Chippac Ltd. Method of mounting an integrated circuit package in an encapsulant cavity
JP2006303003A (ja) * 2005-04-18 2006-11-02 Toshiba Corp プリント基板、および情報処理装置
US7429786B2 (en) * 2005-04-29 2008-09-30 Stats Chippac Ltd. Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides
US7354800B2 (en) * 2005-04-29 2008-04-08 Stats Chippac Ltd. Method of fabricating a stacked integrated circuit package system
TWI264887B (en) * 2005-05-05 2006-10-21 Universal Scient Ind Co Ltd Small-form-factor wireless communication module and manufacturing method thereof
US7582960B2 (en) * 2005-05-05 2009-09-01 Stats Chippac Ltd. Multiple chip package module including die stacked over encapsulated package
US7394148B2 (en) 2005-06-20 2008-07-01 Stats Chippac Ltd. Module having stacked chip scale semiconductor packages
KR100631991B1 (ko) * 2005-07-14 2006-10-09 삼성전기주식회사 Ｉｃ 칩 적층 구조를 갖는 전자 기기용 모듈
KR100749469B1 (ko) * 2005-09-15 2007-08-14 엠텍비젼 주식회사 복수의 메모리를 포함한 멀티미디어 플랫폼을 구비한 장치및 비휘발성 메모리 공유 방법
JP4686318B2 (ja) * 2005-09-28 2011-05-25 ルネサスエレクトロニクス株式会社 半導体装置
TWI305410B (en) * 2005-10-26 2009-01-11 Advanced Semiconductor Eng Multi-chip package structure
US20070108611A1 (en) * 2005-11-17 2007-05-17 International Business Machines Corporation Stacking method and stacked structure for attaching memory components to associated device
US7456088B2 (en) 2006-01-04 2008-11-25 Stats Chippac Ltd. Integrated circuit package system including stacked die
US7768125B2 (en) 2006-01-04 2010-08-03 Stats Chippac Ltd. Multi-chip package system
KR100690246B1 (ko) * 2006-01-10 2007-03-12 삼성전자주식회사 플립 칩 시스템 인 패키지 제조 방법
US7750482B2 (en) 2006-02-09 2010-07-06 Stats Chippac Ltd. Integrated circuit package system including zero fillet resin
US8704349B2 (en) 2006-02-14 2014-04-22 Stats Chippac Ltd. Integrated circuit package system with exposed interconnects
DE102006012446B3 (de) * 2006-03-17 2007-12-20 Infineon Technologies Ag Speichermodul mit einem Mittel zur Kühlung, Verfahren zur Herstellung des Speichermoduls mit einem Mittel zur Kühlung sowie Datenverarbeitungsgerät umfassend ein Speichermodul mit einem Mittel zur Kühlung
US7710735B2 (en) * 2006-04-01 2010-05-04 Stats Chippac Ltd. Multichip package system
JP2007294560A (ja) * 2006-04-24 2007-11-08 Nec Electronics Corp 半導体装置およびその製造方法
US20070252260A1 (en) * 2006-04-28 2007-11-01 Micron Technology, Inc. Stacked die packages
US7569918B2 (en) * 2006-05-01 2009-08-04 Texas Instruments Incorporated Semiconductor package-on-package system including integrated passive components
JP2007324354A (ja) * 2006-05-31 2007-12-13 Sony Corp 半導体装置
US8063482B2 (en) 2006-06-30 2011-11-22 Intel Corporation Heat spreader as mechanical reinforcement for ultra-thin die
KR100813621B1 (ko) * 2006-10-03 2008-03-17 삼성전자주식회사 적층형 반도체 소자 패키지
KR100816119B1 (ko) * 2006-12-28 2008-03-21 주식회사 하이닉스반도체 멀티 다이 패키지 장치
JP2008192725A (ja) * 2007-02-02 2008-08-21 Spansion Llc 半導体装置及びその製造方法並びに半導体装置の製造装置
US9466545B1 (en) 2007-02-21 2016-10-11 Amkor Technology, Inc. Semiconductor package in package
KR100817091B1 (ko) * 2007-03-02 2008-03-26 삼성전자주식회사 적층형 반도체 패키지 및 그 제조방법
US8609463B2 (en) * 2007-03-16 2013-12-17 Stats Chippac Ltd. Integrated circuit package system employing multi-package module techniques
US8212352B2 (en) * 2007-03-28 2012-07-03 Stats Chippac Ltd. Integrated circuit package system with heat sink spacer structures
US8723332B2 (en) * 2007-06-11 2014-05-13 Invensas Corporation Electrically interconnected stacked die assemblies
US20080315407A1 (en) * 2007-06-20 2008-12-25 Vertical Circuits, Inc. Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabrication
JP2009016398A (ja) * 2007-06-29 2009-01-22 Toshiba Corp プリント配線板構造、電子部品の実装方法および電子機器
US8704379B2 (en) * 2007-09-10 2014-04-22 Invensas Corporation Semiconductor die mount by conformal die coating
US8212339B2 (en) 2008-02-05 2012-07-03 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8350367B2 (en) * 2008-02-05 2013-01-08 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
KR100961308B1 (ko) 2008-02-25 2010-06-04 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US8018039B2 (en) * 2008-03-06 2011-09-13 Stats Chippac Ltd. Integrated circuit package system with stacked devices
JP2009239261A (ja) * 2008-03-07 2009-10-15 Panasonic Corp 電子ユニット、電子装置
CN103325764B (zh) 2008-03-12 2016-09-07 伊文萨思公司 支撑安装的电互连管芯组件
US9153517B2 (en) 2008-05-20 2015-10-06 Invensas Corporation Electrical connector between die pad and z-interconnect for stacked die assemblies
US7863159B2 (en) * 2008-06-19 2011-01-04 Vertical Circuits, Inc. Semiconductor die separation method
US8410584B2 (en) * 2008-08-08 2013-04-02 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US7986158B2 (en) * 2008-08-21 2011-07-26 OFID Microdevices, Inc. Methods, apparatuses, and products for a secure circuit
US10251273B2 (en) 2008-09-08 2019-04-02 Intel Corporation Mainboard assembly including a package overlying a die directly attached to the mainboard
US7982298B1 (en) 2008-12-03 2011-07-19 Amkor Technology, Inc. Package in package semiconductor device
US8487420B1 (en) 2008-12-08 2013-07-16 Amkor Technology, Inc. Package in package semiconductor device with film over wire
US8399983B1 (en) * 2008-12-11 2013-03-19 Xilinx, Inc. Semiconductor assembly with integrated circuit and companion device
KR20100071522A (ko) * 2008-12-19 2010-06-29 삼성전자주식회사 패키지 온 패키지 타입의 고용량 다기능 멀티 칩 패키지 구조
US20170117214A1 (en) 2009-01-05 2017-04-27 Amkor Technology, Inc. Semiconductor device with through-mold via
JP2010161184A (ja) 2009-01-08 2010-07-22 Hitachi Ltd 半導体装置
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
US8110902B2 (en) * 2009-02-19 2012-02-07 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
TWI379367B (en) * 2009-06-15 2012-12-11 Kun Yuan Technology Co Ltd Chip packaging method and structure thereof
TWI570879B (zh) * 2009-06-26 2017-02-11 英維瑟斯公司 半導體總成及晶粒堆疊總成
US8212340B2 (en) 2009-07-13 2012-07-03 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
KR20110006482A (ko) * 2009-07-14 2011-01-20 삼성전자주식회사 메모리 링크 아키텍쳐를 갖는 멀티 프로세서 시스템에 적합한 멀티 칩 패키지 구조
US9147583B2 (en) 2009-10-27 2015-09-29 Invensas Corporation Selective die electrical insulation by additive process
TWI544604B (zh) 2009-11-04 2016-08-01 英維瑟斯公司 具有降低應力電互連的堆疊晶粒總成
US8368185B2 (en) * 2009-11-19 2013-02-05 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8378466B2 (en) * 2009-11-19 2013-02-19 Advanced Semiconductor Engineering, Inc. Wafer-level semiconductor device packages with electromagnetic interference shielding
US8030750B2 (en) * 2009-11-19 2011-10-04 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
TWI497679B (zh) * 2009-11-27 2015-08-21 Advanced Semiconductor Eng 半導體封裝件及其製造方法
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (zh) 2010-03-22 2013-10-01 Advanced Semiconductor Eng 半導體封裝件及其製造方法
KR20110137926A (ko) * 2010-06-18 2011-12-26 (주)에프씨아이 적층 다중 칩 패키지 구조
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
US9865310B2 (en) * 2011-02-24 2018-01-09 Interconnect Systems, Inc. High density memory modules
JP5252007B2 (ja) * 2011-03-08 2013-07-31 株式会社村田製作所 電子部品の製造方法
US8569882B2 (en) * 2011-03-24 2013-10-29 Stats Chippac Ltd. Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof
RU2463684C1 (ru) * 2011-05-17 2012-10-10 Российская Федерация, от имени которой выступает Министерство промышленности и торговли РФ Многокристальный модуль
JP2013021216A (ja) * 2011-07-13 2013-01-31 Toshiba Corp 積層型半導体パッケージ
US8552567B2 (en) 2011-07-27 2013-10-08 Micron Technology, Inc. Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
US8937309B2 (en) 2011-08-08 2015-01-20 Micron Technology, Inc. Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
US8749037B1 (en) 2011-10-28 2014-06-10 Altera Corporation Multi-access memory system and a method to manufacture the system
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
KR101869303B1 (ko) * 2012-09-03 2018-06-20 에이치피프린팅코리아 주식회사 전자 장치, 디-커플링 커패시터 최적화 방법 및 컴퓨터 판독가능 기록매체
KR20140067359A (ko) * 2012-11-26 2014-06-05 삼성전기주식회사 적층형 반도체 패키지
US9070653B2 (en) 2013-01-15 2015-06-30 Freescale Semiconductor, Inc. Microelectronic assembly having a heat spreader for a plurality of die
CN103227170A (zh) * 2013-03-29 2013-07-31 日月光半导体制造股份有限公司 堆迭式半导体结构及其制造方法
KR101486790B1 (ko) 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
KR102144367B1 (ko) * 2013-10-22 2020-08-14 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US10242969B2 (en) * 2013-11-12 2019-03-26 Infineon Technologies Ag Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same
WO2015142321A1 (en) * 2014-03-18 2015-09-24 Hewlett Packard Development Company, L.P. Secure element
JP6356450B2 (ja) * 2014-03-20 2018-07-11 株式会社東芝 半導体装置および電子回路装置
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
TWI690029B (zh) * 2014-06-13 2020-04-01 蘋果公司 重組態之寬輸入輸出記憶體模組及使用其之封裝架構
US10177185B2 (en) 2015-05-07 2019-01-08 Taiwan Semiconductor Manufacturing Co., Ltd. High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof
US10535633B2 (en) 2015-07-02 2020-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Chip package having die structures of different heights and method of forming same
US9806058B2 (en) * 2015-07-02 2017-10-31 Taiwan Semiconductor Manufacturing Company, Ltd. Chip package having die structures of different heights and method of forming same
US9825002B2 (en) 2015-07-17 2017-11-21 Invensas Corporation Flipped die stack
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
US9490195B1 (en) 2015-07-17 2016-11-08 Invensas Corporation Wafer-level flipped die stacks with leadframes or metal foil interconnects
US10504736B2 (en) 2015-09-30 2019-12-10 Texas Instruments Incorporated Plating interconnect for silicon chip
KR102492527B1 (ko) * 2015-10-12 2023-01-31 삼성전자주식회사 데이터 스토리지 소자 및 그를 포함하는 전자 장치
US10411001B2 (en) * 2015-12-16 2019-09-10 Intel Corporation Dynamic random access memory (DRAM) mounts
US9508691B1 (en) 2015-12-16 2016-11-29 Invensas Corporation Flipped die stacks with multiple rows of leadframe interconnects
US10566310B2 (en) 2016-04-11 2020-02-18 Invensas Corporation Microelectronic packages having stacked die and wire bond interconnects
US9595511B1 (en) 2016-05-12 2017-03-14 Invensas Corporation Microelectronic packages and assemblies with improved flyby signaling operation
US9728524B1 (en) 2016-06-30 2017-08-08 Invensas Corporation Enhanced density assembly having microelectronic packages mounted at substantial angle to board
US10034407B2 (en) * 2016-07-22 2018-07-24 Intel Corporation Storage sled for a data center
KR20180055635A (ko) * 2016-11-14 2018-05-25 삼성전자주식회사 반도체 모듈
CN108695284A (zh) * 2017-04-07 2018-10-23 晟碟信息科技（上海）有限公司 包括纵向集成半导体封装体组的半导体设备
US20190013214A1 (en) * 2017-07-10 2019-01-10 Powertech Technology Inc. Package structure and manufacturing method thereof
US11145632B2 (en) * 2017-09-29 2021-10-12 Intel Corporation High density die package configuration on system boards
KR102365682B1 (ko) 2017-11-13 2022-02-21 삼성전자주식회사 반도체 패키지
KR102468765B1 (ko) 2017-11-29 2022-11-22 삼성전자주식회사 반도체 패키지 구조체 및 이를 포함하는 반도체 모듈
US10418255B2 (en) * 2017-12-01 2019-09-17 Micron Technology, Inc. Semiconductor device packages and related methods
KR102448248B1 (ko) * 2018-05-24 2022-09-27 삼성전자주식회사 Pop형 반도체 패키지 및 그 제조 방법
JP2020047651A (ja) * 2018-09-14 2020-03-26 キオクシア株式会社 半導体装置
US11264300B2 (en) * 2018-09-17 2022-03-01 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure with lid and method for forming the same
US20200118991A1 (en) * 2018-10-15 2020-04-16 Intel Corporation Pre-patterned fine-pitch bond pad interposer
US10916507B2 (en) 2018-12-04 2021-02-09 International Business Machines Corporation Multiple chip carrier for bridge assembly
DE102020106492A1 (de) * 2019-04-12 2020-10-15 Infineon Technologies Ag Chip -package, verfahren zum bilden eines chip -packages, halbleitervorrichtung, halbleiteranordnung, dreiphasensystem, verfahren zum bilden einer halbleitervorrichtung und verfahren zum bilden einer halbleiteranordnung
US11652020B2 (en) * 2019-05-29 2023-05-16 Intel Corporation Thermal solutions for multi-package assemblies and methods for fabricating the same
US11948855B1 (en) * 2019-09-27 2024-04-02 Rockwell Collins, Inc. Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader
US20230154905A1 (en) * 2021-11-12 2023-05-18 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same

Family Cites Families (197)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4081769A (en) * 1976-09-13 1978-03-28 Texas Instruments Incorporated Acoustic surface wave resonator with suppressed direct coupled response
US4147889A (en) 1978-02-28 1979-04-03 Amp Incorporated Chip carrier
US4531267A (en) * 1982-03-30 1985-07-30 Honeywell Inc. Method for forming a pressure sensor
KR970003915B1 (ko) * 1987-06-24 1997-03-22 미다 가쓰시게 반도체 기억장치 및 그것을 사용한 반도체 메모리 모듈
US5138438A (en) 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
JP2555193B2 (ja) * 1989-08-22 1996-11-20 ファナック株式会社 オルダム継手
IT1237135B (it) * 1989-10-30 1993-05-24 Pirelli Cavi Spa Gruppo di amplificazione ottico a basso rumore, con riflessione della potenza di pompaggio.
US5160870A (en) * 1990-06-25 1992-11-03 Carson Paul L Ultrasonic image sensing array and method
US5446620A (en) 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
FR2670322B1 (fr) 1990-12-05 1997-07-04 Matra Espace Modules de memoire a l'etat solide et dispositifs de memoire comportant de tels modules
US5231327A (en) * 1990-12-14 1993-07-27 Tfr Technologies, Inc. Optimized piezoelectric resonator-based networks
US5132773A (en) 1991-02-06 1992-07-21 Olin Corporation Carrier ring having first and second ring means with bonded surfaces
US5192925A (en) * 1991-05-02 1993-03-09 Murata Manufacturing Co., Ltd. Piezoelectric resonator and method of fabricating the same
JPH04334034A (ja) * 1991-05-09 1992-11-20 Fujitsu Ltd ワイヤボンディング方法
US5252783A (en) 1992-02-10 1993-10-12 Motorola, Inc. Semiconductor package
US5222014A (en) 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
US5422435A (en) 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
FR2694840B1 (fr) 1992-08-13 1994-09-09 Commissariat Energie Atomique Module multi-puces à trois dimensions.
JP3105089B2 (ja) 1992-09-11 2000-10-30 株式会社東芝 半導体装置
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5340771A (en) 1993-03-18 1994-08-23 Lsi Logic Corporation Techniques for providing high I/O count connections to semiconductor dies
US5362986A (en) * 1993-08-19 1994-11-08 International Business Machines Corporation Vertical chip mount memory package with packaging substrate and memory chip pairs
US5444296A (en) 1993-11-22 1995-08-22 Sun Microsystems, Inc. Ball grid array packages for high speed applications
US5436203A (en) 1994-07-05 1995-07-25 Motorola, Inc. Shielded liquid encapsulated semiconductor device and method for making the same
MY112145A (en) 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
JP2573809B2 (ja) 1994-09-29 1997-01-22 九州日本電気株式会社 電子部品内蔵のマルチチップモジュール
US5652185A (en) 1995-04-07 1997-07-29 National Semiconductor Corporation Maximized substrate design for grid array based assemblies
US5842628A (en) * 1995-04-10 1998-12-01 Fujitsu Limited Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method
JP2792473B2 (ja) * 1995-07-06 1998-09-03 日本電気株式会社 マルチチップモジュール
US5874780A (en) * 1995-07-27 1999-02-23 Nec Corporation Method of mounting a semiconductor device to a substrate and a mounted structure
US5692279A (en) * 1995-08-17 1997-12-02 Motorola Method of making a monolithic thin film resonator lattice filter
KR970030760A (ko) * 1995-11-23 1997-06-26 김광호 패키지 삽입형 소켓을 구비한 멀티 패키지 모듈
US5719440A (en) 1995-12-19 1998-02-17 Micron Technology, Inc. Flip chip adaptor package for bare die
US7166495B2 (en) 1996-02-20 2007-01-23 Micron Technology, Inc. Method of fabricating a multi-die semiconductor package assembly
US5798557A (en) * 1996-08-29 1998-08-25 Harris Corporation Lid wafer bond packaging and micromachining
US6075289A (en) 1996-10-24 2000-06-13 Tessera, Inc. Thermally enhanced packaged semiconductor assemblies
US5872403A (en) 1997-01-02 1999-02-16 Lucent Technologies, Inc. Package for a power semiconductor die and power supply employing the same
US5994166A (en) 1997-03-10 1999-11-30 Micron Technology, Inc. Method of constructing stacked packages
US5872493A (en) * 1997-03-13 1999-02-16 Nokia Mobile Phones, Ltd. Bulk acoustic wave (BAW) filter having a top portion that includes a protective acoustic mirror
US5898219A (en) 1997-04-02 1999-04-27 Intel Corporation Custom corner attach heat sink design for a plastic ball grid array integrated circuit package
JPH10294423A (ja) 1997-04-17 1998-11-04 Nec Corp 半導体装置
US5982633A (en) 1997-08-20 1999-11-09 Compaq Computer Corporation Opposed ball grid array mounting
JP3834426B2 (ja) 1997-09-02 2006-10-18 沖電気工業株式会社 半導体装置
CA2218307C (en) 1997-10-10 2006-01-03 Gennum Corporation Three dimensional packaging configuration for multi-chip module assembly
JP3644662B2 (ja) 1997-10-29 2005-05-11 株式会社ルネサステクノロジ 半導体モジュール
JPH11219984A (ja) 1997-11-06 1999-08-10 Sharp Corp 半導体装置パッケージおよびその製造方法ならびにそのための回路基板
US5899705A (en) 1997-11-20 1999-05-04 Akram; Salman Stacked leads-over chip multi-chip module
JP3481444B2 (ja) 1998-01-14 2003-12-22 シャープ株式会社 半導体装置及びその製造方法
JP2000208698A (ja) 1999-01-18 2000-07-28 Toshiba Corp 半導体装置
US6150724A (en) * 1998-03-02 2000-11-21 Motorola, Inc. Multi-chip semiconductor device and method for making the device by using multiple flip chip interfaces
US6028389A (en) * 1998-05-26 2000-02-22 The Charles Stark Draper Laboratory, Inc. Micromachined piezoelectric transducer
TW434756B (en) 1998-06-01 2001-05-16 Hitachi Ltd Semiconductor device and its manufacturing method
US6451624B1 (en) 1998-06-05 2002-09-17 Micron Technology, Inc. Stackable semiconductor package having conductive layer and insulating layers and method of fabrication
US6020629A (en) 1998-06-05 2000-02-01 Micron Technology, Inc. Stacked semiconductor package and method of fabrication
US6034875A (en) 1998-06-17 2000-03-07 International Business Machines Corporation Cooling structure for electronic components
US5977640A (en) 1998-06-26 1999-11-02 International Business Machines Corporation Highly integrated chip-on-chip packaging
US6297960B1 (en) * 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
JP3019211B2 (ja) * 1998-07-06 2000-03-13 株式会社曙川電機製作所 スターター用リング類のプレス生産方法
US5942958A (en) * 1998-07-27 1999-08-24 Tfr Technologies, Inc. Symmetrical piezoelectric resonator filter
JP2000058691A (ja) 1998-08-07 2000-02-25 Sharp Corp ミリ波半導体装置
US6049467A (en) * 1998-08-31 2000-04-11 Unisys Corporation Stackable high density RAM modules
US6201302B1 (en) 1998-12-31 2001-03-13 Sampo Semiconductor Corporation Semiconductor package having multi-dies
US6075712A (en) 1999-01-08 2000-06-13 Intel Corporation Flip-chip having electrical contact pads on the backside of the chip
US6184659B1 (en) 1999-02-16 2001-02-06 Microchip Technology Incorporated Microcontroller with integral switch mode power supply controller
JP3685947B2 (ja) 1999-03-15 2005-08-24 新光電気工業株式会社 半導体装置及びその製造方法
JP4075204B2 (ja) 1999-04-09 2008-04-16 松下電器産業株式会社 積層型半導体装置
US6118176A (en) 1999-04-26 2000-09-12 Advanced Semiconductor Engineering, Inc. Stacked chip assembly utilizing a lead frame
JP2000315776A (ja) * 1999-05-06 2000-11-14 Hitachi Ltd 半導体装置
US6262637B1 (en) * 1999-06-02 2001-07-17 Agilent Technologies, Inc. Duplexer incorporating thin-film bulk acoustic resonators (FBARs)
US6890798B2 (en) 1999-06-08 2005-05-10 Intel Corporation Stacked chip packaging
US6238949B1 (en) 1999-06-18 2001-05-29 National Semiconductor Corporation Method and apparatus for forming a plastic chip on chip package module
JP3526788B2 (ja) 1999-07-01 2004-05-17 沖電気工業株式会社 半導体装置の製造方法
SG87046A1 (en) 1999-08-17 2002-03-19 Micron Technology Inc Multi-chip module with stacked dice
US6424033B1 (en) 1999-08-31 2002-07-23 Micron Technology, Inc. Chip package with grease heat sink and method of making
KR100533673B1 (ko) 1999-09-03 2005-12-05 세이코 엡슨 가부시키가이샤 반도체 장치 및 그 제조 방법, 회로 기판 및 전자 기기
JP2001156212A (ja) 1999-09-16 2001-06-08 Nec Corp 樹脂封止型半導体装置及びその製造方法
JP2001094045A (ja) 1999-09-22 2001-04-06 Seiko Epson Corp 半導体装置
JP3485507B2 (ja) 1999-10-25 2004-01-13 沖電気工業株式会社 半導体装置
JP2001127246A (ja) 1999-10-29 2001-05-11 Fujitsu Ltd 半導体装置
US6392896B1 (en) * 1999-12-22 2002-05-21 International Business Machines Corporation Semiconductor package containing multiple memory units
US6376904B1 (en) 1999-12-23 2002-04-23 Rambus Inc. Redistributed bond pads in stacked integrated circuit die package
US20030082845A1 (en) 2000-01-14 2003-05-01 Amkor Technology, Inc. Package for multiple integrated circuits and method of making
JP2001223326A (ja) 2000-02-09 2001-08-17 Hitachi Ltd 半導体装置
KR100335717B1 (ko) * 2000-02-18 2002-05-08 윤종용 고용량 메모리 카드
US6437446B1 (en) 2000-03-16 2002-08-20 Oki Electric Industry Co., Ltd. Semiconductor device having first and second chips
KR100408616B1 (ko) * 2000-03-21 2003-12-03 미쓰비시덴키 가부시키가이샤 반도체 장치, 전자 기기의 제조 방법, 전자 기기 및 휴대정보 단말
US6462421B1 (en) 2000-04-10 2002-10-08 Advanced Semicondcutor Engineering, Inc. Multichip module
JP2001308262A (ja) 2000-04-26 2001-11-02 Mitsubishi Electric Corp 樹脂封止ｂｇａ型半導体装置
JP3701542B2 (ja) 2000-05-10 2005-09-28 シャープ株式会社 半導体装置およびその製造方法
JP2001320014A (ja) 2000-05-11 2001-11-16 Seiko Epson Corp 半導体装置及びその製造方法
US6522018B1 (en) * 2000-05-16 2003-02-18 Micron Technology, Inc. Ball grid array chip packages having improved testing and stacking characteristics
TW445610B (en) 2000-06-16 2001-07-11 Siliconware Precision Industries Co Ltd Stacked-die packaging structure
US6258626B1 (en) 2000-07-06 2001-07-10 Advanced Semiconductor Engineering, Inc. Method of making stacked chip package
JP2002033441A (ja) * 2000-07-14 2002-01-31 Mitsubishi Electric Corp 半導体装置
TW459361B (en) 2000-07-17 2001-10-11 Siliconware Precision Industries Co Ltd Three-dimensional multiple stacked-die packaging structure
US6472758B1 (en) 2000-07-20 2002-10-29 Amkor Technology, Inc. Semiconductor package including stacked semiconductor dies and bond wires
JP2002040095A (ja) 2000-07-26 2002-02-06 Nec Corp 半導体装置及びその実装方法
JP4361670B2 (ja) 2000-08-02 2009-11-11 富士通マイクロエレクトロニクス株式会社 半導体素子積層体、半導体素子積層体の製造方法、及び半導体装置
US6607937B1 (en) 2000-08-23 2003-08-19 Micron Technology, Inc. Stacked microelectronic dies and methods for stacking microelectronic dies
KR20020043647A (ko) * 2000-08-24 2002-06-10 하이 커넥터 덴서티, 인코포레이티드 저프로파일, 고밀도 메모리시스템
US6593648B2 (en) 2000-08-31 2003-07-15 Seiko Epson Corporation Semiconductor device and method of making the same, circuit board and electronic equipment
JP4570809B2 (ja) 2000-09-04 2010-10-27 富士通セミコンダクター株式会社 積層型半導体装置及びその製造方法
JP3581086B2 (ja) 2000-09-07 2004-10-27 松下電器産業株式会社 半導体装置
US6492726B1 (en) 2000-09-22 2002-12-10 Chartered Semiconductor Manufacturing Ltd. Chip scale packaging with multi-layer flip chip arrangement and ball grid array interconnection
KR100576902B1 (ko) * 2000-10-02 2006-05-03 마츠시타 덴끼 산교 가부시키가이샤 카드형 기록 매체 및 그 제조 방법
JP2002118201A (ja) 2000-10-05 2002-04-19 Hitachi Ltd 半導体装置およびその製造方法
JP3913481B2 (ja) 2001-01-24 2007-05-09 シャープ株式会社 半導体装置および半導体装置の製造方法
TW459363B (en) 2000-11-22 2001-10-11 Kingpak Tech Inc Integrated circuit stacking structure and the manufacturing method thereof
JP3798620B2 (ja) 2000-12-04 2006-07-19 富士通株式会社 半導体装置の製造方法
US6340846B1 (en) 2000-12-06 2002-01-22 Amkor Technology, Inc. Making semiconductor packages with stacked dies and reinforced wire bonds
US6777819B2 (en) 2000-12-20 2004-08-17 Siliconware Precision Industries Co., Ltd. Semiconductor package with flash-proof device
JP3619773B2 (ja) * 2000-12-20 2005-02-16 株式会社ルネサステクノロジ 半導体装置の製造方法
RU2183884C1 (ru) * 2000-12-21 2002-06-20 СИНЕРДЖЕСТИК КОМПЬЮТИНГ СИСТЕМС (СИКС) АпС Гибридный многоуровневый электронный модуль
US6414384B1 (en) * 2000-12-22 2002-07-02 Silicon Precision Industries Co., Ltd. Package structure stacking chips on front surface and back surface of substrate
US6734539B2 (en) 2000-12-27 2004-05-11 Lucent Technologies Inc. Stacked module package
JP2002208656A (ja) 2001-01-11 2002-07-26 Mitsubishi Electric Corp 半導体装置
JP4586273B2 (ja) 2001-01-15 2010-11-24 ソニー株式会社 半導体装置構造
TW554509B (en) 2001-01-19 2003-09-21 Advanced Semiconductor Eng Multi-chip module
JP3565334B2 (ja) 2001-01-25 2004-09-15 シャープ株式会社 半導体装置およびそれを用いる液晶モジュール、並びに半導体装置の製造方法
US6388313B1 (en) 2001-01-30 2002-05-14 Siliconware Precision Industries Co., Ltd. Multi-chip module
JP2002231885A (ja) 2001-02-06 2002-08-16 Mitsubishi Electric Corp 半導体装置
JP4780844B2 (ja) 2001-03-05 2011-09-28 Ｏｋｉセミコンダクタ株式会社 半導体装置
TW502408B (en) 2001-03-09 2002-09-11 Advanced Semiconductor Eng Chip with chamfer
JP2002280516A (ja) 2001-03-19 2002-09-27 Toshiba Corp 半導体モジュール
US6441483B1 (en) 2001-03-30 2002-08-27 Micron Technology, Inc. Die stacking scheme
SG108245A1 (en) 2001-03-30 2005-01-28 Micron Technology Inc Ball grid array interposer, packages and methods
JP3839323B2 (ja) 2001-04-06 2006-11-01 株式会社ルネサステクノロジ 半導体装置の製造方法
US6791166B1 (en) 2001-04-09 2004-09-14 Amkor Technology, Inc. Stackable lead frame package using exposed internal lead traces
US6400007B1 (en) 2001-04-16 2002-06-04 Kingpak Technology Inc. Stacked structure of semiconductor means and method for manufacturing the same
US6778390B2 (en) * 2001-05-15 2004-08-17 Nvidia Corporation High-performance heat sink for printed circuit boards
JP2002359346A (ja) 2001-05-30 2002-12-13 Sharp Corp 半導体装置および半導体チップの積層方法
US6881593B2 (en) 2001-05-31 2005-04-19 The Johns Hopkins University Semiconductor die adapter and method of using
US6472741B1 (en) 2001-07-14 2002-10-29 Siliconware Precision Industries Co., Ltd. Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same
JP4790157B2 (ja) 2001-06-07 2011-10-12 ルネサスエレクトロニクス株式会社 半導体装置
JP2002373969A (ja) 2001-06-15 2002-12-26 Oki Electric Ind Co Ltd 半導体装置及び半導体装置の製造方法
US6900528B2 (en) * 2001-06-21 2005-05-31 Micron Technology, Inc. Stacked mass storage flash memory package
JP3925615B2 (ja) 2001-07-04 2007-06-06 ソニー株式会社 半導体モジュール
US6734552B2 (en) 2001-07-11 2004-05-11 Asat Limited Enhanced thermal dissipation integrated circuit package
JP4126891B2 (ja) 2001-08-03 2008-07-30 セイコーエプソン株式会社 半導体装置の製造方法
JP3649169B2 (ja) 2001-08-08 2005-05-18 松下電器産業株式会社 半導体装置
KR100445073B1 (ko) 2001-08-21 2004-08-21 삼성전자주식회사 듀얼 다이 패키지
US20030048624A1 (en) 2001-08-22 2003-03-13 Tessera, Inc. Low-height multi-component assemblies
DE10142120A1 (de) 2001-08-30 2003-03-27 Infineon Technologies Ag Elektronisches Bauteil mit wenigstens zwei gestapelten Halbleiterchips sowie Verfahren zu seiner Herstellung
US6548376B2 (en) 2001-08-30 2003-04-15 Micron Technology, Inc. Methods of thinning microelectronic workpieces
US6787916B2 (en) 2001-09-13 2004-09-07 Tru-Si Technologies, Inc. Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity
US6495912B1 (en) * 2001-09-17 2002-12-17 Megic Corporation Structure of ceramic package with integrated passive devices
US6847105B2 (en) 2001-09-21 2005-01-25 Micron Technology, Inc. Bumping technology in stacked die configurations
US6599779B2 (en) 2001-09-24 2003-07-29 St Assembly Test Service Ltd. PBGA substrate for anchoring heat sink
US6555917B1 (en) 2001-10-09 2003-04-29 Amkor Technology, Inc. Semiconductor package having stacked semiconductor chips and method of making the same
US6569709B2 (en) 2001-10-15 2003-05-27 Micron Technology, Inc. Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
TW523887B (en) 2001-11-15 2003-03-11 Siliconware Precision Industries Co Ltd Semiconductor packaged device and its manufacturing method
US6737750B1 (en) 2001-12-07 2004-05-18 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages
US7332819B2 (en) 2002-01-09 2008-02-19 Micron Technology, Inc. Stacked die in die BGA package
US20030111716A1 (en) 2001-12-14 2003-06-19 Kazuaki Ano Wirebonded multichip module
US20030111720A1 (en) 2001-12-18 2003-06-19 Tan Lan Chu Stacked die semiconductor device
US20030113952A1 (en) 2001-12-19 2003-06-19 Mahesh Sambasivam Underfill materials dispensed in a flip chip package by way of a through hole
TW523894B (en) 2001-12-24 2003-03-11 Siliconware Precision Industries Co Ltd Semiconductor device and its manufacturing method
JP2003197856A (ja) 2001-12-28 2003-07-11 Oki Electric Ind Co Ltd 半導体装置
US20030134451A1 (en) 2002-01-14 2003-07-17 Picta Technology, Inc. Structure and process for packaging back-to-back chips
TWI268581B (en) 2002-01-25 2006-12-11 Advanced Semiconductor Eng Stack type flip-chip package including a substrate board, a first chip, a second chip, multiple conductive wire, an underfill, and a packaging material
US7034388B2 (en) 2002-01-25 2006-04-25 Advanced Semiconductor Engineering, Inc. Stack type flip-chip package
TWI255532B (en) 2002-02-05 2006-05-21 Siliconware Precision Industries Co Ltd Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same
US6635970B2 (en) 2002-02-06 2003-10-21 International Business Machines Corporation Power distribution design method for stacked flip-chip packages
US7329895B2 (en) 2002-02-22 2008-02-12 Honeywell International Inc. Dual wavelength detector
US20030160311A1 (en) 2002-02-28 2003-08-28 Aminuddin Ismail Stacked die semiconductor device
US6885093B2 (en) 2002-02-28 2005-04-26 Freescale Semiconductor, Inc. Stacked die semiconductor device
SG111935A1 (en) 2002-03-04 2005-06-29 Micron Technology Inc Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
US6753613B2 (en) 2002-03-13 2004-06-22 Intel Corporation Stacked dice standoffs
JP2003273317A (ja) 2002-03-19 2003-09-26 Nec Electronics Corp 半導体装置及びその製造方法
JP2003298002A (ja) * 2002-04-02 2003-10-17 Mitsubishi Electric Corp 半導体モジュール
JP3688249B2 (ja) 2002-04-05 2005-08-24 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
US6867500B2 (en) 2002-04-08 2005-03-15 Micron Technology, Inc. Multi-chip module and methods
US6979904B2 (en) 2002-04-19 2005-12-27 Micron Technology, Inc. Integrated circuit package having reduced interconnects
US6774471B2 (en) 2002-04-30 2004-08-10 Intel Corporation Protected bond fingers
JP3550391B2 (ja) 2002-05-15 2004-08-04 沖電気工業株式会社 半導体装置及びその製造方法
US6906415B2 (en) 2002-06-27 2005-06-14 Micron Technology, Inc. Semiconductor device assemblies and packages including multiple semiconductor devices and methods
US6737738B2 (en) 2002-07-16 2004-05-18 Kingston Technology Corporation Multi-level package for a memory module
KR100442880B1 (ko) 2002-07-24 2004-08-02 삼성전자주식회사 적층형 반도체 모듈 및 그 제조방법
US7132311B2 (en) 2002-07-26 2006-11-07 Intel Corporation Encapsulation of a stack of semiconductor dice
US6762472B2 (en) 2002-08-30 2004-07-13 Agilent Technologies, Inc. Signal communication structures
US7053476B2 (en) 2002-09-17 2006-05-30 Chippac, Inc. Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
US6838761B2 (en) 2002-09-17 2005-01-04 Chippac, Inc. Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield
US6972481B2 (en) 2002-09-17 2005-12-06 Chippac, Inc. Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages
US7064426B2 (en) 2002-09-17 2006-06-20 Chippac, Inc. Semiconductor multi-package module having wire bond interconnect between stacked packages
US20040061213A1 (en) 2002-09-17 2004-04-01 Chippac, Inc. Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
US7034387B2 (en) * 2003-04-04 2006-04-25 Chippac, Inc. Semiconductor multipackage module including processor and memory package assemblies
US7057269B2 (en) 2002-10-08 2006-06-06 Chippac, Inc. Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
TW567601B (en) 2002-10-18 2003-12-21 Siliconware Precision Industries Co Ltd Module device of stacked semiconductor package and method for fabricating the same
SG114585A1 (en) 2002-11-22 2005-09-28 Micron Technology Inc Packaged microelectronic component assemblies
TW576549U (en) 2003-04-04 2004-02-11 Advanced Semiconductor Eng Multi-chip package combining wire-bonding and flip-chip configuration
TWI225292B (en) 2003-04-23 2004-12-11 Advanced Semiconductor Eng Multi-chips stacked package
US6818980B1 (en) 2003-05-07 2004-11-16 Asat Ltd. Stacked semiconductor package and method of manufacturing the same
TWI299551B (en) 2003-06-25 2008-08-01 Via Tech Inc Quad flat no-lead type chip carrier
KR100574947B1 (ko) 2003-08-20 2006-05-02 삼성전자주식회사 Ｂｇａ 패키지, 그 제조방법 및 ｂｇａ 패키지 적층 구조
US6930378B1 (en) 2003-11-10 2005-08-16 Amkor Technology, Inc. Stacked semiconductor die assembly having at least one support
US20060138631A1 (en) 2003-12-31 2006-06-29 Advanced Semiconductor Engineering, Inc. Multi-chip package structure
US20060043556A1 (en) 2004-08-25 2006-03-02 Chao-Yuan Su Stacked packaging methods and structures

Also Published As

Publication number Publication date
US7749807B2 (en) 2010-07-06
WO2004095537A3 (en) 2005-05-19
EP1616350A2 (en) 2006-01-18
JP2006522478A (ja) 2006-09-28
US20090027863A1 (en) 2009-01-29
US7034387B2 (en) 2006-04-25
KR20060002930A (ko) 2006-01-09
US7306973B2 (en) 2007-12-11
US20060151867A1 (en) 2006-07-13
WO2004095537A2 (en) 2004-11-04
KR101050402B1 (ko) 2011-07-19
US20040195667A1 (en) 2004-10-07
EP1616350A4 (en) 2009-12-30

Similar Documents

Publication Publication Date Title
TW200507250A (en) Semiconductor multipackage module including processor and memory package assemblies
AU2003298595A8 (en) Semiconductor stacked multi-package module having inverted second package
SG148851A1 (en) Stacked semiconductor packages
TW200620607A (en) Flip chip and wire bond semiconductor package
TW200419763A (en) Multi-chips stacked package
TW200703600A (en) Stacked semiconductor package assembly having hollowed substrate
WO2003075348A3 (en) Stacked die semiconductor device
TW200802789A (en) Stackable molded packages and methods of making the same
TW200743189A (en) Multiple chip package and method for fabricating the same
SG114665A1 (en) Fan out type wafer level package structure and method of the same
NL1027962A1 (nl) Multi-chipverpakking, halfgeleiderinrichting daarin gebruikt en vervaardigingswijze daarvoor.
TW200715497A (en) Plastic semiconductor package having improved control of dimensions
IL175341A0 (en) Process for packaging components, and packaged components
TW200725859A (en) Structure and method for packaging a chip
TW200707676A (en) Thin IC package for improving heat dissipation from chip backside
TW200719468A (en) Package, package module and manufacturing method of the package
TW200419762A (en) Bumpless chip package
TW200644216A (en) Multipackage module having stacked packages with asymmetrically arranged die and molding
SG106047A1 (en) Near chip size semiconductor package
TW200511531A (en) Package stack module
TW200701412A (en) Package substrate with improved structure for thermal dissipation and electronic device using the same
TW200713555A (en) Package of leadframe with heatsinks
TW200641968A (en) Multi-chip stack structure
TW200514236A (en) Semiconductor device, semiconductor module and method of manufacturing semiconductor device
SG125157A1 (en) Chip-type micro-connector and method of packaging the same