SG158142A1 - A sulfuric acid recycling type cleaning system and a sulfuric acid recycling type persulfuric acid supply apparatus - Google Patents
A sulfuric acid recycling type cleaning system and a sulfuric acid recycling type persulfuric acid supply apparatusInfo
- Publication number
- SG158142A1 SG158142A1 SG200908350-2A SG2009083502A SG158142A1 SG 158142 A1 SG158142 A1 SG 158142A1 SG 2009083502 A SG2009083502 A SG 2009083502A SG 158142 A1 SG158142 A1 SG 158142A1
- Authority
- SG
- Singapore
- Prior art keywords
- cleaning
- persulfuric acid
- sulfuric acid
- recycling type
- cleaning system
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/01—Products
- C25B1/28—Per-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
- C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Electrochemistry (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004271604 | 2004-09-17 | ||
JP2005232825A JP4462146B2 (ja) | 2004-09-17 | 2005-08-11 | 硫酸リサイクル型洗浄システムおよび硫酸リサイクル型過硫酸供給装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG158142A1 true SG158142A1 (en) | 2010-01-29 |
Family
ID=36060067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200908350-2A SG158142A1 (en) | 2004-09-17 | 2005-09-14 | A sulfuric acid recycling type cleaning system and a sulfuric acid recycling type persulfuric acid supply apparatus |
Country Status (9)
Country | Link |
---|---|
US (1) | US9593424B2 (de) |
EP (1) | EP1801265B1 (de) |
JP (1) | JP4462146B2 (de) |
KR (1) | KR101222880B1 (de) |
CN (1) | CN101061261B (de) |
AT (1) | ATE510048T1 (de) |
SG (1) | SG158142A1 (de) |
TW (1) | TWI366611B (de) |
WO (1) | WO2006030816A1 (de) |
Families Citing this family (56)
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US8046867B2 (en) | 2006-02-10 | 2011-11-01 | Tennant Company | Mobile surface cleaner having a sparging device |
JP4605393B2 (ja) * | 2006-03-29 | 2011-01-05 | 栗田工業株式会社 | 電解ガス処理装置および硫酸リサイクル型洗浄システム |
JP4623307B2 (ja) * | 2006-03-29 | 2011-02-02 | 栗田工業株式会社 | 電解セルおよび該電解セルを用いた硫酸リサイクル型洗浄システム |
JP5087325B2 (ja) * | 2006-06-16 | 2012-12-05 | 株式会社東芝 | 洗浄システム及び洗浄方法 |
JP4808551B2 (ja) * | 2006-06-16 | 2011-11-02 | クロリンエンジニアズ株式会社 | 過硫酸の製造方法 |
US8303797B2 (en) * | 2006-06-16 | 2012-11-06 | Kabushiki Kaisha Toshiba | Cleaning system and cleaning method |
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JP4644170B2 (ja) * | 2006-09-06 | 2011-03-02 | 栗田工業株式会社 | 基板処理装置および基板処理方法 |
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JP5105081B2 (ja) * | 2008-04-08 | 2012-12-19 | 栗田工業株式会社 | 機能性溶液供給システムおよび機能性溶液供給方法 |
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JP5358303B2 (ja) * | 2008-06-30 | 2013-12-04 | クロリンエンジニアズ株式会社 | 電解硫酸による洗浄方法及び半導体装置の製造方法 |
US20110247929A1 (en) * | 2008-09-24 | 2011-10-13 | Sumitomo Electric Hardmetal Corp. | Diamond electrode and method for manufacturing diamond electrode |
JP5592611B2 (ja) * | 2009-01-05 | 2014-09-17 | オルガノ株式会社 | 過硫酸製造装置及び過硫酸製造方法 |
JP5660279B2 (ja) * | 2009-03-24 | 2015-01-28 | 栗田工業株式会社 | 機能性溶液供給システムおよび供給方法 |
JP2012146690A (ja) * | 2009-03-31 | 2012-08-02 | Kurita Water Ind Ltd | 電子材料洗浄方法及び電子材料洗浄装置 |
JP5148576B2 (ja) | 2009-09-25 | 2013-02-20 | 株式会社東芝 | 洗浄方法 |
JP5066152B2 (ja) * | 2009-09-25 | 2012-11-07 | 株式会社東芝 | 洗浄システム |
JP5499602B2 (ja) * | 2009-09-30 | 2014-05-21 | 栗田工業株式会社 | 有効酸化性物質の濃度測定方法 |
JP5106523B2 (ja) * | 2009-12-16 | 2012-12-26 | 株式会社東芝 | エッチング処理方法、微細構造体の製造方法、およびエッチング処理装置 |
JP2011192779A (ja) * | 2010-03-15 | 2011-09-29 | Kurita Water Ind Ltd | 電子材料の洗浄方法および洗浄システム |
US20110237484A1 (en) | 2010-03-25 | 2011-09-29 | Basf Se | Electrochemical textile-washing process |
KR101676693B1 (ko) * | 2010-06-07 | 2016-11-16 | 쿠리타 고교 가부시키가이샤 | 세정 시스템 및 세정 방법 |
JP5668914B2 (ja) * | 2010-08-27 | 2015-02-12 | 栗田工業株式会社 | 洗浄方法および洗浄システム |
JP5773132B2 (ja) * | 2011-02-23 | 2015-09-02 | 栗田工業株式会社 | 過硫酸濃度の測定方法、過硫酸濃度測定装置、及び過硫酸供給装置 |
JP2012180538A (ja) * | 2011-02-28 | 2012-09-20 | Kurita Water Ind Ltd | 硫酸電解方法および硫酸電解装置 |
JP5939373B2 (ja) * | 2011-03-24 | 2016-06-22 | 栗田工業株式会社 | 電子材料洗浄方法および洗浄装置 |
US8992691B2 (en) | 2011-04-05 | 2015-03-31 | International Business Machines Corporation | Partial solution replacement in recyclable persulfuric acid cleaning systems |
EP2697730A4 (de) | 2011-04-15 | 2015-04-15 | Advanced Diamond Technologies Inc | Elektrochemisches system und verfahren zur vor-ort-erzeugung von oxidationsmitteln bei hoher stromdichte |
CN102319688A (zh) * | 2011-07-11 | 2012-01-18 | 苏州赤诚洗净科技有限公司 | 硅料清洗装置 |
KR101809927B1 (ko) | 2011-07-11 | 2017-12-18 | 쿠리타 고교 가부시키가이샤 | 메탈 게이트 반도체의 세정 방법 |
DE102011080105A1 (de) * | 2011-07-29 | 2013-01-31 | Wacker Chemie Ag | Verfahren zur Reinigung von polykristallinen Siliciumbruchstücken |
CN104114073A (zh) * | 2012-01-26 | 2014-10-22 | 坦能公司 | 用于产生热提高的处理液体的装置和方法 |
JP2014063920A (ja) * | 2012-09-21 | 2014-04-10 | Kurita Water Ind Ltd | 洗浄方法および洗浄装置 |
JP5854230B2 (ja) * | 2012-12-13 | 2016-02-09 | 栗田工業株式会社 | 基板洗浄液および基板洗浄方法 |
JP6024936B2 (ja) | 2013-07-23 | 2016-11-16 | 栗田工業株式会社 | 全酸化性物質濃度の測定方法、基板洗浄方法および基板洗浄システム |
JP5667674B1 (ja) * | 2013-08-20 | 2015-02-12 | サーモス株式会社 | 金属容器を洗浄する洗浄装置 |
US10239772B2 (en) | 2015-05-28 | 2019-03-26 | Advanced Diamond Technologies, Inc. | Recycling loop method for preparation of high concentration ozone |
US9665000B1 (en) * | 2015-11-16 | 2017-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for EUV mask cleaning with non-thermal solution |
CN105585182A (zh) * | 2016-03-03 | 2016-05-18 | 金晨光 | 一种压舱水处理设备 |
JP6750293B2 (ja) * | 2016-04-28 | 2020-09-02 | 栗田工業株式会社 | プラスチック表面の処理方法 |
US10858744B2 (en) | 2016-10-20 | 2020-12-08 | Advanced Diamond Technologies, Inc. | Ozone generators, methods of making ozone generators, and methods of generating ozone |
JP7146572B2 (ja) | 2018-02-23 | 2022-10-04 | キヤノン株式会社 | 基板の成膜方法、及び液体吐出ヘッドの製造方法 |
CN108550519A (zh) * | 2018-06-08 | 2018-09-18 | 东莞市中图半导体科技有限公司 | 一种半导体晶片的清洗装置 |
JP7072453B2 (ja) * | 2018-06-29 | 2022-05-20 | 東京エレクトロン株式会社 | 基板処理装置、および基板処理方法 |
US11037805B2 (en) * | 2018-11-23 | 2021-06-15 | Nanya Technology Corporation | Wafer cleaning apparatus and method of cleaning wafer |
KR102175129B1 (ko) | 2019-04-26 | 2020-11-05 | 주식회사 성창 | 전자 재료 세정 시스템 |
WO2020217453A1 (ja) * | 2019-04-26 | 2020-10-29 | 神田 智一 | 洗浄液生成装置、洗浄・コーティング液生成装置 |
CN111020643B (zh) * | 2019-12-30 | 2022-02-11 | 中国科学院青海盐湖研究所 | 一种双面光铜箔及其制备方法与装置 |
JP7484407B2 (ja) | 2020-05-18 | 2024-05-16 | 栗田工業株式会社 | 電解硫酸溶液製造システムの立上げ方法 |
US11682567B2 (en) | 2020-06-30 | 2023-06-20 | Applied Materials, Inc. | Cleaning system with in-line SPM processing |
JP6988977B1 (ja) * | 2020-10-07 | 2022-01-05 | 栗田工業株式会社 | 樹脂成形体のエッチング方法及び樹脂成形体のエッチング処理システム |
WO2024155380A1 (en) * | 2023-01-18 | 2024-07-25 | Shyp Bv Pbc | Systems and methods for electrochemical generation of acid and base |
JP7370113B1 (ja) * | 2023-02-28 | 2023-10-27 | ミクロエース株式会社 | 基板処理方法 |
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JP2003271218A (ja) * | 2002-03-15 | 2003-09-26 | Toshiba Corp | 半導体製造装置、半導体製造システム及び基板処理方法 |
DE10219688A1 (de) * | 2002-05-02 | 2003-11-20 | Condias Gmbh | Verfahren und Vorrichtung zur oxidativen Behandlung von Oberflächen |
JP2004174485A (ja) * | 2002-11-14 | 2004-06-24 | Sankyo Seiki Mfg Co Ltd | 超純水洗浄システム |
US20050139487A1 (en) * | 2003-05-02 | 2005-06-30 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Method for the oxidative treatment of components comprised of or containing elementary silicon and/or substantially inorganic silicon compounds |
-
2005
- 2005-08-11 JP JP2005232825A patent/JP4462146B2/ja active Active
- 2005-08-19 TW TW094128350A patent/TWI366611B/zh active
- 2005-09-14 AT AT05783205T patent/ATE510048T1/de not_active IP Right Cessation
- 2005-09-14 EP EP05783205A patent/EP1801265B1/de not_active Not-in-force
- 2005-09-14 SG SG200908350-2A patent/SG158142A1/en unknown
- 2005-09-14 KR KR1020077007934A patent/KR101222880B1/ko active IP Right Grant
- 2005-09-14 WO PCT/JP2005/016916 patent/WO2006030816A1/ja active Application Filing
- 2005-09-14 CN CN2005800393762A patent/CN101061261B/zh active Active
- 2005-09-14 US US11/663,324 patent/US9593424B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101222880B1 (ko) | 2013-01-17 |
TWI366611B (en) | 2012-06-21 |
ATE510048T1 (de) | 2011-06-15 |
TW200610841A (en) | 2006-04-01 |
US9593424B2 (en) | 2017-03-14 |
WO2006030816A1 (ja) | 2006-03-23 |
EP1801265A1 (de) | 2007-06-27 |
CN101061261B (zh) | 2010-09-01 |
JP2006114880A (ja) | 2006-04-27 |
US20080251108A1 (en) | 2008-10-16 |
EP1801265A4 (de) | 2009-06-17 |
EP1801265B1 (de) | 2011-05-18 |
KR20070101219A (ko) | 2007-10-16 |
CN101061261A (zh) | 2007-10-24 |
JP4462146B2 (ja) | 2010-05-12 |
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