SG11201504823YA - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- SG11201504823YA SG11201504823YA SG11201504823YA SG11201504823YA SG11201504823YA SG 11201504823Y A SG11201504823Y A SG 11201504823YA SG 11201504823Y A SG11201504823Y A SG 11201504823YA SG 11201504823Y A SG11201504823Y A SG 11201504823YA SG 11201504823Y A SG11201504823Y A SG 11201504823YA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
- H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
- H01L29/78693—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate the semiconducting oxide being amorphous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thin Film Transistor (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011282509 | 2011-12-23 | ||
PCT/JP2012/083764 WO2013094772A1 (fr) | 2011-12-23 | 2012-12-19 | Dispositif semi-conducteur |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201504823YA true SG11201504823YA (en) | 2015-07-30 |
Family
ID=48653626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201504823YA SG11201504823YA (en) | 2011-12-23 | 2012-12-19 | Semiconductor device |
Country Status (7)
Country | Link |
---|---|
US (3) | US8796683B2 (fr) |
JP (7) | JP2013149965A (fr) |
KR (1) | KR102106030B1 (fr) |
CN (3) | CN103999228B (fr) |
SG (1) | SG11201504823YA (fr) |
TW (2) | TWI580047B (fr) |
WO (1) | WO2013094772A1 (fr) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101968855B1 (ko) | 2009-06-30 | 2019-04-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 제조 방법 |
TWI580047B (zh) | 2011-12-23 | 2017-04-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
TWI605597B (zh) | 2012-01-26 | 2017-11-11 | 半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
TWI604609B (zh) | 2012-02-02 | 2017-11-01 | 半導體能源研究所股份有限公司 | 半導體裝置 |
WO2013154195A1 (fr) | 2012-04-13 | 2013-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif à semi-conducteurs |
DE112013002407B4 (de) | 2012-05-10 | 2024-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
US8901557B2 (en) | 2012-06-15 | 2014-12-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR102113160B1 (ko) | 2012-06-15 | 2020-05-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
US9885108B2 (en) * | 2012-08-07 | 2018-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming sputtering target |
US9018624B2 (en) | 2012-09-13 | 2015-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic appliance |
WO2014061567A1 (fr) | 2012-10-17 | 2014-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Circuit logique programmable |
TWI691084B (zh) | 2012-10-24 | 2020-04-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
JP6300489B2 (ja) | 2012-10-24 | 2018-03-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
WO2014103901A1 (fr) | 2012-12-25 | 2014-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif à semi-conducteur et procédé de fabrication d'un tel dispositif |
TWI621270B (zh) * | 2013-02-07 | 2018-04-11 | 群創光電股份有限公司 | 薄膜電晶體元件與薄膜電晶體顯示裝置 |
US9231111B2 (en) | 2013-02-13 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR102238682B1 (ko) | 2013-02-28 | 2021-04-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치와 그 제작 방법 |
JP6400961B2 (ja) * | 2013-07-12 | 2018-10-03 | 株式会社半導体エネルギー研究所 | 表示装置 |
TWI646690B (zh) | 2013-09-13 | 2019-01-01 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
JP6383616B2 (ja) | 2013-09-25 | 2018-08-29 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2015179247A (ja) | 2013-10-22 | 2015-10-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
US9590111B2 (en) | 2013-11-06 | 2017-03-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
JP6537264B2 (ja) | 2013-12-12 | 2019-07-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI666770B (zh) | 2013-12-19 | 2019-07-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
WO2015097586A1 (fr) * | 2013-12-25 | 2015-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif semi-conducteur |
KR20160102295A (ko) * | 2013-12-26 | 2016-08-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
JP2015188062A (ja) * | 2014-02-07 | 2015-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI663726B (zh) | 2014-05-30 | 2019-06-21 | Semiconductor Energy Laboratory Co., Ltd. | 半導體裝置、模組及電子裝置 |
US10002971B2 (en) * | 2014-07-03 | 2018-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
KR20220069118A (ko) | 2014-07-15 | 2022-05-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치와 그 제작 방법, 및 상기 반도체 장치를 포함하는 표시 장치 |
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CN107004721B (zh) | 2014-12-16 | 2020-10-20 | 乐金显示有限公司 | 薄膜晶体管阵列基板 |
WO2016104253A1 (fr) * | 2014-12-25 | 2016-06-30 | シャープ株式会社 | Dispositif à semi-conducteur |
US9660100B2 (en) * | 2015-02-06 | 2017-05-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US9818880B2 (en) | 2015-02-12 | 2017-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
KR20160114511A (ko) | 2015-03-24 | 2016-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
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US10714633B2 (en) | 2015-12-15 | 2020-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
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CN105932024B (zh) * | 2016-05-05 | 2019-05-24 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法和显示装置 |
KR102330605B1 (ko) * | 2016-06-22 | 2021-11-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
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TW201836020A (zh) * | 2017-02-17 | 2018-10-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
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KR102449467B1 (ko) * | 2017-12-11 | 2022-09-29 | 엘지디스플레이 주식회사 | 박막 트랜지스터, 그의 제조방법, 및 그를 포함한 표시장치 |
TWI667796B (zh) * | 2017-05-31 | 2019-08-01 | 南韓商Lg顯示器股份有限公司 | 薄膜電晶體、包含該薄膜電晶體的閘極驅動器、及包含該閘極驅動器的顯示裝置 |
CN109148592B (zh) | 2017-06-27 | 2022-03-11 | 乐金显示有限公司 | 包括氧化物半导体层的薄膜晶体管,其制造方法和包括其的显示设备 |
CN107689345B (zh) * | 2017-10-09 | 2020-04-28 | 深圳市华星光电半导体显示技术有限公司 | Tft基板及其制作方法与oled面板及其制作方法 |
JP2019091794A (ja) * | 2017-11-14 | 2019-06-13 | シャープ株式会社 | 半導体装置 |
KR102446301B1 (ko) * | 2017-12-11 | 2022-09-23 | 엘지디스플레이 주식회사 | 지지층을 갖는 박막 트랜지스터, 그 제조방법 및 이를 포함하는 표시장치 |
TW202032242A (zh) | 2018-08-03 | 2020-09-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
US11426818B2 (en) | 2018-08-10 | 2022-08-30 | The Research Foundation for the State University | Additive manufacturing processes and additively manufactured products |
CN109712931A (zh) * | 2019-01-03 | 2019-05-03 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制作方法、显示面板 |
CN110190085B (zh) * | 2019-06-05 | 2021-03-23 | 京东方科技集团股份有限公司 | 发光二极管驱动背板及其制备方法、显示装置 |
KR102697041B1 (ko) | 2019-06-10 | 2024-08-20 | 삼성전자주식회사 | 반도체 장치 |
EP3790057A1 (fr) * | 2019-09-06 | 2021-03-10 | SABIC Global Technologies B.V. | Transistor à couche mince à semi-conducteur traité à basse température |
TWI757845B (zh) * | 2020-08-24 | 2022-03-11 | 友達光電股份有限公司 | 超音波換能元件及其製造方法 |
TWI813217B (zh) * | 2021-12-09 | 2023-08-21 | 友達光電股份有限公司 | 半導體裝置及其製造方法 |
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CN102130009B (zh) | 2010-12-01 | 2012-12-05 | 北京大学深圳研究生院 | 一种晶体管的制造方法 |
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TWI580047B (zh) | 2011-12-23 | 2017-04-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
-
2012
- 2012-12-17 TW TW101147851A patent/TWI580047B/zh not_active IP Right Cessation
- 2012-12-17 TW TW106100181A patent/TWI613824B/zh active
- 2012-12-17 US US13/716,939 patent/US8796683B2/en not_active Expired - Fee Related
- 2012-12-19 CN CN201280063818.7A patent/CN103999228B/zh not_active Expired - Fee Related
- 2012-12-19 KR KR1020147019553A patent/KR102106030B1/ko active IP Right Grant
- 2012-12-19 SG SG11201504823YA patent/SG11201504823YA/en unknown
- 2012-12-19 WO PCT/JP2012/083764 patent/WO2013094772A1/fr active Application Filing
- 2012-12-19 CN CN202110664358.4A patent/CN113421928A/zh active Pending
- 2012-12-19 CN CN201810569628.1A patent/CN109065630B/zh active Active
- 2012-12-19 JP JP2012276700A patent/JP2013149965A/ja not_active Withdrawn
-
2014
- 2014-08-04 US US14/450,997 patent/US9166061B2/en active Active
-
2015
- 2015-09-15 US US14/854,566 patent/US9559213B2/en active Active
-
2016
- 2016-10-06 JP JP2016197831A patent/JP2017017345A/ja not_active Withdrawn
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2018
- 2018-04-10 JP JP2018075205A patent/JP2018137468A/ja not_active Withdrawn
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2019
- 2019-06-24 JP JP2019116325A patent/JP6714130B2/ja active Active
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2020
- 2020-06-04 JP JP2020097458A patent/JP2020145478A/ja not_active Withdrawn
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2022
- 2022-09-21 JP JP2022149824A patent/JP7392068B2/ja active Active
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2023
- 2023-11-22 JP JP2023197829A patent/JP2024015008A/ja active Pending
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Publication number | Publication date |
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US20130161608A1 (en) | 2013-06-27 |
KR102106030B1 (ko) | 2020-04-29 |
JP2022171915A (ja) | 2022-11-11 |
JP2017017345A (ja) | 2017-01-19 |
JP2013149965A (ja) | 2013-08-01 |
US20140339555A1 (en) | 2014-11-20 |
TWI580047B (zh) | 2017-04-21 |
CN103999228A (zh) | 2014-08-20 |
JP2020145478A (ja) | 2020-09-10 |
TW201336077A (zh) | 2013-09-01 |
US9166061B2 (en) | 2015-10-20 |
US20160005878A1 (en) | 2016-01-07 |
CN109065630B (zh) | 2021-07-06 |
JP2018137468A (ja) | 2018-08-30 |
CN109065630A (zh) | 2018-12-21 |
US9559213B2 (en) | 2017-01-31 |
JP7392068B2 (ja) | 2023-12-05 |
JP6714130B2 (ja) | 2020-06-24 |
CN113421928A (zh) | 2021-09-21 |
TW201727912A (zh) | 2017-08-01 |
US8796683B2 (en) | 2014-08-05 |
KR20140107451A (ko) | 2014-09-04 |
CN103999228B (zh) | 2018-07-03 |
WO2013094772A1 (fr) | 2013-06-27 |
JP2019192930A (ja) | 2019-10-31 |
TWI613824B (zh) | 2018-02-01 |
JP2024015008A (ja) | 2024-02-01 |
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