SE0004565L - Ljuskänslig hartskomposition - Google Patents
Ljuskänslig hartskompositionInfo
- Publication number
- SE0004565L SE0004565L SE0004565A SE0004565A SE0004565L SE 0004565 L SE0004565 L SE 0004565L SE 0004565 A SE0004565 A SE 0004565A SE 0004565 A SE0004565 A SE 0004565A SE 0004565 L SE0004565 L SE 0004565L
- Authority
- SE
- Sweden
- Prior art keywords
- substituted
- mdash
- unsubstituted
- c12alkyl
- phenyl
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 3
- 229910052739 hydrogen Inorganic materials 0.000 abstract 3
- 239000001257 hydrogen Substances 0.000 abstract 3
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 abstract 2
- 150000002431 hydrogen Chemical class 0.000 abstract 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 2
- -1 phenyl-C1-C3alkyl Chemical group 0.000 abstract 2
- 125000002861 (C1-C4) alkanoyl group Chemical group 0.000 abstract 1
- 125000006552 (C3-C8) cycloalkyl group Chemical group 0.000 abstract 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 125000004957 naphthylene group Chemical group 0.000 abstract 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C251/00—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton
- C07C251/32—Oximes
- C07C251/62—Oximes having oxygen atoms of oxyimino groups esterified
- C07C251/64—Oximes having oxygen atoms of oxyimino groups esterified by carboxylic acids
- C07C251/66—Oximes having oxygen atoms of oxyimino groups esterified by carboxylic acids with the esterifying carboxyl groups bound to hydrogen atoms, to acyclic carbon atoms or to carbon atoms of rings other than six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
- C07D209/02—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom condensed with one carbocyclic ring
- C07D209/04—Indoles; Hydrogenated indoles
- C07D209/10—Indoles; Hydrogenated indoles with substituted hydrocarbon radicals attached to carbon atoms of the hetero ring
- C07D209/14—Radicals substituted by nitrogen atoms, not forming part of a nitro radical
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D307/00—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
- C07D307/02—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings
- C07D307/34—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
- C07D307/38—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with substituted hydrocarbon radicals attached to ring carbon atoms
- C07D307/52—Radicals substituted by nitrogen atoms not forming part of a nitro radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/32—Compounds containing nitrogen bound to oxygen
- C08K5/33—Oximes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Polymerisation Methods In General (AREA)
- Materials For Photolithography (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Optical Filters (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Indole Compounds (AREA)
- Heterocyclic Compounds That Contain Two Or More Ring Oxygen Atoms (AREA)
- Furan Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polyamides (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99811161 | 1999-12-15 | ||
EP00810630 | 2000-07-17 |
Publications (3)
Publication Number | Publication Date |
---|---|
SE0004565D0 SE0004565D0 (sv) | 2000-12-11 |
SE0004565L true SE0004565L (sv) | 2001-07-25 |
SE522645C2 SE522645C2 (sv) | 2004-02-24 |
Family
ID=26073958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0004565A SE522645C2 (sv) | 1999-12-15 | 2000-12-11 | Ljuskänslig hartskomposition, lödresist, färgfilterresist, belagt underlag och färgfilter innefattande kompositionen samt förfarande för fotopolymerisation, framställning av reliefbilder och framställning av bilder |
Country Status (22)
Country | Link |
---|---|
US (1) | US7829257B2 (sv) |
JP (1) | JP4532726B2 (sv) |
KR (1) | KR20010082582A (sv) |
CN (1) | CN1302339C (sv) |
AT (1) | AT410146B (sv) |
AU (1) | AU773749B2 (sv) |
BE (1) | BE1013705A3 (sv) |
BR (1) | BR0005866A (sv) |
CA (1) | CA2328342A1 (sv) |
CH (1) | CH694673A5 (sv) |
CZ (1) | CZ20004639A3 (sv) |
DE (1) | DE10061948A1 (sv) |
DK (1) | DK200001877A (sv) |
ES (1) | ES2189609B1 (sv) |
FI (1) | FI20002731A (sv) |
FR (1) | FR2802655B1 (sv) |
GB (1) | GB2357293B (sv) |
IT (1) | IT1319687B1 (sv) |
MY (1) | MY123712A (sv) |
NL (1) | NL1016814C2 (sv) |
SE (1) | SE522645C2 (sv) |
SG (1) | SG97168A1 (sv) |
Families Citing this family (82)
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TW575792B (en) * | 1998-08-19 | 2004-02-11 | Ciba Sc Holding Ag | New unsaturated oxime derivatives and the use thereof as latent acids |
NL1016815C2 (nl) * | 1999-12-15 | 2002-05-14 | Ciba Sc Holding Ag | Oximester-fotoinitiatoren. |
TWI272451B (en) * | 2000-09-25 | 2007-02-01 | Ciba Sc Holding Ag | Chemically amplified photoresist composition, process for preparation of a photoresist, and use of said chemically amplified photoresist composition |
WO2002100903A1 (en) * | 2001-06-11 | 2002-12-19 | Ciba Specialty Chemicals Holding Inc. | Oxime ester photoinitiators having a combined structure |
US6702437B2 (en) * | 2001-08-23 | 2004-03-09 | Fuji Photo Film Co., Ltd. | Image recording material |
US6905243B2 (en) * | 2001-11-17 | 2005-06-14 | Dr. Friedrichs Gruppe Gmbh | Buoyancy liquid for galilean thermometer |
CA2470547C (en) | 2001-12-24 | 2008-05-20 | Digimarc Id Systems, Llc | Laser etched security features for identification documents and methods of making same |
US7694887B2 (en) | 2001-12-24 | 2010-04-13 | L-1 Secure Credentialing, Inc. | Optically variable personalized indicia for identification documents |
WO2003056500A1 (en) | 2001-12-24 | 2003-07-10 | Digimarc Id Systems, Llc | Covert variable information on id documents and methods of making same |
WO2003088144A2 (en) * | 2002-04-09 | 2003-10-23 | Digimarc Id Systems, Llc | Image processing techniques for printing identification cards and documents |
DE60233826D1 (de) * | 2002-05-10 | 2009-11-05 | Kao Corp | Form zur herstellung von fasergussformteilen |
US7824029B2 (en) | 2002-05-10 | 2010-11-02 | L-1 Secure Credentialing, Inc. | Identification card printer-assembler for over the counter card issuing |
WO2004049242A2 (en) | 2002-11-26 | 2004-06-10 | Digimarc Id Systems | Systems and methods for managing and detecting fraud in image databases used with identification documents |
US20050215656A1 (en) | 2002-11-28 | 2005-09-29 | Taiyo Ink Manufacturing Co., Ltd. | Photocurable and thermosetting resin composition and printed circuit boards made by using the same |
TW200417294A (en) * | 2002-11-28 | 2004-09-01 | Taiyo Ink Mfg Co Ltd | Photo- and thermo-setting resin composition and printed wiring boards made by using the same |
US20040222080A1 (en) * | 2002-12-17 | 2004-11-11 | William Marsh Rice University | Use of microwaves to crosslink carbon nanotubes to facilitate modification |
JP4911975B2 (ja) * | 2003-02-17 | 2012-04-04 | ジャパンコンポジット株式会社 | 導電性樹脂組成物及び燃料電池用セパレーター |
JP3797348B2 (ja) * | 2003-02-24 | 2006-07-19 | コニカミノルタホールディングス株式会社 | 活性エネルギー線硬化組成物 |
DE602004030434D1 (de) | 2003-04-16 | 2011-01-20 | L 1 Secure Credentialing Inc | Dreidimensionale datenspeicherung |
TW200519535A (en) * | 2003-11-27 | 2005-06-16 | Taiyo Ink Mfg Co Ltd | Hardenable resin composition, hardened body thereof, and printed circuit board |
JP4292985B2 (ja) * | 2003-12-25 | 2009-07-08 | Jsr株式会社 | 感放射線性組成物、マイクロレンズとその形成方法および液晶表示素子 |
DE102004003143A1 (de) * | 2004-01-21 | 2005-08-18 | Kodak Polychrome Graphics Gmbh | Strahlungsempfindliche Zusammensetzungen mit mercapto-funktionalisierten, radikalisch polymerisierbaren Monomeren |
JP2005215147A (ja) * | 2004-01-28 | 2005-08-11 | Fuji Photo Film Co Ltd | 重合性組成物 |
TWI285297B (en) * | 2004-02-09 | 2007-08-11 | Chi Mei Corp | Light-sensitive resin composition for black matrix |
JP2005300994A (ja) * | 2004-04-13 | 2005-10-27 | Jsr Corp | 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル |
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JP2006284976A (ja) * | 2005-04-01 | 2006-10-19 | Jsr Corp | 感放射線性樹脂組成物、それから形成された突起およびスペーサー、ならびにそれらを具備する液晶表示素子 |
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US8828651B2 (en) * | 2005-07-25 | 2014-09-09 | Nissan Chemical Industries, Ltd. | Positive-type photosensitive resin composition and cured film manufactured therefrom |
JP5270814B2 (ja) * | 2005-08-11 | 2013-08-21 | 東京応化工業株式会社 | 感光性組成物用着色剤分散液 |
ES2333442T3 (es) * | 2005-08-26 | 2010-02-22 | Agfa Graphics N.V. | Precursor de placa de impresion fotopolimerico. |
KR100791817B1 (ko) * | 2005-09-30 | 2008-01-04 | 주식회사 동진쎄미켐 | 감광성 수지 조성물 |
JP5117397B2 (ja) * | 2005-12-20 | 2013-01-16 | チバ ホールディング インコーポレーテッド | オキシムエステル光開始剤 |
CN1991582B (zh) * | 2005-12-31 | 2010-04-21 | 财团法人工业技术研究院 | 负型感光间隙控制材料的组成及其形成方法 |
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KR101320894B1 (ko) * | 2006-07-05 | 2013-10-24 | 삼성디스플레이 주식회사 | 포토레지스트 조성물 및 이를 이용한 컬러 필터 기판의제조방법 |
KR100787853B1 (ko) * | 2006-08-16 | 2007-12-27 | 주식회사 동진쎄미켐 | 아크릴계 포토레지스트 모노머, 폴리머 및 이를 포함하는포토레지스트 조성물 |
JP2008064890A (ja) * | 2006-09-05 | 2008-03-21 | Fujifilm Corp | 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板 |
WO2008059670A1 (fr) | 2006-11-15 | 2008-05-22 | Taiyo Ink Mfg. Co., Ltd. | Composition de résine photodurcissable/thermodurcissable, object durci et plaque de câblage imprimée |
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WO2008059935A1 (fr) | 2006-11-15 | 2008-05-22 | Taiyo Ink Mfg. Co., Ltd. | Composition de résine photodurcissable/thermodurcissable, produit durci et planche de câblage imprimé |
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US9441066B2 (en) * | 2009-12-02 | 2016-09-13 | Basf Se | Use of photosensitive molecules and metal complexes as oxygen scavenger elements |
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EP3127898B1 (en) * | 2014-04-04 | 2021-08-25 | Adeka Corporation | Oxime ester compound and photopolymerization initiator containing said compound |
JPWO2016013587A1 (ja) * | 2014-07-24 | 2017-05-25 | 日立化成株式会社 | 感光性樹脂組成物、感光性フィルム、パターン基板、感光性導電フィルム及び導電パターン基板 |
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CN111221215A (zh) * | 2018-11-23 | 2020-06-02 | 常州强力先端电子材料有限公司 | 感光性树脂组合物及应用 |
CN110551098B (zh) * | 2019-06-17 | 2021-03-12 | 湖北固润科技股份有限公司 | 包含五元芳杂环结构的肟酯类光引发剂及其制备和用途 |
CN111028987B (zh) * | 2019-12-23 | 2021-12-28 | 合肥微晶材料科技有限公司 | 一种纳米银线导电膜及其作为触控传感器电极层的制作方法 |
KR102586093B1 (ko) * | 2020-04-16 | 2023-10-05 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 컬러필터 |
CN114163364A (zh) * | 2021-12-06 | 2022-03-11 | 河北科技大学 | 2-甲氧基烯丙基磺酸酯及其合成方法 |
CN116836388B (zh) * | 2023-08-30 | 2023-12-15 | 明士(北京)新材料开发有限公司 | 一种正性光敏性树脂、树脂组合物及它们的制备方法与应用 |
CN118092072A (zh) * | 2024-04-26 | 2024-05-28 | 湖南初源新材料股份有限公司 | 酸显影型感光树脂组合物及其制备方法与感光干膜 |
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FR2393345A1 (fr) | 1977-06-01 | 1978-12-29 | Agfa Gevaert Nv | Fabrication d'elements modifies sous forme d'images |
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JPS62184056A (ja) * | 1986-02-10 | 1987-08-12 | Asahi Chem Ind Co Ltd | 感光性組成物 |
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WO1996008525A1 (fr) * | 1994-09-14 | 1996-03-21 | Nippon Shokubai Co., Ltd. | Procede de production de resine photosensible et composition liquide de resine photosensible |
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JPH08339081A (ja) | 1995-06-09 | 1996-12-24 | Tokyo Ohka Kogyo Co Ltd | 感光性樹脂組成物及びその製造方法 |
TW436491B (en) * | 1997-08-22 | 2001-05-28 | Ciba Sc Holding Ag | Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions |
SG77689A1 (en) * | 1998-06-26 | 2001-01-16 | Ciba Sc Holding Ag | New o-acyloxime photoinitiators |
MY121423A (en) * | 1998-06-26 | 2006-01-28 | Ciba Sc Holding Ag | Photopolymerizable thermosetting resin compositions |
EP1635220A2 (en) * | 1999-03-03 | 2006-03-15 | Ciba Specialty Chemicals Holding Inc. | Oxime derivatives and the use thereof as photoinitiators |
SG78412A1 (en) * | 1999-03-31 | 2001-02-20 | Ciba Sc Holding Ag | Oxime derivatives and the use thereof as latent acids |
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2000
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- 2000-12-06 NL NL1016814A patent/NL1016814C2/nl not_active IP Right Cessation
- 2000-12-07 MY MYPI20005760A patent/MY123712A/en unknown
- 2000-12-07 GB GB0029801A patent/GB2357293B/en not_active Expired - Fee Related
- 2000-12-11 JP JP2000376036A patent/JP4532726B2/ja not_active Expired - Fee Related
- 2000-12-11 CH CH02411/00A patent/CH694673A5/de not_active IP Right Cessation
- 2000-12-11 SE SE0004565A patent/SE522645C2/sv not_active IP Right Cessation
- 2000-12-12 IT IT2000MI002675A patent/IT1319687B1/it active
- 2000-12-12 CZ CZ20004639A patent/CZ20004639A3/cs unknown
- 2000-12-12 US US09/734,635 patent/US7829257B2/en not_active Expired - Fee Related
- 2000-12-13 FI FI20002731A patent/FI20002731A/sv not_active IP Right Cessation
- 2000-12-13 CA CA002328342A patent/CA2328342A1/en not_active Abandoned
- 2000-12-13 DE DE10061948A patent/DE10061948A1/de not_active Ceased
- 2000-12-13 BR BR0005866-1A patent/BR0005866A/pt not_active IP Right Cessation
- 2000-12-14 AT AT0208000A patent/AT410146B/de not_active IP Right Cessation
- 2000-12-14 FR FR0016309A patent/FR2802655B1/fr not_active Expired - Fee Related
- 2000-12-14 ES ES200002990A patent/ES2189609B1/es not_active Expired - Fee Related
- 2000-12-14 AU AU72268/00A patent/AU773749B2/en not_active Ceased
- 2000-12-14 BE BE2000/0786A patent/BE1013705A3/fr not_active IP Right Cessation
- 2000-12-14 CN CNB001350633A patent/CN1302339C/zh not_active Expired - Fee Related
- 2000-12-14 DK DK200001877A patent/DK200001877A/da not_active Application Discontinuation
- 2000-12-15 KR KR1020000077181A patent/KR20010082582A/ko not_active Application Discontinuation
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