NO20022132D0 - Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelse - Google Patents

Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelse

Info

Publication number
NO20022132D0
NO20022132D0 NO20022132A NO20022132A NO20022132D0 NO 20022132 D0 NO20022132 D0 NO 20022132D0 NO 20022132 A NO20022132 A NO 20022132A NO 20022132 A NO20022132 A NO 20022132A NO 20022132 D0 NO20022132 D0 NO 20022132D0
Authority
NO
Norway
Prior art keywords
component
solder material
providing
soldered connection
cooled
Prior art date
Application number
NO20022132A
Other languages
English (en)
Other versions
NO20022132L (no
NO323074B1 (no
Inventor
Stefan Weber
Alfred Kemper
Original Assignee
Ping Gmbh Vakuumtechnik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ping Gmbh Vakuumtechnik filed Critical Ping Gmbh Vakuumtechnik
Publication of NO20022132L publication Critical patent/NO20022132L/no
Publication of NO20022132D0 publication Critical patent/NO20022132D0/no
Publication of NO323074B1 publication Critical patent/NO323074B1/no

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Coating With Molten Metal (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Tunnel Furnaces (AREA)
  • Heat Treatment Of Articles (AREA)
NO20022132A 1999-11-08 2002-05-03 Fremgangsmate og anordning for a tilveiebringe en loddet forbindelse NO323074B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19953654A DE19953654A1 (de) 1999-11-08 1999-11-08 Verfahren und Vorrichtung zur Herstellung einer Lotverbindung
PCT/DE2000/003848 WO2001034334A1 (de) 1999-11-08 2000-11-02 Verfahren und vorrichtung zur herstellung einer lotverbindung

Publications (3)

Publication Number Publication Date
NO20022132L NO20022132L (no) 2002-05-03
NO20022132D0 true NO20022132D0 (no) 2002-05-03
NO323074B1 NO323074B1 (no) 2006-12-27

Family

ID=7928273

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20022132A NO323074B1 (no) 1999-11-08 2002-05-03 Fremgangsmate og anordning for a tilveiebringe en loddet forbindelse

Country Status (19)

Country Link
US (1) US6796483B1 (no)
EP (1) EP1233841B1 (no)
JP (1) JP4727110B2 (no)
KR (1) KR100645984B1 (no)
CN (1) CN1275730C (no)
AT (1) ATE297829T1 (no)
AU (1) AU779191B2 (no)
CA (1) CA2390498C (no)
CZ (1) CZ302495B6 (no)
DE (2) DE19953654A1 (no)
DK (1) DK1233841T3 (no)
ES (1) ES2243338T3 (no)
HU (1) HU225907B1 (no)
IL (2) IL149489A0 (no)
MX (1) MXPA02004579A (no)
NO (1) NO323074B1 (no)
PL (1) PL194904B1 (no)
PT (1) PT1233841E (no)
WO (1) WO2001034334A1 (no)

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JP5488974B2 (ja) 2006-05-29 2014-05-14 キルステン，ソルダリング エージー はんだ付けモジュールと、可動性であり、はんだ付けモジュール内に交換可能に挿入できる、少なくとも１つのはんだ付けステーションを備えるはんだ付け装置、および、はんだ付けステーションを収容する待機ステーション
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DE102014106631B4 (de) 2013-05-10 2021-12-02 Seho Systemtechnik Gmbh Vorrichtung und Verfahren zum Herstellen von Lötverbindungen
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HUE041408T2 (hu) * 2014-12-09 2019-05-28 Pink Gmbh Thermosysteme Hõátviteli eszköz elektronikai alkatrészek forrasztásos csatlakozással történõ elõállításához
DE102016103213A1 (de) * 2016-02-24 2017-08-24 Semikron Elektronik Gmbh & Co. Kg Vorrichtung, Verfahren und Anlage zur der inhomogenen Abkühlung eines flächigen Gegenstandes
CN107855623B (zh) * 2017-12-29 2023-07-18 山东才聚电子科技有限公司 一种真空焊接炉控制系统及其控制方法
CN109059543A (zh) * 2018-07-16 2018-12-21 苏州洛特兰新材料科技有限公司 一种用于陶瓷材料生产的工业窑炉
DE102019211212A1 (de) 2019-07-29 2021-02-04 Rehm Thermal Systems Gmbh Mechatronischer Vorhang für eine Prozesskammer zur Durchführung thermischer Prozesse in der Fertigung elektronischer Baugruppen
CN113543514B (zh) * 2020-04-15 2022-09-23 昆山达菲乐电子产品有限公司 回焊炉
CN115605310A (zh) * 2020-05-15 2023-01-13 平克塞莫系统有限公司（De） 用于连接电子组件的系统
CN115922172B (zh) * 2023-03-14 2023-06-02 无锡昌鼎电子有限公司 一种在线式真空焊接炉组装设备及其组装方法
CN117139941A (zh) * 2023-10-30 2023-12-01 北京中科同志科技股份有限公司 真空系统及其工作方法

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Also Published As

Publication number Publication date
CZ302495B6 (cs) 2011-06-15
CZ20021603A3 (cs) 2003-05-14
CA2390498C (en) 2009-06-30
CN1275730C (zh) 2006-09-20
DE19953654A1 (de) 2001-05-23
ES2243338T3 (es) 2005-12-01
IL149489A (en) 2006-10-31
ATE297829T1 (de) 2005-07-15
NO20022132L (no) 2002-05-03
PT1233841E (pt) 2005-09-30
CN1387468A (zh) 2002-12-25
DE50010577D1 (de) 2005-07-21
KR100645984B1 (ko) 2006-11-13
AU779191B2 (en) 2005-01-13
JP2003517376A (ja) 2003-05-27
KR20020062935A (ko) 2002-07-31
WO2001034334A1 (de) 2001-05-17
IL149489A0 (en) 2002-11-10
DK1233841T3 (da) 2005-10-10
CA2390498A1 (en) 2001-05-17
EP1233841B1 (de) 2005-06-15
US6796483B1 (en) 2004-09-28
JP4727110B2 (ja) 2011-07-20
HU225907B1 (en) 2007-12-28
MXPA02004579A (es) 2004-09-10
EP1233841A1 (de) 2002-08-28
NO323074B1 (no) 2006-12-27
PL194904B1 (pl) 2007-07-31
HUP0203145A2 (en) 2002-12-28
AU2501001A (en) 2001-06-06
PL355529A1 (en) 2004-05-04

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