MXPA02004579A - Metodo y dispositivo para producir una junta estano soldada. - Google Patents
Metodo y dispositivo para producir una junta estano soldada.Info
- Publication number
- MXPA02004579A MXPA02004579A MXPA02004579A MXPA02004579A MXPA02004579A MX PA02004579 A MXPA02004579 A MX PA02004579A MX PA02004579 A MXPA02004579 A MX PA02004579A MX PA02004579 A MXPA02004579 A MX PA02004579A MX PA02004579 A MXPA02004579 A MX PA02004579A
- Authority
- MX
- Mexico
- Prior art keywords
- component
- producing
- soldered joint
- solder material
- cooled
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Die Bonding (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Tunnel Furnaces (AREA)
- Heat Treatment Of Articles (AREA)
- Coating With Molten Metal (AREA)
Abstract
Un metodo y un dispositivo para el tratamiento termico de piezas de trabajo o componentes, en particular para producir una junta estanosoldada entre un material de suelda y al menos un componente o pieza de trabajo que es utilizado como portador para el material de suelda, fundiendo el material de suelda arreglado sobre el portador del material de suelda, donde la menos un componente es calentado en una camara de fusion (12) en una atmosfera de proceso la cual esta sellada del ambiente, por lo que en un paso posterior el componente es enfriado en una camara de enfriamiento (13) en una atmosfera de proceso la cual esta sellada del ambiente, y por lo que le componente es calentado y enfriado en las camaras de proceso (12, 13), las cuales son independientes entre si.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19953654A DE19953654A1 (de) | 1999-11-08 | 1999-11-08 | Verfahren und Vorrichtung zur Herstellung einer Lotverbindung |
PCT/DE2000/003848 WO2001034334A1 (de) | 1999-11-08 | 2000-11-02 | Verfahren und vorrichtung zur herstellung einer lotverbindung |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA02004579A true MXPA02004579A (es) | 2004-09-10 |
Family
ID=7928273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA02004579A MXPA02004579A (es) | 1999-11-08 | 2000-11-02 | Metodo y dispositivo para producir una junta estano soldada. |
Country Status (19)
Country | Link |
---|---|
US (1) | US6796483B1 (es) |
EP (1) | EP1233841B1 (es) |
JP (1) | JP4727110B2 (es) |
KR (1) | KR100645984B1 (es) |
CN (1) | CN1275730C (es) |
AT (1) | ATE297829T1 (es) |
AU (1) | AU779191B2 (es) |
CA (1) | CA2390498C (es) |
CZ (1) | CZ302495B6 (es) |
DE (2) | DE19953654A1 (es) |
DK (1) | DK1233841T3 (es) |
ES (1) | ES2243338T3 (es) |
HU (1) | HU225907B1 (es) |
IL (2) | IL149489A0 (es) |
MX (1) | MXPA02004579A (es) |
NO (1) | NO323074B1 (es) |
PL (1) | PL194904B1 (es) |
PT (1) | PT1233841E (es) |
WO (1) | WO2001034334A1 (es) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3770238B2 (ja) * | 2002-03-22 | 2006-04-26 | セイコーエプソン株式会社 | 電子デバイス製造装置および電子デバイスの製造方法 |
DE10304774B3 (de) * | 2003-02-05 | 2004-07-15 | Pink Gmbh Vakuumtechnik | Verfahren und Vorrichtung zur Temperaturbeaufschlagung von Werkstücken |
JP4537019B2 (ja) * | 2003-06-04 | 2010-09-01 | 古河スカイ株式会社 | アルミニウム材のろう付け方法 |
DE102004047359B3 (de) * | 2004-09-29 | 2006-01-26 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Verfahren und Vorrichtung zur Regelung und Überwachung eines Lötprozesses |
US7845540B2 (en) * | 2005-08-30 | 2010-12-07 | Micron Technology, Inc. | Systems and methods for depositing conductive material into openings in microfeature workpieces |
DE502007006611D1 (de) | 2006-05-29 | 2011-04-14 | Kirsten Soldering Ag | Lötanlage mit lötmodulen und mindestens einer mobilen und auswechselbar in einem lötmodul einsetzbaren lötstation ; entsprechende stand-by station |
DE102006029593A1 (de) * | 2006-05-29 | 2007-12-13 | Pink Gmbh Vakuumtechnik | Verfahren und Vorrichtung zur Herstellung einer Lotverbindung |
CN101454107B (zh) * | 2006-05-29 | 2013-03-27 | 平克塞莫系统有限公司 | 对工件或元件进行温度处理的方法和装置 |
DE102006034600B4 (de) * | 2006-07-26 | 2010-01-14 | Infineon Technologies Ag | Verfahren zur Herstellung einer Lötverbindung |
US7793819B2 (en) | 2007-03-19 | 2010-09-14 | Infineon Technologies Ag | Apparatus and method for connecting a component with a substrate |
WO2009026765A1 (en) * | 2007-08-29 | 2009-03-05 | Acm Research (Shanghai) Inc. | Method and apparatus for thermal treatment of semiconductor workpieces |
DE102008021240B4 (de) * | 2008-04-28 | 2012-11-22 | Ersa Gmbh | Vorrichtung zur thermischen Behandlung von Werkstücken und Verfahren zur Bestimmung der thermischen Prozessstabilität in einer solchen Vorrichtung |
DE102011081606B4 (de) * | 2011-08-26 | 2022-08-04 | Infineon Technologies Ag | Kühlvorrichtung und Lötanlage |
JP5778731B2 (ja) * | 2012-09-17 | 2015-09-16 | ピーエスケー・インコーポレーテッド | 連続線形熱処理装置の配列 |
CN102896391B (zh) * | 2012-10-15 | 2015-10-07 | 泗阳群鑫电子有限公司 | 一种链式真空炉 |
DE102014106631B4 (de) | 2013-05-10 | 2021-12-02 | Seho Systemtechnik Gmbh | Vorrichtung und Verfahren zum Herstellen von Lötverbindungen |
US9733130B2 (en) * | 2013-05-10 | 2017-08-15 | Illinois Tool Works Inc. | Temperature sensor belt |
JP2015009262A (ja) * | 2013-07-01 | 2015-01-19 | 三菱電機株式会社 | リフロー装置 |
CN107000092B (zh) * | 2014-12-09 | 2019-06-21 | 平克塞莫系统有限公司 | 用于制造电子部件的焊接连接部的传热装置 |
DE102016103213A1 (de) * | 2016-02-24 | 2017-08-24 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung, Verfahren und Anlage zur der inhomogenen Abkühlung eines flächigen Gegenstandes |
CN107855623B (zh) * | 2017-12-29 | 2023-07-18 | 山东才聚电子科技有限公司 | 一种真空焊接炉控制系统及其控制方法 |
CN109059543A (zh) * | 2018-07-16 | 2018-12-21 | 苏州洛特兰新材料科技有限公司 | 一种用于陶瓷材料生产的工业窑炉 |
DE102019211212A1 (de) | 2019-07-29 | 2021-02-04 | Rehm Thermal Systems Gmbh | Mechatronischer Vorhang für eine Prozesskammer zur Durchführung thermischer Prozesse in der Fertigung elektronischer Baugruppen |
CN113543514B (zh) * | 2020-04-15 | 2022-09-23 | 昆山达菲乐电子产品有限公司 | 回焊炉 |
KR102572094B1 (ko) * | 2020-05-15 | 2023-08-30 | 핑크 게엠베하 써모시스테메 | 전자 조립체들을 연결하기 위한 시스템 |
CN115922172B (zh) * | 2023-03-14 | 2023-06-02 | 无锡昌鼎电子有限公司 | 一种在线式真空焊接炉组装设备及其组装方法 |
CN117139941A (zh) * | 2023-10-30 | 2023-12-01 | 北京中科同志科技股份有限公司 | 真空系统及其工作方法 |
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US3882596A (en) * | 1972-11-09 | 1975-05-13 | Vaw Ver Aluminium Werke Ag | Method of flux-free soldering of aluminum-containing workpieces in a controlled atmosphere |
JPS5091031A (es) * | 1973-12-17 | 1975-07-21 | ||
US3926415A (en) * | 1974-01-23 | 1975-12-16 | Park Ohio Industries Inc | Method and apparatus for carbonizing and degassing workpieces |
JPS54118358A (en) * | 1978-03-07 | 1979-09-13 | Toyo Radiator Kk | Production of aluminum heat exchanger |
JPS54125832A (en) * | 1978-03-23 | 1979-09-29 | Tobishima Construct Co Ltd | Yoke for slip form |
CS201367B1 (en) * | 1978-11-17 | 1980-11-28 | Jozef Husar | Method of capillary soldering of hollow steel products particularly the cover knifes in the vacuum or in the protective atmosphere of inert gas |
JPS58217625A (ja) * | 1982-06-09 | 1983-12-17 | Daido Steel Co Ltd | 熱処理装置 |
US4568277A (en) * | 1983-12-20 | 1986-02-04 | International Business Machines Corporation | Apparatus for heating objects to and maintaining them at a desired temperature |
JPS61125618A (ja) | 1984-11-24 | 1986-06-13 | Ohkura Electric Co Ltd | パタ−ン切換式温度制御装置 |
JPS61206667A (ja) * | 1985-03-09 | 1986-09-12 | Matsushita Electric Ind Co Ltd | ドツトプリンタ用印字ヘツド |
US4804128A (en) * | 1986-12-04 | 1989-02-14 | General Motors Corporation | Vacuum brazing of aluminum alloy workpieces |
JPS63177961A (ja) * | 1987-01-19 | 1988-07-22 | Koki:Kk | 予熱ヒ−タ自動制御方法 |
DE3737563A1 (de) * | 1987-11-05 | 1989-05-18 | Ernst Hohnerlein | Loetmaschine |
JPH0714353Y2 (ja) * | 1988-07-08 | 1995-04-05 | 中外炉工業株式会社 | ローラハース型熱処理炉 |
JP2858009B2 (ja) * | 1988-08-02 | 1999-02-17 | 利光 武者 | ゆらぎ照明装置 |
JPH0244694A (ja) * | 1988-08-04 | 1990-02-14 | Matsushita Graphic Commun Syst Inc | 原稿照明装置 |
DE3843191C2 (de) * | 1988-12-22 | 1994-09-15 | Broadcast Television Syst | Vorrichtung zum Löten |
JP2750747B2 (ja) * | 1989-09-20 | 1998-05-13 | 日本真空技術株式会社 | 連続式真空ろう付炉 |
DE3934103A1 (de) * | 1989-10-12 | 1991-04-25 | Ipsen Ind Int Gmbh | Ofen zur partiellen waermebehandlung von werkzeugen |
US5341980A (en) * | 1990-02-19 | 1994-08-30 | Hitachi, Ltd. | Method of fabricating electronic circuit device and apparatus for performing the same method |
JP3066436B2 (ja) * | 1990-09-05 | 2000-07-17 | 東洋ラジエーター株式会社 | 熱交換器の真空ろう付け方法 |
US5128506A (en) * | 1990-10-30 | 1992-07-07 | Westinghouse Electric Corp. | Method and apparatus for selective infrared soldering using shielding fixtures |
CS609090A3 (en) * | 1990-12-07 | 1992-06-17 | Vyzk Ustav Zvaracsky | Process of cladding metallic materials with a solder foil |
US5516031A (en) * | 1991-02-19 | 1996-05-14 | Hitachi, Ltd. | Soldering method and apparatus for use in connecting electronic circuit devices |
US5147083A (en) * | 1991-09-25 | 1992-09-15 | General Motors Corporation | Method and apparatus for convection brazing of aluminum heat exchangers |
JPH05308186A (ja) * | 1991-11-06 | 1993-11-19 | Sanden Corp | ろう付加熱装置 |
JPH05161961A (ja) * | 1991-11-14 | 1993-06-29 | Tamura Seisakusho Co Ltd | リフロー炉 |
NL9202279A (nl) * | 1992-07-29 | 1994-02-16 | Soltec Bv | Reflow-soldeermachine. |
JPH07115169B2 (ja) * | 1992-08-11 | 1995-12-13 | 株式会社サーマル | ろう付け連続装置 |
US5439160A (en) * | 1993-03-31 | 1995-08-08 | Siemens Corporate Research, Inc. | Method and apparatus for obtaining reflow oven settings for soldering a PCB |
US5341978A (en) | 1993-08-16 | 1994-08-30 | General Motors Corporation | Braze furnace with improved inert gas system |
DE4432730A1 (de) | 1994-09-14 | 1996-03-21 | Emitec Emissionstechnologie | Verfahren zur Herstellung einer metallischen Struktur |
JPH08125099A (ja) * | 1994-10-28 | 1996-05-17 | Toshiba Corp | 半導体装置の製造方法 |
DE29505496U1 (de) * | 1995-03-31 | 1995-06-01 | Ipsen Industries International GmbH, 47533 Kleve | Vorrichtung zur Wärmebehandlung metallischer Werkstücke unter Vakuum |
JP2793528B2 (ja) | 1995-09-22 | 1998-09-03 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ハンダ付け方法、ハンダ付け装置 |
JPH10339377A (ja) * | 1997-06-06 | 1998-12-22 | Nec Corp | ゲートバルブ |
US6039236A (en) * | 1997-06-11 | 2000-03-21 | Soltec B.V. | Reflow soldering apparatus with improved cooling |
JPH1177294A (ja) * | 1997-08-28 | 1999-03-23 | Toyota Motor Corp | 減圧ロウ付け方法 |
-
1999
- 1999-11-08 DE DE19953654A patent/DE19953654A1/de not_active Ceased
-
2000
- 2000-11-02 JP JP2001536316A patent/JP4727110B2/ja not_active Expired - Lifetime
- 2000-11-02 IL IL14948900A patent/IL149489A0/xx active IP Right Grant
- 2000-11-02 MX MXPA02004579A patent/MXPA02004579A/es active IP Right Grant
- 2000-11-02 KR KR1020027005763A patent/KR100645984B1/ko active IP Right Grant
- 2000-11-02 EP EP00988556A patent/EP1233841B1/de not_active Expired - Lifetime
- 2000-11-02 ES ES00988556T patent/ES2243338T3/es not_active Expired - Lifetime
- 2000-11-02 DE DE50010577T patent/DE50010577D1/de not_active Expired - Lifetime
- 2000-11-02 PL PL355529A patent/PL194904B1/pl unknown
- 2000-11-02 US US10/129,575 patent/US6796483B1/en not_active Expired - Lifetime
- 2000-11-02 HU HU0203145A patent/HU225907B1/hu unknown
- 2000-11-02 AT AT00988556T patent/ATE297829T1/de active
- 2000-11-02 CA CA002390498A patent/CA2390498C/en not_active Expired - Lifetime
- 2000-11-02 CN CNB008154392A patent/CN1275730C/zh not_active Expired - Lifetime
- 2000-11-02 CZ CZ20021603A patent/CZ302495B6/cs not_active IP Right Cessation
- 2000-11-02 AU AU25010/01A patent/AU779191B2/en not_active Ceased
- 2000-11-02 DK DK00988556T patent/DK1233841T3/da active
- 2000-11-02 WO PCT/DE2000/003848 patent/WO2001034334A1/de active IP Right Grant
- 2000-11-02 PT PT00988556T patent/PT1233841E/pt unknown
-
2002
- 2002-05-03 NO NO20022132A patent/NO323074B1/no not_active IP Right Cessation
- 2002-05-06 IL IL149489A patent/IL149489A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE297829T1 (de) | 2005-07-15 |
DE50010577D1 (de) | 2005-07-21 |
HU225907B1 (en) | 2007-12-28 |
CZ20021603A3 (cs) | 2003-05-14 |
HUP0203145A2 (en) | 2002-12-28 |
WO2001034334A1 (de) | 2001-05-17 |
NO323074B1 (no) | 2006-12-27 |
IL149489A (en) | 2006-10-31 |
PT1233841E (pt) | 2005-09-30 |
EP1233841A1 (de) | 2002-08-28 |
DK1233841T3 (da) | 2005-10-10 |
CA2390498C (en) | 2009-06-30 |
IL149489A0 (en) | 2002-11-10 |
CA2390498A1 (en) | 2001-05-17 |
PL194904B1 (pl) | 2007-07-31 |
CN1275730C (zh) | 2006-09-20 |
NO20022132D0 (no) | 2002-05-03 |
PL355529A1 (en) | 2004-05-04 |
NO20022132L (no) | 2002-05-03 |
US6796483B1 (en) | 2004-09-28 |
JP4727110B2 (ja) | 2011-07-20 |
CN1387468A (zh) | 2002-12-25 |
DE19953654A1 (de) | 2001-05-23 |
KR20020062935A (ko) | 2002-07-31 |
AU779191B2 (en) | 2005-01-13 |
EP1233841B1 (de) | 2005-06-15 |
CZ302495B6 (cs) | 2011-06-15 |
AU2501001A (en) | 2001-06-06 |
ES2243338T3 (es) | 2005-12-01 |
KR100645984B1 (ko) | 2006-11-13 |
JP2003517376A (ja) | 2003-05-27 |
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Legal Events
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FG | Grant or registration | ||
GB | Transfer or rights |