KR940022816A - X형 지지부재를 가지는 반도체 장치와 그 제조방법 - Google Patents

X형 지지부재를 가지는 반도체 장치와 그 제조방법 Download PDF

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KR940022816A
KR940022816A KR1019940005590A KR19940005590A KR940022816A KR 940022816 A KR940022816 A KR 940022816A KR 1019940005590 A KR1019940005590 A KR 1019940005590A KR 19940005590 A KR19940005590 A KR 19940005590A KR 940022816 A KR940022816 A KR 940022816A
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die
lead
semiconductor
tie bar
support member
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KR100219772B1 (ko
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덴나스 프랭크
티. 로꾸 이삭
야로시 로버트
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빈센트 비, 인그라시아
모토로라 인코포레이티드
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Abstract

반도체 장치(10)는 타이바아(16)를 포함하는 라이드프레임(12)을 포함한다. 본 발명의 한 형태에 있어서, 타이바아는 반도체 다이(20)를 지지하는데 사용되어 응력에 의해 패키지 크래킹 문제를 경감하고 많은 다른 다이크기에 사용하는데 적합한 종합 리이드 프레임을 제공한다. 다른 실시예에서, 반도체 장치(45)는 상기와 같은 목적을 성취하기 위해 미니플래그(42)를 가지는 리이드 프레임(40)을 가진다.

Description

X형 지지부재를 가지는 반도체 장치와 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 패키지되고 플래그 없는 반도체 장치의 부분의 평면도, 제2도는 플라스틱으로 패키지되어 있는 제1도의 2-2선을 따라 취한 반도체 장치의 단면도.

Claims (3)

  1. 중앙 영역을 가지는 개방 영역을 형성하는 내부 리이드 부분과 외부 리이드 부분을 가지는 다수의 리이드(14)와, 각각이 1.6mm보다 적은 최대폭을 가지는, 상기 개방 영역을 가로지르고 상기 중앙 영역 근처에 연결되는 다수의 타이바아(16)를 포함하는 리이드 프레임과, 상기 타이바아에 의해 장착 지지된 반도체다이(20)와, 반도체 다이를 리이드의 내부부분과 전기적으로 연결하기 위한 수단(24)과, 반도체 다이와 다수의 리이드의 내부 리이드 부분을 포장하는 플라스틱 패키지 몸체(28)를 포함하는 반도체 장치(10)에 있어서, 상기 타이바아는 반도체 다이를 지지하는 리이드 프레임의 유일한 부분인 것을 특징으로 하는 반도체 장치.
  2. 중앙 영역을 가지는 개방 영역을 형성하는 내부 리이드 부분과 외부 리이드 부분을 가지는 다수의 리이드(14)와, 각각이 1.6mm보다 보다 적은 최대폭을 가지는 상기 개방 영역을 가로지르고 상기 중앙 영역 근처에 연결되는 다수의 타이바아 (16)를 포함하는 리이드 프레임과, 상기 타이바아에 의해 장착 지지된 반도체다이 (20)와, 반도체 다이를 리이드의 내부부분과 전기적으로 연결하기 위한 수단(24)과, 반도체 다이와 다수의 리이드의 내부 리이드 부분을 포장하는 플라스틱 패키지 몸체(28)를 포함하는 반도체 장치(10)에 있어서, 상기 타이바아는 반도체 다이를 지지하는 리이드 프레임의 유일한 부분이며, 상기 각 타이바아는 폭을 가지는 제1부분(15)과 제1부분의 폭보다 더 큰 최대폭을 가지는 제2부분을 가지며, 상기 반도체 다이는 상기 타이바아의 제2부분상에 장착된 것을 특징으로 하는 반도체 장치.
  3. 각각이 내부 리이드 부분과 외부 리이드부를 가지며 내부 리이드 부분이 서로 개방 영역을 형성하는 다수의 리이드(14)와, 각각 최대 폭을 가지는 4개의 아암 (16)을 가지며 표면 영역을 가지는, 개방 영역내에 위치된 X형상의 금속 다이 지지부재와, 표면 영역을 가지며, X형상의 다이 지지 부재에 장착된 반도체 다이(26)와, 반도체 다이를 다수의 리이드에 전기적으로 연결하기 위한 수단(24)과, 반도체다이, 다이 지지부재와 다수의 리이드의 내부 리이드 부분을 포장하는 플라스틱 패키지(28)를 포함하는 반도체 장치에 있어서, 상기 다이 지지부재의 표면 영역은 금속-플라스틱 인터페이스 영역과 동일하고, 다이의 표면 영역에서 다이 지지부재의 표면 영역을 뺀 것이 다이 플라스틱-인터페이스 영역과 동일하고, 금속-플라스틱 인터페이스 영역이 다이-플라스틱 인터페이스 영역보다 적은 것을 특징으로 하는 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940005590A 1993-03-22 1994-03-21 반도체 장치 KR100219772B1 (ko)

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US08/035,422 US5327008A (en) 1993-03-22 1993-03-22 Semiconductor device having universal low-stress die support and method for making the same
US035,422 1993-10-12
US133,947 1993-10-12
US08/133,947 US5424576A (en) 1993-03-22 1993-10-12 Semiconductor device having x-shaped die support member and method for making the same

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US5424576A (en) 1995-06-13
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US5327008A (en) 1994-07-05

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