JPS55150264A - Lead frame for semiconductor device and method of fabricating the same - Google Patents

Lead frame for semiconductor device and method of fabricating the same

Info

Publication number
JPS55150264A
JPS55150264A JP5845579A JP5845579A JPS55150264A JP S55150264 A JPS55150264 A JP S55150264A JP 5845579 A JP5845579 A JP 5845579A JP 5845579 A JP5845579 A JP 5845579A JP S55150264 A JPS55150264 A JP S55150264A
Authority
JP
Japan
Prior art keywords
lead frame
holes
pressed
fabricating
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5845579A
Other languages
Japanese (ja)
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5845579A priority Critical patent/JPS55150264A/en
Publication of JPS55150264A publication Critical patent/JPS55150264A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To obtain an economic lead frame by eliminating a tie bar and forming an organic insulating material at the portion. CONSTITUTION:Holes 8 are pressed selectively at a foil 7 for the lead frame of Cu or the like. Then, organic insulating material 9 having excellent heat resistance, medicine resistance and preferable adherence is filled and secured in the holes 8. The holes 10 are pressed in contact with the holes 8 to form the external lead wire 4 of the lead frame. Subsequently, holes 11 are pressed to form die pads 2 and internal lead wires 3, and finally Ni is plated at predetermined position of the lead frame to complete it. Since no tie bar is provided, it is unnecessary to cut it to eliminate expensive mold and press and to improve the yield.
JP5845579A 1979-05-10 1979-05-10 Lead frame for semiconductor device and method of fabricating the same Pending JPS55150264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5845579A JPS55150264A (en) 1979-05-10 1979-05-10 Lead frame for semiconductor device and method of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5845579A JPS55150264A (en) 1979-05-10 1979-05-10 Lead frame for semiconductor device and method of fabricating the same

Publications (1)

Publication Number Publication Date
JPS55150264A true JPS55150264A (en) 1980-11-22

Family

ID=13084888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5845579A Pending JPS55150264A (en) 1979-05-10 1979-05-10 Lead frame for semiconductor device and method of fabricating the same

Country Status (1)

Country Link
JP (1) JPS55150264A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127653U (en) * 1982-02-24 1983-08-30 大槻　眞之 Lead terminal
JPS59501387A (en) * 1982-07-12 1984-08-02 モトロ−ラ・インコ−ポレ−テツド Lead frame and its processing method
JPH01105564A (en) * 1987-10-19 1989-04-24 Toppan Printing Co Ltd Lead frame
JPH01241852A (en) * 1988-03-24 1989-09-26 Mitsubishi Electric Corp Lead frame
US5271148A (en) * 1988-11-17 1993-12-21 National Semiconductor Corporation Method of producing a leadframe

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127653U (en) * 1982-02-24 1983-08-30 大槻　眞之 Lead terminal
JPS59501387A (en) * 1982-07-12 1984-08-02 モトロ−ラ・インコ−ポレ−テツド Lead frame and its processing method
JPH035666B2 (en) * 1982-07-12 1991-01-28 Motorola Inc
JPH01105564A (en) * 1987-10-19 1989-04-24 Toppan Printing Co Ltd Lead frame
JPH01241852A (en) * 1988-03-24 1989-09-26 Mitsubishi Electric Corp Lead frame
US5271148A (en) * 1988-11-17 1993-12-21 National Semiconductor Corporation Method of producing a leadframe

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