SG89255A1 - Face mounted device on small mount pad - Google Patents
Face mounted device on small mount padInfo
- Publication number
- SG89255A1 SG89255A1 SG9800669A SG1998000669A SG89255A1 SG 89255 A1 SG89255 A1 SG 89255A1 SG 9800669 A SG9800669 A SG 9800669A SG 1998000669 A SG1998000669 A SG 1998000669A SG 89255 A1 SG89255 A1 SG 89255A1
- Authority
- SG
- Singapore
- Prior art keywords
- mount pad
- mounted device
- face mounted
- small mount
- small
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG9800669A SG89255A1 (en) | 1998-03-31 | 1998-03-31 | Face mounted device on small mount pad |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG9800669A SG89255A1 (en) | 1998-03-31 | 1998-03-31 | Face mounted device on small mount pad |
Publications (1)
Publication Number | Publication Date |
---|---|
SG89255A1 true SG89255A1 (en) | 2002-06-18 |
Family
ID=20429965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9800669A SG89255A1 (en) | 1998-03-31 | 1998-03-31 | Face mounted device on small mount pad |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG89255A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5424576A (en) * | 1993-03-22 | 1995-06-13 | Motorola, Inc. | Semiconductor device having x-shaped die support member and method for making the same |
US5674785A (en) * | 1995-11-27 | 1997-10-07 | Micron Technology, Inc. | Method of producing a single piece package for semiconductor die |
-
1998
- 1998-03-31 SG SG9800669A patent/SG89255A1/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5424576A (en) * | 1993-03-22 | 1995-06-13 | Motorola, Inc. | Semiconductor device having x-shaped die support member and method for making the same |
US5674785A (en) * | 1995-11-27 | 1997-10-07 | Micron Technology, Inc. | Method of producing a single piece package for semiconductor die |
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