KR930002434A - 내열성이 향상된 반도체소자 밀봉용 수지 조성물 - Google Patents

내열성이 향상된 반도체소자 밀봉용 수지 조성물 Download PDF

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Publication number
KR930002434A
KR930002434A KR1019910011808A KR910011808A KR930002434A KR 930002434 A KR930002434 A KR 930002434A KR 1019910011808 A KR1019910011808 A KR 1019910011808A KR 910011808 A KR910011808 A KR 910011808A KR 930002434 A KR930002434 A KR 930002434A
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KR
South Korea
Prior art keywords
resin composition
group
heat resistance
semiconductor element
improved heat
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Application number
KR1019910011808A
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English (en)
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KR960010844B1 (ko
Inventor
남태영
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이대원
제일모직 주식회사
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Application filed by 이대원, 제일모직 주식회사 filed Critical 이대원
Priority to KR1019910011808A priority Critical patent/KR960010844B1/ko
Priority to JP4180778A priority patent/JPH0674320B2/ja
Priority to US07/911,762 priority patent/US5349029A/en
Publication of KR930002434A publication Critical patent/KR930002434A/ko
Application granted granted Critical
Publication of KR960010844B1 publication Critical patent/KR960010844B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용 없음.

Description

내열성이 향상된 반도체소자 밀봉용 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. 크레졸 노블락에폭시수지, 경화제, 경화촉진제 및 충진제로 이루어진 반도체소자 밀봉용 수지조성물에 있어서, 하기식(1)로 표시되는 말레이미드 변성실록산계 개질제를 함유하고 하기식(2)로 표시되는 알릴에테르화된 페놀류 노블락수지를 경화제로 사용함을 특징으로 하는 내열성이 향상된 반도체 소자 밀봉용 수지조성물.
    (단, R1: 메틸렌기, 페닐렌기, 치환페닐렌기, R2: 메틸기, 페닐기, 치환페닐기, n : R1이 페닐렌이나 치환 페닐렌인 경우 1, R1: 이 메틸렌인 경우 3 또는 4, m : 1 내지 100의 정수.)
    (단, ℓ=1 내지 100의 정수, k=0 또는 1내지 100의 정수)
  2. 제1항에 있어서, 말레이미드 변성 실록산계 개질제가 1.0 내지 15중량%, 알릴에테르화된 페놀류 노블락수지가 4내지 10중량% 포함되는 것을 특징으로한 반도체 소자 밀봉용 수지조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910011808A 1991-07-11 1991-07-11 내열성이 향상된 반도체소자 밀봉용 수지조성물 KR960010844B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019910011808A KR960010844B1 (ko) 1991-07-11 1991-07-11 내열성이 향상된 반도체소자 밀봉용 수지조성물
JP4180778A JPH0674320B2 (ja) 1991-07-11 1992-07-08 耐熱性が向上された半導体素子密封用樹脂組成物
US07/911,762 US5349029A (en) 1991-07-11 1992-07-10 Epoxy resin compositions with improved heat resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910011808A KR960010844B1 (ko) 1991-07-11 1991-07-11 내열성이 향상된 반도체소자 밀봉용 수지조성물

Publications (2)

Publication Number Publication Date
KR930002434A true KR930002434A (ko) 1993-02-23
KR960010844B1 KR960010844B1 (ko) 1996-08-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910011808A KR960010844B1 (ko) 1991-07-11 1991-07-11 내열성이 향상된 반도체소자 밀봉용 수지조성물

Country Status (3)

Country Link
US (1) US5349029A (ko)
JP (1) JPH0674320B2 (ko)
KR (1) KR960010844B1 (ko)

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US6197878B1 (en) 1997-08-28 2001-03-06 Eastman Chemical Company Diol latex compositions and modified condensation polymers
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WO2000052083A1 (en) 1999-03-03 2000-09-08 Eastman Chemical Company Silicone polymer diol compositions and condensation polymer/silicone polymer blends
US6512031B1 (en) * 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
CN1357021A (zh) 1999-06-18 2002-07-03 伊斯曼化学公司 酰胺型聚合物/硅氧烷聚合物共混物及其制造工艺
WO2000078845A1 (en) 1999-06-18 2000-12-28 Eastman Chemical Company Nylon 6-silicone blends
JP2012017422A (ja) * 2010-07-08 2012-01-26 Nitto Denko Corp 熱硬化性樹脂組成物硬化体の製法およびそれにより得られた硬化物
JP5364050B2 (ja) * 2010-07-08 2013-12-11 日東電工株式会社 熱硬化性樹脂組成物硬化体の製法およびそれにより得られた硬化物
US8470936B2 (en) 2011-07-29 2013-06-25 Namics Corporation Liquid epoxy resin composition for semiconductor encapsulation
US20130026660A1 (en) * 2011-07-29 2013-01-31 Namics Corporation Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
JP6147561B2 (ja) * 2012-06-26 2017-06-14 株式会社日本触媒 硬化性樹脂組成物及び封止材
US10221276B2 (en) * 2013-09-27 2019-03-05 Aditya Birla Chemicals (Thailand) Ltd. Self-healing epoxy resin composition
CN113736401A (zh) * 2021-09-06 2021-12-03 艾蒙特成都新材料科技有限公司 一种高耐热单组份胶黏剂及其制备方法

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JPS5032119B2 (ko) * 1971-12-20 1975-10-17
US4288359A (en) * 1977-11-04 1981-09-08 E. I. Du Pont De Nemours And Company Epoxy imide compositions
JPS5943048B2 (ja) * 1978-04-28 1984-10-19 三菱電機株式会社 耐熱性硬化性樹脂組成物
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Also Published As

Publication number Publication date
KR960010844B1 (ko) 1996-08-09
JPH0674320B2 (ja) 1994-09-21
US5349029A (en) 1994-09-20
JPH05235212A (ja) 1993-09-10

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