KR920021648A - 에폭시 수지 조성물 및 반도체 장치 - Google Patents

에폭시 수지 조성물 및 반도체 장치 Download PDF

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Publication number
KR920021648A
KR920021648A KR1019920008523A KR920008523A KR920021648A KR 920021648 A KR920021648 A KR 920021648A KR 1019920008523 A KR1019920008523 A KR 1019920008523A KR 920008523 A KR920008523 A KR 920008523A KR 920021648 A KR920021648 A KR 920021648A
Authority
KR
South Korea
Prior art keywords
integer
epoxy resin
carbon atoms
following general
general formula
Prior art date
Application number
KR1019920008523A
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English (en)
Other versions
KR100197044B1 (ko
Inventor
도시오 시오하라
다까유끼 아오끼
가즈또시 도미요시
히사시 시미즈
다까시 쓰찌야
Original Assignee
카나가와 치히로
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 카나가와 치히로, 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 카나가와 치히로
Publication of KR920021648A publication Critical patent/KR920021648A/ko
Application granted granted Critical
Publication of KR100197044B1 publication Critical patent/KR100197044B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds

Abstract

내용 없음

Description

에폭시 수지 조성물 및 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. (A)하기 일반식(1)의 나프탈렌 고리 함유 에폭시 수지
    (식 중, R1은 수소 원자 또는 탄소수 1-10의 알킬기, OG는0-5의 정수, ℓ은 0-3의 정수, m은 0-2의 정수, n은 1 또는 2의 정수를 나타내며, OG는 나프탈렌 고리의 어느 고리에 부가해도 좋고, 양 고리에 동시에 부가해도 좋다.), (B) 하기 일반식(2)의 비페닐기 함유 에폭시 수지
    (식 중, R2은 수소 원자, 할로겐 원자 또는 탄소수 1-5의 1가 탄화수소기이고, q는 0-5의 정수이다.), (C)하기 일반식(3)의 페놀 수지.
    (식 중, R3 또는 이들 기의 수소 원자의 일부 또는 전부가 탄소수 1-5의 알킬기로 치환된 기, R4는 수소 원자 또는 탄소수 1-4의 알킬기, r은 0-5의 정수이다.) 및 (D) 무기질 충전제를 필수 성분으로 하는 에폭시 수지 조성물.
  2. 제1항의 에폭시 수지 조성물의 경화물로 봉지된 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019920008523A 1991-05-21 1992-05-20 에폭시 수지 조성물 및 반도체 장치 KR100197044B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3145502A JP2526747B2 (ja) 1991-05-21 1991-05-21 エポキシ樹脂組成物及び半導体装置
JP91-145502 1991-05-21

Publications (2)

Publication Number Publication Date
KR920021648A true KR920021648A (ko) 1992-12-18
KR100197044B1 KR100197044B1 (ko) 1999-06-15

Family

ID=15386746

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920008523A KR100197044B1 (ko) 1991-05-21 1992-05-20 에폭시 수지 조성물 및 반도체 장치

Country Status (4)

Country Link
US (1) US5298548A (ko)
JP (1) JP2526747B2 (ko)
KR (1) KR100197044B1 (ko)
DE (1) DE4216680C2 (ko)

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Also Published As

Publication number Publication date
US5298548A (en) 1994-03-29
KR100197044B1 (ko) 1999-06-15
JPH04342719A (ja) 1992-11-30
DE4216680C2 (de) 1998-09-17
JP2526747B2 (ja) 1996-08-21
DE4216680A1 (de) 1992-11-26

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