KR920018142A - 에폭시 수지 조성물 및 반도체 장치 - Google Patents
에폭시 수지 조성물 및 반도체 장치 Download PDFInfo
- Publication number
- KR920018142A KR920018142A KR1019920005192A KR920005192A KR920018142A KR 920018142 A KR920018142 A KR 920018142A KR 1019920005192 A KR1019920005192 A KR 1019920005192A KR 920005192 A KR920005192 A KR 920005192A KR 920018142 A KR920018142 A KR 920018142A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- semiconductor devices
- resin compositions
- carbon atoms
- resin composition
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title claims 4
- 229920000647 polyepoxide Polymers 0.000 title claims 4
- 239000000203 mixture Substances 0.000 title claims 3
- 239000004065 semiconductor Substances 0.000 title claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 239000005011 phenolic resin Substances 0.000 claims 2
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 125000001624 naphthyl group Chemical group 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (2)
- (A) 나프탈렌 고리 함유 에폭시 수지, (B) 하기 일반식(1)로 나타내어지는 페놀 수지를 함유하는 페놀 수지 및 (C) 무기질 충전제를 필수 성분으로 하는 에폭시 수지 조성물.(식 중, R은또는 이들 기의 수소 원자의 일부 또는 전부가 탄소수 1-5의 알킬기로 치환된 기, R1은 수소 원자 또는 탄소수 1-4의 알킬기, n은 0-5의 정수이다.)
- 제1항 기재의 에폭시 수지 조성물의 경화물로 봉지된 반도체 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP91-91475 | 1991-03-29 | ||
JP3091475A JPH04300914A (ja) | 1991-03-29 | 1991-03-29 | エポキシ樹脂組成物及び半導体装置 |
JP91-091475 | 1991-03-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920018142A true KR920018142A (ko) | 1992-10-21 |
KR0181716B1 KR0181716B1 (ko) | 1999-05-15 |
Family
ID=14027425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920005192A KR0181716B1 (ko) | 1991-03-29 | 1992-03-28 | 에폭시 수지 조성물 및 반도체 장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5418266A (ko) |
EP (1) | EP0506360B1 (ko) |
JP (1) | JPH04300914A (ko) |
KR (1) | KR0181716B1 (ko) |
DE (1) | DE69202608T2 (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05230170A (ja) * | 1991-06-25 | 1993-09-07 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
JPH05230187A (ja) * | 1991-06-25 | 1993-09-07 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂組成物 |
IT1261171B (it) * | 1992-03-03 | 1996-05-09 | Ruetgerswerke Ag | Miscuglio resinoso a basso contenuto di prodotti di scissione. |
US7041771B1 (en) | 1995-08-11 | 2006-05-09 | Kac Holdings, Inc. | Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering |
SG63803A1 (en) * | 1997-01-23 | 1999-03-30 | Toray Industries | Epoxy-resin composition to seal semiconductors and resin-sealed semiconductor device |
TW452944B (en) * | 1997-06-03 | 2001-09-01 | Hitachi Chemical Co Ltd | Phenolic resin, resin composition, molding material for encapsulation, and electronic component device |
JPH11140277A (ja) * | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びこれを用いた半導体装置 |
JPH11140166A (ja) * | 1997-11-11 | 1999-05-25 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
DE69934153T2 (de) * | 1998-02-02 | 2007-09-20 | Shin-Etsu Chemical Co., Ltd. | Verfahren zur Montage von Flip-Chip-Halbleiterbauelementen |
EP1507829A4 (en) * | 2002-05-24 | 2009-11-04 | Nippon Catalytic Chem Ind | FLAME RESISTANT RESIN COMPOSITION, MANUFACTURING METHOD, FORM BODY, AND SILICON DIOXIDE THEREIN |
JP3627736B2 (ja) * | 2002-10-11 | 2005-03-09 | 住友ベークライト株式会社 | エポキシ樹脂組成物並びにこれを用いた半導体装置 |
WO2005056632A1 (ja) * | 2003-12-08 | 2005-06-23 | Sekisui Chemical Co., Ltd. | 熱硬化性樹脂組成物、樹脂シートおよび絶縁基板用樹脂シート |
US7943706B2 (en) * | 2005-03-24 | 2011-05-17 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
US20060241215A1 (en) * | 2005-04-25 | 2006-10-26 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
JP4844725B2 (ja) * | 2005-04-25 | 2011-12-28 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
US8048969B2 (en) * | 2005-04-25 | 2011-11-01 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
US20070207322A1 (en) * | 2006-03-01 | 2007-09-06 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
KR101388750B1 (ko) * | 2012-07-31 | 2014-04-25 | 삼성전기주식회사 | 인쇄회로기판용 에폭시 수지 조성물, 절연필름, 프리프레그 및 다층 인쇄회로기판 |
CN105051115B (zh) | 2013-03-28 | 2018-01-09 | 松下电器产业株式会社 | 绝缘导热性树脂组合物 |
JP6924292B2 (ja) * | 2020-01-22 | 2021-08-25 | 日本化薬株式会社 | エポキシ樹脂混合物、エポキシ樹脂組成物およびその硬化物 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3384618A (en) * | 1960-11-24 | 1968-05-21 | Imoto Minoru | Method of producing synthetic resins from aromatic glycols and a phenol |
US3275708A (en) * | 1966-07-11 | 1966-09-27 | Dow Chemical Co | Phenolic adducts of diphenyloxides or biphenyls, with epoxy resins |
JPS53299A (en) * | 1976-06-25 | 1978-01-05 | Hitachi Ltd | Epoxy resin composition |
JPS5967660A (ja) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置 |
JPS59230017A (ja) * | 1983-05-25 | 1984-12-24 | Agency Of Ind Science & Technol | 新規ポリグリシジルエ−テル及びその製法 |
JPS60112813A (ja) * | 1983-11-24 | 1985-06-19 | Dainippon Ink & Chem Inc | 成形材料用エポキシ樹脂組成物 |
EP0218228B1 (en) * | 1985-10-07 | 1993-09-15 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition |
JPH0617458B2 (ja) * | 1987-03-16 | 1994-03-09 | 信越化学工業株式会社 | エポキシ樹脂組成物 |
JPH06104712B2 (ja) * | 1987-04-08 | 1994-12-21 | 東レ株式会社 | 半導体封止用樹脂組成物 |
JPS6460623A (en) * | 1987-08-31 | 1989-03-07 | Toshiba Corp | Epoxy resin composition for semiconductor sealing |
JPH0657740B2 (ja) * | 1988-09-27 | 1994-08-03 | 三菱電機株式会社 | 半導体封止用エポキシ樹脂組成物 |
JPH0291118A (ja) * | 1988-09-29 | 1990-03-30 | Nippon Steel Chem Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JPH0791364B2 (ja) * | 1988-10-06 | 1995-10-04 | 東レ株式会社 | 半導体封止用半田耐熱性エポキシ樹脂組成物 |
JPH02189326A (ja) * | 1989-01-18 | 1990-07-25 | Mitsubishi Petrochem Co Ltd | 電子部品封止用エポキシ樹脂組成物 |
JPH0617440B2 (ja) * | 1989-05-30 | 1994-03-09 | 新日鐵化学株式会社 | 新規エポキシ樹脂及びその製造法 |
KR940010010B1 (ko) * | 1989-06-20 | 1994-10-20 | 닛뽕 가야꾸 가부시기가이샤 | 페놀류 노볼락형 수지, 그 경화물 및 그 제조방법 |
JPH0390075A (ja) * | 1989-09-01 | 1991-04-16 | Nippon Steel Chem Co Ltd | エポキシ樹脂及びその中間体並びにその製造法 |
DE69115058T2 (de) * | 1990-01-25 | 1996-08-08 | Shinetsu Chemical Co | Epoxyharzzusammensetzung und damit verkapselte Halbleiteranordnung. |
JP2823056B2 (ja) * | 1990-12-10 | 1998-11-11 | 日本化薬株式会社 | エポキシ樹脂組成物及びその硬化物 |
JP3032315B2 (ja) * | 1991-01-14 | 2000-04-17 | 健二 片桐 | 脂肪肝治療剤 |
JP2526747B2 (ja) * | 1991-05-21 | 1996-08-21 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP3000717U (ja) | 1994-02-03 | 1994-08-16 | 株式会社博進紙器製作所 | 電報用装飾台紙 |
-
1991
- 1991-03-29 JP JP3091475A patent/JPH04300914A/ja active Pending
-
1992
- 1992-03-25 DE DE69202608T patent/DE69202608T2/de not_active Expired - Lifetime
- 1992-03-25 EP EP92302564A patent/EP0506360B1/en not_active Expired - Lifetime
- 1992-03-28 KR KR1019920005192A patent/KR0181716B1/ko not_active IP Right Cessation
-
1994
- 1994-01-27 US US08/187,262 patent/US5418266A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5418266A (en) | 1995-05-23 |
DE69202608T2 (de) | 1996-01-18 |
KR0181716B1 (ko) | 1999-05-15 |
EP0506360A3 (en) | 1993-01-13 |
EP0506360A2 (en) | 1992-09-30 |
JPH04300914A (ja) | 1992-10-23 |
DE69202608D1 (de) | 1995-06-29 |
EP0506360B1 (en) | 1995-05-24 |
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