KR870001261A - 에폭시 수지 조성물 - Google Patents

에폭시 수지 조성물 Download PDF

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Publication number
KR870001261A
KR870001261A KR1019860000087A KR860000087A KR870001261A KR 870001261 A KR870001261 A KR 870001261A KR 1019860000087 A KR1019860000087 A KR 1019860000087A KR 860000087 A KR860000087 A KR 860000087A KR 870001261 A KR870001261 A KR 870001261A
Authority
KR
South Korea
Prior art keywords
epoxy resin
resin composition
parts
weight
curing agent
Prior art date
Application number
KR1019860000087A
Other languages
English (en)
Other versions
KR900000454B1 (ko
Inventor
가즈오 야쓰다
가즈오·안도 도시하루·이다바시 요시후미 야쓰다
도시하루 안도
요시후미 이다바시
Original Assignee
미쓰비시전기주식회사
시끼 모리야
미쓰비시전기 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시전기주식회사, 시끼 모리야, 미쓰비시전기 주식회사 filed Critical 미쓰비시전기주식회사
Publication of KR870001261A publication Critical patent/KR870001261A/ko
Application granted granted Critical
Publication of KR900000454B1 publication Critical patent/KR900000454B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음.

Description

에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 실시예 1-3 및 비교예 1-2에서 제조한 에폭시수지 조성물의 점도의 경시변화를 표시한 그래프.

Claims (3)

  1. 에폭시당량 200 이하의 에폭시수지 100중량부에 대하여 식(I) :
    (식중, n는 50-80의 정수를 표시한다)에서 표현되는 폴리수루본 수지 0.5-10중량부를 가열 혼합하여, 얻어진 가열용해 혼합물, 경화제 및 무기질 충전제 등으로 이루어지는 것을 특징으로 하는 에폭시 수지 조성물.
  2. 청구범위 제1항에 있어서, 경화제가 다염기성 카루본산 무수물 100중량부 및 식(II):
    에서 표현되는 비스페놀 A40-60중량부의 축합 혼합물인 것을 특징으로 하는 에폭시 수지 조성물.
  3. 청구범위 제1항에 있어서, 무기질 충전제가 아루미나 분말인 것을 특징으로 하는 에폭시 수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860000087A 1985-07-18 1986-01-09 에폭시수지 조성물 KR900000454B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60159139A JPS6220555A (ja) 1985-07-18 1985-07-18 エポキシ樹脂組成物
JP159139 1985-07-18

Publications (2)

Publication Number Publication Date
KR870001261A true KR870001261A (ko) 1987-03-12
KR900000454B1 KR900000454B1 (ko) 1990-01-30

Family

ID=15687101

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860000087A KR900000454B1 (ko) 1985-07-18 1986-01-09 에폭시수지 조성물

Country Status (6)

Country Link
US (1) US4677144A (ko)
EP (1) EP0211147B1 (ko)
JP (1) JPS6220555A (ko)
KR (1) KR900000454B1 (ko)
CN (1) CN1004487B (ko)
DE (1) DE3662054D1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3855530T2 (de) * 1987-10-05 1997-02-06 Ici Plc Polymermasse
US4972031A (en) * 1988-10-05 1990-11-20 Imperial Chemical Industries Plc Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone
US5213886A (en) * 1989-02-17 1993-05-25 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions
US5162450A (en) * 1989-02-17 1992-11-10 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions
KR930701561A (ko) * 1990-06-08 1993-06-12 게리 엘. 그리스울드 전자 용품용 재처리가능한 접착제
NL9402233A (nl) * 1994-12-29 1996-08-01 3P Licensing Bv Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.
US5834565A (en) * 1996-11-12 1998-11-10 General Electric Company Curable polyphenylene ether-thermosetting resin composition and process
US6197898B1 (en) 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
US7867319B2 (en) * 2008-04-01 2011-01-11 Honeywell International Inc. Filled epoxy tubesheet
BRPI1015324A2 (pt) * 2009-05-05 2019-04-09 Huntsman Advanced Materials (Switzerland) Gmbh sistema curável, método para a fabricação de um produto curado, produto curado, e, usos do produto curado e do sistema curável
CN101864262A (zh) * 2009-11-03 2010-10-20 上海上大瑞沪微系统集成技术有限公司 柔性导电胶
WO2014092182A1 (ja) * 2012-12-13 2014-06-19 Watanabe Kayo 充填剤、シーリング構造およびその製法
CN108215233B (zh) * 2017-12-11 2019-12-24 湖北耐创新材料洁具有限公司 一种树脂和矿物混合浇注件的压力成型工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1169613A (en) * 1967-02-21 1969-11-05 Ciba Ltd Epoxide Resin Compositions
GB1306231A (ko) * 1969-10-24 1973-02-07
US3819472A (en) * 1973-03-13 1974-06-25 Du Pont Coating composition of an aromatic polysulfone resin, an epoxy resin, and n-cyclohexyl toluene sulfonamide
JPS5331904A (en) * 1976-09-06 1978-03-25 Nippon Telegr & Teleph Corp <Ntt> Informing system for facsimile communication result
EP0151553A3 (de) * 1984-02-03 1987-05-27 Ciba-Geigy Ag Epoxiharz/Polysulfon-Formmassen für gehärtete Produkte mit ausgezeichneter Riss- und Feuchtigkeitsbeständigkeit
JPS60243113A (ja) * 1984-05-17 1985-12-03 Sumitomo Chem Co Ltd 強靭性に優れたエポキシ樹脂組成物

Also Published As

Publication number Publication date
DE3662054D1 (en) 1989-03-16
KR900000454B1 (ko) 1990-01-30
JPS6220555A (ja) 1987-01-29
EP0211147A1 (en) 1987-02-25
CN1004487B (zh) 1989-06-14
EP0211147B1 (en) 1989-02-08
US4677144A (en) 1987-06-30
CN86104577A (zh) 1987-02-11

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