KR920014906A - 분말상 에폭시 수지 코팅 조성물 - Google Patents

분말상 에폭시 수지 코팅 조성물 Download PDF

Info

Publication number
KR920014906A
KR920014906A KR1019920001035A KR920001035A KR920014906A KR 920014906 A KR920014906 A KR 920014906A KR 1019920001035 A KR1019920001035 A KR 1019920001035A KR 920001035 A KR920001035 A KR 920001035A KR 920014906 A KR920014906 A KR 920014906A
Authority
KR
South Korea
Prior art keywords
weight
coating composition
parts
epoxy resin
resin coating
Prior art date
Application number
KR1019920001035A
Other languages
English (en)
Other versions
KR0133653B1 (ko
Inventor
구니미쓰 마쓰자끼
가즈야 오노
세이따로 이와모또
미끼오 오사
다께시 와따나베
Original Assignee
원본미기재
소마루가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 소마루가부시끼가이샤 filed Critical 원본미기재
Publication of KR920014906A publication Critical patent/KR920014906A/ko
Application granted granted Critical
Publication of KR0133653B1 publication Critical patent/KR0133653B1/ko

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03Powdery paints
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/934Powdered coating composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

분말상 에폭시 수지 코팅 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. 에폭시수지 100중량부; 산무수물 5~35중량부; 페놀수지 2~30중량부; 경화가속제 0.05~5중량부; 및 평균입도 0.5~100㎛인 제1충전제 성분의 99.7~87.0중량%와 평균입도 0.1㎛이하인 제2충전제 성분의 0.3~13.0중량%로 이루어진 무기충전제의 130~270 중량부를 포함하는 분말상 코팅 조성물.
  2. 제1항에 있어서, 무기충전제가 제1충전제 성분의 99.5~90중량%와 제2충전제 성분의 0.5~10.0중량%로 이루어짐을 특징으로 하는 분말상 코팅 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920001035A 1991-01-25 1992-01-24 분말상 에폭시 수지 코팅 조성물 KR0133653B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-25777 1991-01-25
JP3025777A JP2668289B2 (ja) 1991-01-25 1991-01-25 粉体塗料用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
KR920014906A true KR920014906A (ko) 1992-08-25
KR0133653B1 KR0133653B1 (ko) 1998-04-20

Family

ID=12175278

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920001035A KR0133653B1 (ko) 1991-01-25 1992-01-24 분말상 에폭시 수지 코팅 조성물

Country Status (7)

Country Link
US (1) US5418265A (ko)
EP (1) EP0496618B1 (ko)
JP (1) JP2668289B2 (ko)
KR (1) KR0133653B1 (ko)
CA (1) CA2059905A1 (ko)
DE (1) DE69201657T2 (ko)
HK (1) HK12997A (ko)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1261171B (it) * 1992-03-03 1996-05-09 Ruetgerswerke Ag Miscuglio resinoso a basso contenuto di prodotti di scissione.
CA2150479A1 (en) * 1992-12-22 1994-07-07 Allen Leroy Griggs Rapid cure thermosetting functional powder coatings
JP3123272B2 (ja) * 1992-12-25 2001-01-09 日本油脂株式会社 軽量気泡コンクリート、その製造方法および補強鉄骨用粉体塗料
US5447751A (en) * 1994-03-08 1995-09-05 Morton International, Inc. Wrinkle finish powder coating
JP3611066B2 (ja) * 1996-08-29 2005-01-19 株式会社ルネサステクノロジ 無機質充填剤及びエポキシ樹脂組成物の製造方法
US5908883A (en) 1997-06-18 1999-06-01 Caramanian; John Compositions for dynamic balancing
DE19810621A1 (de) * 1998-03-12 1999-09-16 Bosch Gmbh Robert Rotor für eine Kommutatormaschine
KR100554031B1 (ko) * 1998-12-31 2006-12-19 주식회사 케이씨씨 열경화성 에폭시 분체도료 조성물_
JP3425739B2 (ja) * 1999-03-23 2003-07-14 大日精化工業株式会社 粉体塗料の製造方法
KR100616527B1 (ko) * 1999-06-18 2006-08-28 주식회사 케이씨씨 3겹 강관 하도용 열경화성 분체도료 조성물
US6778053B1 (en) * 2000-04-19 2004-08-17 General Electric Company Powder coated generator field coils and related method
US6899917B2 (en) * 2001-12-27 2005-05-31 3M Innovative Properties Company Powdered epoxy composition
US6933332B2 (en) * 2001-12-27 2005-08-23 3M Innovative Properties Company Powdered epoxy composition
US7265045B2 (en) * 2002-10-24 2007-09-04 Megica Corporation Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
US20040236037A1 (en) * 2003-05-19 2004-11-25 December Timothy S. Particulate coatings having improved chip resistance, UV durability, and color stability
KR101115598B1 (ko) * 2004-04-14 2012-03-14 나믹스 코포레이션 에폭시 수지 조성물
US20060071570A1 (en) * 2004-10-05 2006-04-06 General Electric Company Generator rotor slot armors and related method
DE102006012839B4 (de) * 2006-03-21 2008-05-29 Vacuumschmelze Gmbh & Co. Kg Lackzusammensetzung und deren Verwendung
US7498374B2 (en) * 2006-11-15 2009-03-03 Irwin Frank Cast polymer and method of making the same
JP5547456B2 (ja) * 2009-11-10 2014-07-16 スリーエム イノベイティブ プロパティズ カンパニー 一液型エポキシ樹脂組成物及びそれを用いた接着方法
KR101004742B1 (ko) * 2010-07-28 2011-01-04 (주)서해씨엔씨 지상기기 외함의 부식방지, 광고물부착방지, 오염방지, 낙서방지 효과를 동시에 얻기 위한 코팅방법 및 코팅액조성물
KR101734711B1 (ko) 2015-12-08 2017-05-12 주식회사 케이씨씨 내열성능이 우수한 진공증착 하도용 분체도료 조성물 및 이로부터 형성된 경화코팅층을 포함하는 성형품
CN112341908B (zh) * 2020-11-27 2022-03-22 海隆石油产品技术服务(上海)有限公司 一种气井油管用高耐磨粉末涂料
CN114752282B (zh) * 2022-03-30 2023-05-23 安徽舜邦精细化工有限公司 一种石油管道用耐腐蚀环氧粉末涂料

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5740524A (en) * 1980-08-25 1982-03-06 Toshiba Corp Epoxy resin composition
JPS58198525A (ja) * 1982-05-14 1983-11-18 Sanyurejin Kk エポキシ樹脂組成物
JPS60123526A (ja) * 1983-12-06 1985-07-02 Mitsubishi Electric Corp エポキシ樹脂組成物
JPS60190418A (ja) * 1984-03-12 1985-09-27 Mitsubishi Electric Corp 半導体封止用液状エポキシ樹脂組成物
US4617330A (en) * 1984-03-30 1986-10-14 Kabushiki Kaisha Toshiba Epoxy resin composition for cast molding
JPS61185528A (ja) * 1985-02-12 1986-08-19 Mitsubishi Electric Corp エポキシ樹脂組成物
JPS61233011A (ja) * 1985-04-10 1986-10-17 Mitsubishi Electric Corp エポキシ樹脂組成物
JPS63168472A (ja) * 1986-12-27 1988-07-12 Sumitomo Bakelite Co Ltd エポキシ樹脂粉体塗料組成物
JPS63310504A (ja) * 1987-06-12 1988-12-19 Nitto Electric Ind Co Ltd 絶縁体
JPH07100766B2 (ja) * 1987-06-25 1995-11-01 ソマール株式会社 エポキシ樹脂粉体塗料組成物
US4898620A (en) * 1988-08-12 1990-02-06 Ecca Calcium Products, Inc. Dry ground/wet ground calcium carbonate filler compositions
US5137940A (en) * 1989-02-09 1992-08-11 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin compositions
US5008309A (en) * 1989-04-20 1991-04-16 Asmo Co., Ltd. Balancing putty
JPH0713206B2 (ja) * 1989-11-17 1995-02-15 ソマール株式会社 密着性及び電気特性の良好な粉体塗料
JP2639739B2 (ja) * 1990-03-16 1997-08-13 ソマール 株式会社 粉体塗料用エポキシ樹脂組成物

Also Published As

Publication number Publication date
EP0496618A2 (en) 1992-07-29
DE69201657D1 (de) 1995-04-20
EP0496618B1 (en) 1995-03-15
JP2668289B2 (ja) 1997-10-27
JPH04248876A (ja) 1992-09-04
US5418265A (en) 1995-05-23
CA2059905A1 (en) 1992-07-26
KR0133653B1 (ko) 1998-04-20
HK12997A (en) 1997-02-14
EP0496618A3 (en) 1992-12-23
DE69201657T2 (de) 1995-09-07

Similar Documents

Publication Publication Date Title
KR920014906A (ko) 분말상 에폭시 수지 코팅 조성물
KR900013006A (ko) 반도체 봉지용 에폭시 수지 조성물 및 그 경화물
KR860001167A (ko) 무용제 폴리이미드-변태 에폭시 조성물
KR870008938A (ko) 열가소성 수지 조성물
KR870007995A (ko) 도전성 수지 페이스트
KR920016518A (ko) 열전도성 플라스틱 물질용 충전제
ATE273337T1 (de) Härtbare zusammensetzungen
KR850003552A (ko) 전자소자 캡슐화수지용 충전제 및 그를 함유하는 전자소자 캡슐화수지 조성물
KR870001261A (ko) 에폭시 수지 조성물
KR910009821A (ko) 분말 피복 조성물
KR870005049A (ko) 열가소성 수지 조성물
KR890013120A (ko) 매트릭스 수지 소성물
KR860008235A (ko) 에폭시 수지조성물
KR910018460A (ko) 열가소성 수지 조성물
JPS5359798A (en) Epoxy resin composition of excellent warm-water resistance
JPS5518472A (en) Antisagging and anticorrosive material
KR900001782A (ko) 밀봉용 수지 조성물
JPS51129498A (en) Thermosetting resin composition
JPS5390400A (en) Powdery epoxy resin composition
JPS57198754A (en) Chlorine-containing resin composition
KR910012110A (ko) 열경화성 에폭시 수지 분체도료
KR920000883A (ko) 에폭시 수지 분체도료 조성물
KR920012346A (ko) 열경화성 에폭시 수지 분체 도료 조성물 및 이를 이용한 분체도료 제조방법
KR900000420A (ko) 열경화성 에폭시 수지에 의거한 분말 피복 조성물
KR910012055A (ko) 반도체 봉지용 에폭시 수지 조성물

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20011213

Year of fee payment: 5

LAPS Lapse due to unpaid annual fee