KR920016518A - 열전도성 플라스틱 물질용 충전제 - Google Patents

열전도성 플라스틱 물질용 충전제 Download PDF

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KR920016518A
KR920016518A KR1019920002072A KR920002072A KR920016518A KR 920016518 A KR920016518 A KR 920016518A KR 1019920002072 A KR1019920002072 A KR 1019920002072A KR 920002072 A KR920002072 A KR 920002072A KR 920016518 A KR920016518 A KR 920016518A
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South Korea
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weight
component
volume
formulation
powder mixture
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KR1019920002072A
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KR100210184B1 (ko
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부야르트 파트리세
지버 베르너
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베르너 발데그
시바-가이기 에이지
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C01P2004/53—Particles with a specific particle size distribution bimodal size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

내용 없음

Description

열전도성 플라스틱 물질용 충전제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (16)

  1. (1)이의 90중량% 이상의 평균 입자 크기가 20 내지 120㎛인 구형α-알루미나 55내지 75용적%, (2) 이의 90중량% 이상의 평균 입자 크기가 3 내지 24㎛인 구형 알루미나 35 내지 20용적% 및 (3) 이의 90중량%이상의 입자 크기가 1내지 7㎛인 알루미나 10내지 1용적%를 총 용적%가 100% 이하가 되게 하는 양으로 포함하는, 입자크기 및 외부 형태가 상이한 분획을 함유하는 알루미나의 분말 혼합물.
  2. 제1항에 있어서, 성분(1) 65내지 75용적%, 성분(2) 35내지 22용적% 및 성분(3) 7내지 1용적%를 총 용적%가 100% 이하가 되게 하는 양으로 포함하는 혼합물.
  3. 제1항에 있어서, 성분(1) 70 내지 75용적%, 성분(2) 30내지 22용적% 및 성분(3) 7 내지 1용적%를 총 용적%가 100%이하가 되게 하는 양으로 포함하는 혼합물.
  4. 제1항에 있어서, 성분(1)의 입자 직경이 30 내지 100㎛이고, 성분(2)의 입자 직경이 3 내지 20㎛이며, 성분(3)의 입자 직경이 1 내지 5㎛인 혼합물.
  5. a) 열가소성 또는 구조적으로 가교결합된 중합체 10 내지 95중량%및 b) 제 1항에 따른 분말 혼합물 90 내지 5중량%를 포함하는 균질하게 블렌딩된 체형.
  6. 제5항에 있어서, 중합체 10 내지 90중량% 및 분말 혼합물 90 내지 10중량%를 포함하는 제형.
  7. 제5항에 있어서, 구조적으로 가교결합된 중합체가 에폭시 수지인 제형.
  8. 제형을 기준으로 하여, 제1항에 따른 분말 혼합물 70 내지 90중량%를 포함하는, 에폭시 수지를 기본으로 하는 주조 수지 제형.
  9. 제8항에 있어서, 분말 혼합물 75 내지 90중량%를 포함하는 주조 수지 제형.
  10. 제8항에 있어서, 분말 혼합물 80 내지 90중량%를 포함하는 주조 수지 제형.
  11. 제8항에 있어서, 경화제로서 비스페놀 디글리시딜 에테르와 폴리카복실산 무수물의 혼합물을 포함하는 주조 수지제형.
  12. 제11항에 있어서, 추가로 경화 촉진제를 포함하는 주조 수지 제형.
  13. 제11항에 있어서, 비스페놀 A 또는 비스페놀 F 디글리시딜 에테르를 포함하는 주조 수지 제형.
  14. 열전도성 성형품 및 복합재를 제조하기 위한, 제5항에 따른 제형의 용도.
  15. 열전도성 성형품을 제조하기 위한, 제8항에 따른 주조 수지 제형의 용도.
  16. 금속을 결합시키기 위한 수지 접착제 또는 전기 및 전자 부품용 밀봉 물질로서의 제8항에 따른 주조 수지 제형의 용도.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920002072A 1991-02-14 1992-02-13 열전도성 플라스틱 물질용 충전제 KR100210184B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH00454/91-9 1991-02-14
CH45491 1991-02-14
CH454/91-9 1991-02-14

Publications (2)

Publication Number Publication Date
KR920016518A true KR920016518A (ko) 1992-09-25
KR100210184B1 KR100210184B1 (ko) 1999-07-15

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KR1019920002072A KR100210184B1 (ko) 1991-02-14 1992-02-13 열전도성 플라스틱 물질용 충전제

Country Status (6)

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EP (1) EP0499585B1 (ko)
JP (1) JP3176416B2 (ko)
KR (1) KR100210184B1 (ko)
CA (1) CA2061093A1 (ko)
DE (1) DE59203064D1 (ko)
TW (1) TW197458B (ko)

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EP0933397B1 (en) * 1996-10-16 2002-12-18 Kureha Kagaku Kogyo Kabushiki Kaisha Poly(phenylene sulfide) resin composition
US5929138A (en) * 1996-11-05 1999-07-27 Raychem Corporation Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
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JP2001168246A (ja) * 1999-11-30 2001-06-22 Three M Innovative Properties Co 熱伝導性シート及びその製造方法
US6500891B1 (en) 2000-05-19 2002-12-31 Loctite Corporation Low viscosity thermally conductive compositions containing spherical thermally conductive particles
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US6887811B2 (en) 2001-05-30 2005-05-03 Showa Denko K.K. Spherical alumina particles and production process thereof
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JP5345340B2 (ja) * 2008-05-16 2013-11-20 新日鉄住金マテリアルズ株式会社 アルミナ配合粒子および樹脂成形体
DE102008049850A1 (de) * 2008-10-01 2010-04-08 Tesa Se Wärmeleitende Haftklebemasse
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JP5558161B2 (ja) 2010-03-29 2014-07-23 アロン化成株式会社 発熱体と、冷却部品との間のスペーサーとして使用される熱伝導性エラストマー組成物
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ITMI20121202A1 (it) * 2012-07-10 2014-01-11 Francesco Pio Salvatore Calabrese Formulazione per materiali compositi, materiali compositi e procedimento per la loro produzione
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WO2018135517A1 (ja) 2017-01-19 2018-07-26 国立大学法人福井大学 高熱伝導性材料及びその製造方法
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Also Published As

Publication number Publication date
KR100210184B1 (ko) 1999-07-15
EP0499585B1 (de) 1995-08-02
TW197458B (ko) 1993-01-01
DE59203064D1 (de) 1995-09-07
EP0499585A1 (de) 1992-08-19
JP3176416B2 (ja) 2001-06-18
CA2061093A1 (en) 1992-08-15
JPH05132576A (ja) 1993-05-28

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