KR900013006A - 반도체 봉지용 에폭시 수지 조성물 및 그 경화물 - Google Patents

반도체 봉지용 에폭시 수지 조성물 및 그 경화물 Download PDF

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Publication number
KR900013006A
KR900013006A KR1019900001507A KR900001507A KR900013006A KR 900013006 A KR900013006 A KR 900013006A KR 1019900001507 A KR1019900001507 A KR 1019900001507A KR 900001507 A KR900001507 A KR 900001507A KR 900013006 A KR900013006 A KR 900013006A
Authority
KR
South Korea
Prior art keywords
epoxy resin
resin composition
semiconductor encapsulation
cured product
average particle
Prior art date
Application number
KR1019900001507A
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English (en)
Other versions
KR950005309B1 (ko
Inventor
가즈또시 도미요시
도시오 시오하라
하쓰니 시라이시
고오니 닛모리
Original Assignee
고사까 유따로
신에쓰 가가꾸 고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1030813A external-priority patent/JPH02209949A/ja
Priority claimed from JP1050695A external-priority patent/JPH0645740B2/ja
Application filed by 고사까 유따로, 신에쓰 가가꾸 고오교 가부시끼가이샤 filed Critical 고사까 유따로
Publication of KR900013006A publication Critical patent/KR900013006A/ko
Application granted granted Critical
Publication of KR950005309B1 publication Critical patent/KR950005309B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

반도체 봉지용 에폭시 수지 조성물 및 그 경화물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 에폭시 수지 경화제 및 무기질 충전제를 함유해서되는 에폭시 수지 조성물에 있어서, 무기질 충전제로서 평균 입경이 5-35㎛인 구상 실리카, 평균 입경이 0.1-2㎛인 구상 실리카 및 평균입경이 2-15㎛인 파쇄 실리카를 무기질 충전제의 전체 배합량에 대해 각각 20-80중량% 1-20중량% 및 20-80중량%의 양으로 병용하는 것을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물.
  2. 제1항에 있어서, 파쇄 실리카가 구상 실리카를 분쇄함으로써 얻어지는 것인 반도체 봉지용 에폭시 수지 조성물.
  3. 제1항 또는 제2항 기재의 에폭시 수지 조성물을 경화시킴으로써 얻어지는 경화물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900001507A 1989-02-09 1990-02-08 반도체 봉지용 에폭시 수지 조성물 및 그 경화물 KR950005309B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP30813 1986-02-17
JP1-30813 1989-02-09
JP1030813A JPH02209949A (ja) 1989-02-09 1989-02-09 半導体封止用エポキシ樹脂組成物及び硬化物
JP1050695A JPH0645740B2 (ja) 1989-03-01 1989-03-01 半導体封止用エポキシ樹脂組成物
JP1-50695 1989-03-01
JP50695 1989-03-01

Publications (2)

Publication Number Publication Date
KR900013006A true KR900013006A (ko) 1990-09-03
KR950005309B1 KR950005309B1 (ko) 1995-05-23

Family

ID=26369222

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900001507A KR950005309B1 (ko) 1989-02-09 1990-02-08 반도체 봉지용 에폭시 수지 조성물 및 그 경화물

Country Status (3)

Country Link
US (1) US5137940A (ko)
KR (1) KR950005309B1 (ko)
DE (1) DE4003842C2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100679490B1 (ko) * 2000-12-29 2007-02-07 주식회사 케이씨씨 반도체 패키징용 에폭시 수지 조성물

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950011902B1 (ko) * 1990-04-04 1995-10-12 도오레 가부시끼가이샤 반도체 장치 캡슐 봉입 에폭시 수지 조성물
DE9013615U1 (de) * 1990-09-28 1990-12-06 AEG Niederspannungstechnik GmbH & Co KG, 24534 Neumünster Elektrolumineszenz- oder Laserdiode
JP2668289B2 (ja) * 1991-01-25 1997-10-27 ソマール 株式会社 粉体塗料用エポキシ樹脂組成物
US5362775A (en) * 1991-03-27 1994-11-08 Nippondenso Co., Ltd. Epoxy resin composition and cured product thereof
JP2816774B2 (ja) * 1991-03-29 1998-10-27 日本石油株式会社 フェノール樹脂、その樹脂の製造法および封止材用エポキシ樹脂組成物
DE4244961C2 (de) * 1991-05-23 2001-09-06 Hitachi Ltd Wärmeaushärtende Harzzusammensetzung zum Gießen einer Hochspannungsspule
JP2524011B2 (ja) * 1991-05-23 1996-08-14 株式会社日立製作所 高圧コイル注型用熱硬化性樹脂組成物、該組成物で注型、硬化してなるモ―ルドコイル、パネル
JP3359410B2 (ja) * 1994-03-04 2002-12-24 三菱電機株式会社 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法
US5719225A (en) * 1994-06-13 1998-02-17 Sumitomo Chemical Company, Ltd. Filler-containing resin composition suitable for injection molding and transfer molding
US5708056A (en) * 1995-12-04 1998-01-13 Delco Electronics Corporation Hot melt epoxy encapsulation material
ES2160928T3 (es) * 1996-03-22 2001-11-16 Vantico Ag Material para trabajar con herramientas de resina epoxi de un componente.
KR100537349B1 (ko) * 1996-06-26 2006-02-28 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 발광 변환 소자를 포함하는 발광 반도체 소자
DE19638667C2 (de) 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
JP3611066B2 (ja) 1996-08-29 2005-01-19 株式会社ルネサステクノロジ 無機質充填剤及びエポキシ樹脂組成物の製造方法
JP3445707B2 (ja) * 1996-09-18 2003-09-08 電気化学工業株式会社 シリカ質フィラー及びその製法
US6214905B1 (en) 1997-12-23 2001-04-10 Cookson Singapore Pte Ltd C/O Alpha Metals, Inc. Epoxy mold compound and method
DE19841204A1 (de) 1998-09-09 2000-03-23 Siemens Ag Anordnung mit lichtemittierendem Leistungshalbleiterbauelement sowie Verfahren zur Herstellung derselben
DE60011199T2 (de) * 1999-10-06 2004-09-30 Nitto Denko Corp., Ibaraki Harzzusammensetzung zur Einkapselung von Halbleitern, Halbleiteranordnungen die diese enthalten und Verfahren für die Herstellung von diesen Halbleiteranordnungen
DE19964252A1 (de) 1999-12-30 2002-06-06 Osram Opto Semiconductors Gmbh Oberflächenmontierbares Bauelement für eine LED-Weißlichtquelle
US6770965B2 (en) * 2000-12-28 2004-08-03 Ngk Spark Plug Co., Ltd. Wiring substrate using embedding resin
US7814641B2 (en) 2001-01-09 2010-10-19 Black & Decker Inc. Method of forming a power tool
US7096566B2 (en) * 2001-01-09 2006-08-29 Black & Decker Inc. Method for making an encapsulated coil structure
DE10131698A1 (de) * 2001-06-29 2003-01-30 Osram Opto Semiconductors Gmbh Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung
WO2003029323A1 (en) * 2001-09-28 2003-04-10 Nippon Petrochemicals Co.,Ltd. Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition
TWI281924B (en) * 2003-04-07 2007-06-01 Hitachi Chemical Co Ltd Epoxy resin molding material for sealing use and semiconductor device
ATE497626T1 (de) * 2004-07-13 2011-02-15 Areva T & D Sas Verfahren zur herstellung eines isolators für hochspannungsanwendungen
TWI366421B (en) * 2008-08-22 2012-06-11 Nanya Plastics Corp High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards
KR20100028384A (ko) * 2008-09-04 2010-03-12 삼성전기주식회사 복합체 및 그의 제조방법
US8580879B2 (en) 2009-01-06 2013-11-12 Nan Ya Plastics Corporation Resin composition of high thermal conductivity and high glass transition temperature (Tg) and for use with PCB, and prepreg and coating thereof
WO2011095208A1 (en) * 2010-02-03 2011-08-11 Abb Research Ltd Electrical insulation system
KR101092015B1 (ko) * 2011-05-03 2011-12-08 주식회사 네패스신소재 열경화형 광반사용 수지 조성물, 이의 제조 방법, 이로부터 제조된 광반도체 소자 탑재용 반사판, 및 이를 포함하는 광반도체 장치
JP6571585B2 (ja) * 2015-06-08 2019-09-04 信越化学工業株式会社 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617330A (en) * 1984-03-30 1986-10-14 Kabushiki Kaisha Toshiba Epoxy resin composition for cast molding
JPS6134052A (ja) * 1984-07-25 1986-02-18 Matsushita Electric Works Ltd 封止用一液性エポキシ樹脂組成物
JPS61143466A (ja) * 1984-12-18 1986-07-01 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPS61268750A (ja) * 1985-05-22 1986-11-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JP2938080B2 (ja) * 1988-07-22 1999-08-23 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100679490B1 (ko) * 2000-12-29 2007-02-07 주식회사 케이씨씨 반도체 패키징용 에폭시 수지 조성물

Also Published As

Publication number Publication date
KR950005309B1 (ko) 1995-05-23
US5137940A (en) 1992-08-11
DE4003842C2 (de) 1997-06-05
DE4003842A1 (de) 1990-08-16

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