KR920021646A - 표면표장 집적회로(ic)용 에폭시 성형조성물 - Google Patents
표면표장 집적회로(ic)용 에폭시 성형조성물 Download PDFInfo
- Publication number
- KR920021646A KR920021646A KR1019920007113A KR920007113A KR920021646A KR 920021646 A KR920021646 A KR 920021646A KR 1019920007113 A KR1019920007113 A KR 1019920007113A KR 920007113 A KR920007113 A KR 920007113A KR 920021646 A KR920021646 A KR 920021646A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy molding
- molding composition
- low stress
- silica
- multifunctional
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims 9
- 239000004593 Epoxy Substances 0.000 title claims 6
- 238000000465 moulding Methods 0.000 title claims 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 8
- 239000000377 silicon dioxide Substances 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 239000012530 fluid Substances 0.000 claims 2
- 239000005350 fused silica glass Substances 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 1
- 239000011802 pulverized particle Substances 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 239000012798 spherical particle Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Knives (AREA)
- Wrappers (AREA)
- Paints Or Removers (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (5)
- (a) 5-15%의 다작용기 에폭시 수지; (b) 2.5-8%의 다작용기 경화제; (c) 70-85%의, 구형 및 분쇄형 입자들 모두를 포함하는 혼합물상의 용융실리카; (d) 0.25-3%의 구형 실리콘 고무 입자들; 및 (e) 0.25-3%의 유기작용기 실리콘 유체를 포함하는, 표면표장 집적회로(IC)용 저응력 에폭시 성형 조성물.
- 제1항에 있어서, 다작용기 에폭시 수지가 트리스-페놀메탄 유도체인, 표면표장 집적회로용 저응력 에폭시 성형 조성물.
- 제1항에 있어서, 다작용기 경화제가 트리스-페놀메탄 유도체인, 표면표장 집적회로용 저응력 에폭시 성형 조성물.
- 제1항에 있어서, 용융실리카의 양이 조성물의 75wt% 이상이며 그 용융실리카가 65-85%의 구형 실리카와 15-35%의 분쇄된 실리카의 혼합물인, 표면 표장 집적회로용 저응력 에폭시 성형 조성물.
- 제1항에 있어서, 실리콘 유체가 에폭시- 및 폴리알킬렌옥시-작용기들을 모두 갖는 것인, 저응력 에폭시 성형 조성물.※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69388291A | 1991-05-01 | 1991-05-01 | |
US693,882 | 1991-05-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920021646A true KR920021646A (ko) | 1992-12-18 |
KR100234942B1 KR100234942B1 (ko) | 1999-12-15 |
Family
ID=24786516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920007113A KR100234942B1 (ko) | 1991-05-01 | 1992-04-27 | 표면 탑재 집적회로(ic)용 에폭시 성형조성물 |
Country Status (21)
Country | Link |
---|---|
US (1) | US5434199A (ko) |
EP (1) | EP0511833B1 (ko) |
JP (1) | JP3340462B2 (ko) |
KR (1) | KR100234942B1 (ko) |
CN (1) | CN1041578C (ko) |
AT (1) | ATE142370T1 (ko) |
AU (1) | AU660666B2 (ko) |
BR (1) | BR9201580A (ko) |
CA (1) | CA2066497A1 (ko) |
DE (1) | DE69213308T2 (ko) |
FI (1) | FI921981A (ko) |
IE (1) | IE921403A1 (ko) |
IL (1) | IL101664A (ko) |
MX (1) | MX9202065A (ko) |
MY (1) | MY110809A (ko) |
NO (1) | NO921632L (ko) |
NZ (1) | NZ242461A (ko) |
PH (1) | PH30678A (ko) |
SG (1) | SG38926A1 (ko) |
TW (1) | TW252138B (ko) |
ZA (1) | ZA923022B (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW398163B (en) | 1996-10-09 | 2000-07-11 | Matsushita Electric Ind Co Ltd | The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof |
JPH10195179A (ja) * | 1997-01-08 | 1998-07-28 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
SG63803A1 (en) * | 1997-01-23 | 1999-03-30 | Toray Industries | Epoxy-resin composition to seal semiconductors and resin-sealed semiconductor device |
US6214905B1 (en) | 1997-12-23 | 2001-04-10 | Cookson Singapore Pte Ltd C/O Alpha Metals, Inc. | Epoxy mold compound and method |
TW459016B (en) | 1998-03-13 | 2001-10-11 | Sumitomo Chemical Co | Epoxy resin composition and resin-encapsulated semiconductor device |
JP3479827B2 (ja) * | 1998-04-27 | 2003-12-15 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP3388537B2 (ja) * | 1998-05-15 | 2003-03-24 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
US6297306B1 (en) | 1998-05-15 | 2001-10-02 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
US6291556B1 (en) | 1999-03-26 | 2001-09-18 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
JP2000294692A (ja) * | 1999-04-06 | 2000-10-20 | Hitachi Ltd | 樹脂封止型電子装置及びその製造方法並びにそれを使用した内燃機関用点火コイル装置 |
TW538482B (en) | 1999-04-26 | 2003-06-21 | Shinetsu Chemical Co | Semiconductor encapsulating epoxy resin composition and semiconductor device |
JP4187062B2 (ja) * | 2000-08-24 | 2008-11-26 | 電気化学工業株式会社 | 金属ベース回路基板 |
KR20030096309A (ko) * | 2001-04-13 | 2003-12-24 | 이데미쓰세끼유가가꾸가부시끼가이샤 | 광통신 부품용 폴리아릴렌 설파이드 수지 조성물 |
US20040166241A1 (en) * | 2003-02-20 | 2004-08-26 | Henkel Loctite Corporation | Molding compositions containing quaternary organophosphonium salts |
JP4300418B2 (ja) * | 2004-04-30 | 2009-07-22 | 信越化学工業株式会社 | エポキシ・シリコーン混成樹脂組成物及び発光半導体装置 |
JP5396687B2 (ja) * | 2005-01-13 | 2014-01-22 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物、その製造方法及び半導体装置 |
JP5069692B2 (ja) * | 2005-11-16 | 2012-11-07 | チバ ホールディング インコーポレーテッド | 印刷回路板のための難燃性プリプレグ |
KR101133309B1 (ko) | 2006-05-12 | 2012-04-04 | 덴끼 가가꾸 고교 가부시키가이샤 | 세라믹 분말 및 그의 용도 |
JP5864828B2 (ja) | 2007-08-31 | 2016-02-17 | 東レ・ダウコーニング株式会社 | シリコーンゴムパウダーおよびその製造方法 |
JP2009057500A (ja) | 2007-08-31 | 2009-03-19 | Dow Corning Toray Co Ltd | 硬化性エポキシ樹脂組成物およびその硬化物 |
WO2013149386A1 (zh) * | 2012-04-05 | 2013-10-10 | 广东生益科技股份有限公司 | 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
US9036109B2 (en) * | 2012-08-20 | 2015-05-19 | Apple Inc. | Electronic device with thermally matched light guide plate |
CN107275018A (zh) * | 2017-05-16 | 2017-10-20 | 东莞市晴远电子有限公司 | 一种无感电阻及用于该无感电阻的高导热绝缘材料 |
US20220177700A1 (en) * | 2019-02-25 | 2022-06-09 | Kuraray Co., Ltd. | Waterproof component, electronic equipment comprising same, waterproofing method using insert-molded body, and waterproofing method for electronic equipment |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4417006A (en) * | 1981-06-08 | 1983-11-22 | Material Sciences Corporation | Organopolysiloxane coating compositions |
JPS62270617A (ja) * | 1986-05-20 | 1987-11-25 | Mitsui Toatsu Chem Inc | 半導体封止用樹脂組成物 |
KR900006033B1 (ko) * | 1987-05-30 | 1990-08-20 | 고려화학 주식회사 | 저응력화 변성제 제조방법 및 본 변성제를 함유한 반도체 봉지용 에폭시수지 조성물 |
JP2595292B2 (ja) * | 1988-03-17 | 1997-04-02 | 住友ベークライト株式会社 | 電気・電子部品封止用樹脂組成物 |
JPH01294765A (ja) * | 1988-05-20 | 1989-11-28 | Nippon Retsuku Kk | エポキシ樹脂組成物 |
JPH0229420A (ja) * | 1988-07-19 | 1990-01-31 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
JPH0232117A (ja) * | 1988-07-21 | 1990-02-01 | Mitsui Toatsu Chem Inc | 半導体封止用樹脂組成物 |
JP2660012B2 (ja) * | 1988-09-13 | 1997-10-08 | 株式会社東芝 | ゴム変性フェノール樹脂、エポキシ樹脂組成物及び樹脂封止型半導体装置 |
JP2641277B2 (ja) * | 1988-11-30 | 1997-08-13 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
JPH02182747A (ja) * | 1989-01-09 | 1990-07-17 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
JPH02212514A (ja) * | 1989-02-14 | 1990-08-23 | Sumitomo Bakelite Co Ltd | 樹脂組成物 |
JP2642470B2 (ja) * | 1989-02-23 | 1997-08-20 | 株式会社東芝 | 封止用樹脂組成物及び樹脂封止型半導体装置 |
JP2631233B2 (ja) * | 1989-03-31 | 1997-07-16 | 一夫 中野 | 往復回転運動を1方向回転運動に変換して取り出す装置 |
US5134204A (en) * | 1989-05-12 | 1992-07-28 | Mitsui Toatsu Chemicals, Inc. | Resin composition for sealing semiconductors |
JPH02302422A (ja) * | 1989-05-18 | 1990-12-14 | Mitsui Toatsu Chem Inc | 半導体封止用樹脂組成物 |
US5114991A (en) * | 1990-02-26 | 1992-05-19 | Gencorp Inc. | Paper felts or mats |
-
1992
- 1992-04-21 IL IL10166492A patent/IL101664A/en active IP Right Grant
- 1992-04-21 CA CA 2066497 patent/CA2066497A1/en not_active Abandoned
- 1992-04-22 MY MYPI92000683A patent/MY110809A/en unknown
- 1992-04-23 NZ NZ242461A patent/NZ242461A/en unknown
- 1992-04-27 ZA ZA923022A patent/ZA923022B/xx unknown
- 1992-04-27 KR KR1019920007113A patent/KR100234942B1/ko not_active IP Right Cessation
- 1992-04-28 EP EP19920303832 patent/EP0511833B1/en not_active Expired - Lifetime
- 1992-04-28 SG SG1996000789A patent/SG38926A1/en unknown
- 1992-04-28 PH PH44275A patent/PH30678A/en unknown
- 1992-04-28 NO NO92921632A patent/NO921632L/no unknown
- 1992-04-28 AT AT92303832T patent/ATE142370T1/de not_active IP Right Cessation
- 1992-04-28 DE DE1992613308 patent/DE69213308T2/de not_active Expired - Fee Related
- 1992-04-28 AU AU15195/92A patent/AU660666B2/en not_active Ceased
- 1992-04-29 BR BR9201580A patent/BR9201580A/pt active Search and Examination
- 1992-04-30 FI FI921981A patent/FI921981A/fi not_active Application Discontinuation
- 1992-04-30 CN CN92103962A patent/CN1041578C/zh not_active Expired - Fee Related
- 1992-04-30 MX MX9202065A patent/MX9202065A/es unknown
- 1992-05-01 JP JP11262492A patent/JP3340462B2/ja not_active Expired - Fee Related
- 1992-05-07 TW TW81103553A patent/TW252138B/zh active
- 1992-07-01 IE IE140392A patent/IE921403A1/en not_active IP Right Cessation
-
1994
- 1994-10-07 US US08/320,097 patent/US5434199A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE142370T1 (de) | 1996-09-15 |
TW252138B (ko) | 1995-07-21 |
BR9201580A (pt) | 1992-12-15 |
FI921981A (fi) | 1992-11-02 |
FI921981A0 (fi) | 1992-04-30 |
AU660666B2 (en) | 1995-07-06 |
CN1041578C (zh) | 1999-01-06 |
NZ242461A (en) | 1994-04-27 |
IL101664A0 (en) | 1992-12-30 |
IE921403A1 (en) | 1992-11-04 |
AU1519592A (en) | 1992-11-05 |
DE69213308T2 (de) | 1997-01-30 |
EP0511833A2 (en) | 1992-11-04 |
MY110809A (en) | 1999-05-31 |
CA2066497A1 (en) | 1992-11-02 |
MX9202065A (es) | 1992-12-01 |
US5434199A (en) | 1995-07-18 |
DE69213308D1 (de) | 1996-10-10 |
ZA923022B (en) | 1992-12-30 |
SG38926A1 (en) | 1999-09-21 |
CN1069147A (zh) | 1993-02-17 |
EP0511833A3 (en) | 1992-12-30 |
NO921632L (no) | 1992-11-02 |
IL101664A (en) | 1996-01-31 |
NO921632D0 (no) | 1992-04-28 |
JP3340462B2 (ja) | 2002-11-05 |
PH30678A (en) | 1997-09-16 |
JPH05152467A (ja) | 1993-06-18 |
EP0511833B1 (en) | 1996-09-04 |
KR100234942B1 (ko) | 1999-12-15 |
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