KR920021646A - 표면표장 집적회로(ic)용 에폭시 성형조성물 - Google Patents

표면표장 집적회로(ic)용 에폭시 성형조성물 Download PDF

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Publication number
KR920021646A
KR920021646A KR1019920007113A KR920007113A KR920021646A KR 920021646 A KR920021646 A KR 920021646A KR 1019920007113 A KR1019920007113 A KR 1019920007113A KR 920007113 A KR920007113 A KR 920007113A KR 920021646 A KR920021646 A KR 920021646A
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KR
South Korea
Prior art keywords
epoxy molding
molding composition
low stress
silica
multifunctional
Prior art date
Application number
KR1019920007113A
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English (en)
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KR100234942B1 (ko
Inventor
켄리크 갤러허 마이클
앤소니 페티 마이클
Original Assignee
원본미기재
롬 앤드 하스 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 롬 앤드 하스 캄파니 filed Critical 원본미기재
Publication of KR920021646A publication Critical patent/KR920021646A/ko
Application granted granted Critical
Publication of KR100234942B1 publication Critical patent/KR100234942B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Abstract

내용 없음

Description

표면표장 집적회로(IC)용 에폭시 성형조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. (a) 5-15%의 다작용기 에폭시 수지; (b) 2.5-8%의 다작용기 경화제; (c) 70-85%의, 구형 및 분쇄형 입자들 모두를 포함하는 혼합물상의 용융실리카; (d) 0.25-3%의 구형 실리콘 고무 입자들; 및 (e) 0.25-3%의 유기작용기 실리콘 유체를 포함하는, 표면표장 집적회로(IC)용 저응력 에폭시 성형 조성물.
  2. 제1항에 있어서, 다작용기 에폭시 수지가 트리스-페놀메탄 유도체인, 표면표장 집적회로용 저응력 에폭시 성형 조성물.
  3. 제1항에 있어서, 다작용기 경화제가 트리스-페놀메탄 유도체인, 표면표장 집적회로용 저응력 에폭시 성형 조성물.
  4. 제1항에 있어서, 용융실리카의 양이 조성물의 75wt% 이상이며 그 용융실리카가 65-85%의 구형 실리카와 15-35%의 분쇄된 실리카의 혼합물인, 표면 표장 집적회로용 저응력 에폭시 성형 조성물.
  5. 제1항에 있어서, 실리콘 유체가 에폭시- 및 폴리알킬렌옥시-작용기들을 모두 갖는 것인, 저응력 에폭시 성형 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019920007113A 1991-05-01 1992-04-27 표면 탑재 집적회로(ic)용 에폭시 성형조성물 KR100234942B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US69388291A 1991-05-01 1991-05-01
US693,882 1991-05-01

Publications (2)

Publication Number Publication Date
KR920021646A true KR920021646A (ko) 1992-12-18
KR100234942B1 KR100234942B1 (ko) 1999-12-15

Family

ID=24786516

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920007113A KR100234942B1 (ko) 1991-05-01 1992-04-27 표면 탑재 집적회로(ic)용 에폭시 성형조성물

Country Status (21)

Country Link
US (1) US5434199A (ko)
EP (1) EP0511833B1 (ko)
JP (1) JP3340462B2 (ko)
KR (1) KR100234942B1 (ko)
CN (1) CN1041578C (ko)
AT (1) ATE142370T1 (ko)
AU (1) AU660666B2 (ko)
BR (1) BR9201580A (ko)
CA (1) CA2066497A1 (ko)
DE (1) DE69213308T2 (ko)
FI (1) FI921981A (ko)
IE (1) IE921403A1 (ko)
IL (1) IL101664A (ko)
MX (1) MX9202065A (ko)
MY (1) MY110809A (ko)
NO (1) NO921632L (ko)
NZ (1) NZ242461A (ko)
PH (1) PH30678A (ko)
SG (1) SG38926A1 (ko)
TW (1) TW252138B (ko)
ZA (1) ZA923022B (ko)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW398163B (en) 1996-10-09 2000-07-11 Matsushita Electric Ind Co Ltd The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof
JPH10195179A (ja) * 1997-01-08 1998-07-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
SG63803A1 (en) * 1997-01-23 1999-03-30 Toray Industries Epoxy-resin composition to seal semiconductors and resin-sealed semiconductor device
US6214905B1 (en) 1997-12-23 2001-04-10 Cookson Singapore Pte Ltd C/O Alpha Metals, Inc. Epoxy mold compound and method
TW459016B (en) * 1998-03-13 2001-10-11 Sumitomo Chemical Co Epoxy resin composition and resin-encapsulated semiconductor device
JP3479827B2 (ja) * 1998-04-27 2003-12-15 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3388537B2 (ja) * 1998-05-15 2003-03-24 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
US6297306B1 (en) 1998-05-15 2001-10-02 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
US6291556B1 (en) 1999-03-26 2001-09-18 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
JP2000294692A (ja) * 1999-04-06 2000-10-20 Hitachi Ltd 樹脂封止型電子装置及びその製造方法並びにそれを使用した内燃機関用点火コイル装置
TW538482B (en) 1999-04-26 2003-06-21 Shinetsu Chemical Co Semiconductor encapsulating epoxy resin composition and semiconductor device
JP4187062B2 (ja) * 2000-08-24 2008-11-26 電気化学工業株式会社 金属ベース回路基板
WO2002083792A1 (fr) * 2001-04-13 2002-10-24 Idemitsu Petrochemical Co., Ltd. Composition de resine de sulfure de polyarylene pour fabrication de pieces pour transmission optique
US20040166241A1 (en) * 2003-02-20 2004-08-26 Henkel Loctite Corporation Molding compositions containing quaternary organophosphonium salts
JP4300418B2 (ja) * 2004-04-30 2009-07-22 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
CN101090944B (zh) * 2005-01-13 2012-05-30 住友电木株式会社 半导体密封用环氧树脂组合物及半导体装置
DE602006019896D1 (de) * 2005-11-16 2011-03-10 Basf Se Flammwidrige prepregs und laminate für leiterplatten
WO2007132770A1 (ja) 2006-05-12 2007-11-22 Denki Kagaku Kogyo Kabushiki Kaisha セラミックス粉末及びその用途
JP2009057500A (ja) 2007-08-31 2009-03-19 Dow Corning Toray Co Ltd 硬化性エポキシ樹脂組成物およびその硬化物
JP5864828B2 (ja) 2007-08-31 2016-02-17 東レ・ダウコーニング株式会社 シリコーンゴムパウダーおよびその製造方法
WO2013149386A1 (zh) * 2012-04-05 2013-10-10 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板
US9036109B2 (en) * 2012-08-20 2015-05-19 Apple Inc. Electronic device with thermally matched light guide plate
CN107275018A (zh) * 2017-05-16 2017-10-20 东莞市晴远电子有限公司 一种无感电阻及用于该无感电阻的高导热绝缘材料
EP3932987A4 (en) * 2019-02-25 2022-11-23 Kuraray Co., Ltd. WATERPROOF COMPONENT, ELECTRONIC EQUIPMENT COMPRISING THE SAME, WATERPROOFING METHOD USING INSERT MOLDED BODY, AND WATERPROOFING METHOD FOR ELECTRONIC EQUIPMENT

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417006A (en) * 1981-06-08 1983-11-22 Material Sciences Corporation Organopolysiloxane coating compositions
JPS62270617A (ja) * 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
KR900006033B1 (ko) * 1987-05-30 1990-08-20 고려화학 주식회사 저응력화 변성제 제조방법 및 본 변성제를 함유한 반도체 봉지용 에폭시수지 조성물
JP2595292B2 (ja) * 1988-03-17 1997-04-02 住友ベークライト株式会社 電気・電子部品封止用樹脂組成物
JPH01294765A (ja) * 1988-05-20 1989-11-28 Nippon Retsuku Kk エポキシ樹脂組成物
JPH0229420A (ja) * 1988-07-19 1990-01-31 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料
JPH0232117A (ja) * 1988-07-21 1990-02-01 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
JP2660012B2 (ja) * 1988-09-13 1997-10-08 株式会社東芝 ゴム変性フェノール樹脂、エポキシ樹脂組成物及び樹脂封止型半導体装置
JP2641277B2 (ja) * 1988-11-30 1997-08-13 住友ベークライト株式会社 エポキシ樹脂組成物
JPH02182747A (ja) * 1989-01-09 1990-07-17 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPH02212514A (ja) * 1989-02-14 1990-08-23 Sumitomo Bakelite Co Ltd 樹脂組成物
JP2642470B2 (ja) * 1989-02-23 1997-08-20 株式会社東芝 封止用樹脂組成物及び樹脂封止型半導体装置
JP2631233B2 (ja) * 1989-03-31 1997-07-16 一夫 中野 往復回転運動を１方向回転運動に変換して取り出す装置
US5134204A (en) * 1989-05-12 1992-07-28 Mitsui Toatsu Chemicals, Inc. Resin composition for sealing semiconductors
JPH02302422A (ja) * 1989-05-18 1990-12-14 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
US5114991A (en) * 1990-02-26 1992-05-19 Gencorp Inc. Paper felts or mats

Also Published As

Publication number Publication date
ZA923022B (en) 1992-12-30
NZ242461A (en) 1994-04-27
BR9201580A (pt) 1992-12-15
SG38926A1 (en) 1999-09-21
EP0511833A2 (en) 1992-11-04
JPH05152467A (ja) 1993-06-18
EP0511833A3 (en) 1992-12-30
US5434199A (en) 1995-07-18
EP0511833B1 (en) 1996-09-04
AU660666B2 (en) 1995-07-06
CA2066497A1 (en) 1992-11-02
NO921632L (no) 1992-11-02
MY110809A (en) 1999-05-31
PH30678A (en) 1997-09-16
TW252138B (ko) 1995-07-21
CN1069147A (zh) 1993-02-17
DE69213308D1 (de) 1996-10-10
AU1519592A (en) 1992-11-05
IL101664A0 (en) 1992-12-30
NO921632D0 (no) 1992-04-28
IE921403A1 (en) 1992-11-04
FI921981A0 (fi) 1992-04-30
IL101664A (en) 1996-01-31
DE69213308T2 (de) 1997-01-30
ATE142370T1 (de) 1996-09-15
KR100234942B1 (ko) 1999-12-15
FI921981A (fi) 1992-11-02
JP3340462B2 (ja) 2002-11-05
MX9202065A (es) 1992-12-01
CN1041578C (zh) 1999-01-06

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