KR890015967A - PbTiO_3 충전제에서 Ti를 Fe 및 W로 부분치환한 것을 포함하는 충전제로서의 실링 유리조성물 - Google Patents

PbTiO_3 충전제에서 Ti를 Fe 및 W로 부분치환한 것을 포함하는 충전제로서의 실링 유리조성물 Download PDF

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Publication number
KR890015967A
KR890015967A KR1019890004565A KR890004565A KR890015967A KR 890015967 A KR890015967 A KR 890015967A KR 1019890004565 A KR1019890004565 A KR 1019890004565A KR 890004565 A KR890004565 A KR 890004565A KR 890015967 A KR890015967 A KR 890015967A
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South Korea
Prior art keywords
powder
filler
glass composition
sealing glass
pbtio
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KR1019890004565A
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English (en)
Inventor
토시오 야마나까
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원본미기재
니뽄 덴끼 가라스 가부시끼가이샤
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Application filed by 원본미기재, 니뽄 덴끼 가라스 가부시끼가이샤 filed Critical 원본미기재
Publication of KR890015967A publication Critical patent/KR890015967A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/04—Particles; Flakes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Glass Compositions (AREA)

Abstract

내용 없음

Description

PbTiO3충전제에서 Ti를 Fe 및 W로 부분치환한 것을 포함하는 충전제로서의 실링 유리조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 낮은 팽창계수의 충진제분말 및 낮은 융점의 솔더 유리분말을 포함하는 혼합물로 이루어지는 전자부품내의 부재를 실링하기 위해 사용되는, 실링유리조성물에 있어서, 상기 충진제 분말이 65-75중량%의 Pbo, 10-25중량%의 TiO2, 1-10중량%의 Fe2O3, 1-12중량%의 WO3및 0-5중량%의 CaO로 구성되는 세라믹분말을 포함함을 특징으로 하는 실링유리조성물.
  2. 제 1 항에 있어서, 상기 충진제 분말이 상기 조성물 전체양의 20-50부피%임을 특징으로 하는 실링유리조성물.
  3. 제 1 항에 있어서, 상기 충진제 분말이 약 5㎛의 평균 입자크기를 갖고 있음을 특징으로 하는 실링유리조성물.
  4. 제 1 항에 있어서, 상기 혼합물이 부가적 충진제 분말로서 지르콘분말, 주석물질분말, β-유크립타이트분말, 코오디어라이트분말, 윌레마이트분말 및 뮬라이트분말의 적어도 하나를 더 포함함을 특징으로 하는 실링유리조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890004565A 1988-04-07 1989-04-07 PbTiO_3 충전제에서 Ti를 Fe 및 W로 부분치환한 것을 포함하는 충전제로서의 실링 유리조성물 KR890015967A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8690988 1988-04-07
JP63-86909 1988-04-07

Publications (1)

Publication Number Publication Date
KR890015967A true KR890015967A (ko) 1989-11-27

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ID=13899968

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890004565A KR890015967A (ko) 1988-04-07 1989-04-07 PbTiO_3 충전제에서 Ti를 Fe 및 W로 부분치환한 것을 포함하는 충전제로서의 실링 유리조성물

Country Status (3)

Country Link
US (1) US4883777A (ko)
KR (1) KR890015967A (ko)
DE (1) DE3911176A1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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DE3934971C1 (ko) * 1989-10-20 1991-01-24 Schott Glaswerke, 6500 Mainz, De
DE4344174C2 (de) * 1993-12-23 1999-07-22 Temperaturmestechnik Geraberg Temperaturfühler
US5814029A (en) * 1994-11-03 1998-09-29 Daig Corporation Guiding introducer system for use in ablation and mapping procedures in the left ventricle
JPH11510666A (ja) 1996-05-24 1999-09-14 シーメンス マツシタ コンポーネンツ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ウント コンパニコマンデイート ゲゼルシヤフト 電子デバイス、特に表面音波で作動するデバイス―ｓａｗデバイス
JP2001510109A (ja) * 1997-07-16 2001-07-31 オーチス エレベータ カンパニー レーザインプリンティングのための方法及び組成物と該方法及び該組成物を使用してインプリンティングを施された物品
EP0897897A1 (de) * 1997-08-18 1999-02-24 Siemens Aktiengesellschaft Composit-Glaslot, Verwendung eines Composit-Glaslotes und Hochtemperatur-Brennstoffzelle
DE19833252C2 (de) * 1998-07-23 2002-01-31 Schott Glas Komposit-Lotglas mit niedriger Aufschmelztemperatur, ein Füllstoff hierfür, ein Verfahren zu seiner Herstellung sowie deren Verwendung
US6218005B1 (en) 1999-04-01 2001-04-17 3M Innovative Properties Company Tapes for heat sealing substrates
DE10219951A1 (de) * 2002-05-03 2003-11-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter
DE102004021729B4 (de) * 2004-04-30 2017-01-19 Mann + Hummel Gmbh Verfahren zur Herstellung eines hochtemperaturbeständigen Hohlfasermembranmoduls
CN102070302A (zh) * 2010-11-22 2011-05-25 珠海彩珠实业有限公司 一种介质浆料用透明低熔点玻璃粉及其制备方法
DE102012206967A1 (de) * 2012-04-26 2013-10-31 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
KR102483950B1 (ko) * 2015-04-28 2023-01-03 삼성디스플레이 주식회사 디스플레이 장치 실링용 조성물, 이를 포함한 유기발광 디스플레이 장치 및 그 제조방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2548736C3 (de) * 1975-10-31 1978-05-18 Jenaer Glaswerk Schott & Gen., 6500 Mainz Composit-Passivierungsglas auf der Basis PbO-B2 Okskö-ab O3) m't einem thermischen Ausdehnungskoeffizienten (200-300 Grad C) zwischen 40 und 60 mal 10"7 / Grad C für Silicium-Halbleiterbauelemente mit Aufschmelztemperaturen von höchstens 600 Grad C
US4405722A (en) * 1979-01-23 1983-09-20 Asahi Glass Company Ltd. Sealing glass compositions
JPS59102874A (ja) * 1982-12-03 1984-06-14 岩城硝子株式会社 封着用組成物
JPS59164649A (ja) * 1983-03-11 1984-09-17 Nippon Electric Glass Co Ltd 封着用ガラス組成物
US4537863A (en) * 1983-08-10 1985-08-27 Nippon Electric Glass Company, Ltd. Low temperature sealing composition
US4522925A (en) * 1983-09-01 1985-06-11 Owens-Illinois, Inc. Sealing glass and method of making a Willemite filler therefor
JPS60204637A (ja) * 1984-03-19 1985-10-16 Nippon Electric Glass Co Ltd 低融点封着用組成物
JPS62191442A (ja) * 1986-02-17 1987-08-21 Nippon Electric Glass Co Ltd 低融点封着用組成物
JPS62256741A (ja) * 1986-04-16 1987-11-09 Nippon Electric Glass Co Ltd 封着材料

Also Published As

Publication number Publication date
DE3911176C2 (ko) 1992-09-10
DE3911176A1 (de) 1989-10-19
US4883777A (en) 1989-11-28

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