KR870009968A - 티탄산 납칼슘 충전제로 된 봉착재료 - Google Patents

티탄산 납칼슘 충전제로 된 봉착재료 Download PDF

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Publication number
KR870009968A
KR870009968A KR870003586A KR870003586A KR870009968A KR 870009968 A KR870009968 A KR 870009968A KR 870003586 A KR870003586 A KR 870003586A KR 870003586 A KR870003586 A KR 870003586A KR 870009968 A KR870009968 A KR 870009968A
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KR
South Korea
Prior art keywords
sealing material
filler
calcium titanate
lead calcium
titanate filler
Prior art date
Application number
KR870003586A
Other languages
English (en)
Other versions
KR900000624B1 (ko
Inventor
야마나까 도시오
야마꾸찌 후미오
Original Assignee
기요사꾸 기시다
니뽄 일렉트릭 글래스 컴패니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 기요사꾸 기시다, 니뽄 일렉트릭 글래스 컴패니 리미티드 filed Critical 기요사꾸 기시다
Publication of KR870009968A publication Critical patent/KR870009968A/ko
Application granted granted Critical
Publication of KR900000624B1 publication Critical patent/KR900000624B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/04—Particles; Flakes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structural Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Glass Compositions (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

내용 없음

Description

티탄산 납칼슘 충전재로 된 봉착재료
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 본 발명에 있어서 충전제로 사용된 PbTiO3의 납을 치환하는 칼슘양과 충전제와 유리를 혼합한 봉착재료의 열팽창계수와의 관계를 나타낸 곡선도.

Claims (3)

  1. 낮은 용융점과 낮은 팽창계수의 충전분말인 유리분말로 구성되어 전자부품의 밀봉부재로 사용되는 봉착재료에 있어서, 상기 충전제가 다음과 같은 화학식;
    (Pb1-mCam)TiO3(0<m≤0.40)
    을 나타내는 티탄산 납칼슘으로 반드시 구성되어 있도록 개선된 것을 특징으로 하는 봉착재료.
  2. 제1항에 있어서, 상기의 충전제가 상기의 전체양의 20-50vol%인 것을 특징으로 하는 봉착재료.
  3. 제1항에 있어서, 상기의 충전제 분말이 약 15㎛ 이하의 평균입자크기를 갖는 것을 특징으로 하는 봉착재료.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870003586A 1986-04-16 1987-04-15 티탄산 납칼슘 충전제로 된 봉착재료 KR900000624B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61087542A JPS62256741A (ja) 1986-04-16 1986-04-16 封着材料
JP87542 1986-04-16
JP61-87542 1986-04-16

Publications (2)

Publication Number Publication Date
KR870009968A true KR870009968A (ko) 1987-11-30
KR900000624B1 KR900000624B1 (ko) 1990-02-01

Family

ID=13917867

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870003586A KR900000624B1 (ko) 1986-04-16 1987-04-15 티탄산 납칼슘 충전제로 된 봉착재료

Country Status (4)

Country Link
US (1) US4710479A (ko)
JP (1) JPS62256741A (ko)
KR (1) KR900000624B1 (ko)
DE (1) DE3712569A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4883777A (en) * 1988-04-07 1989-11-28 Nippon Electric Glass Company, Limited Sealing glass composition with filler containing Fe and W partially substituted for Ti in PbTiO3 filler
US4983839A (en) * 1989-08-18 1991-01-08 The United States Of America As Represented By The Secretary Of The Army Pyroelectric materials
JP2971502B2 (ja) * 1990-03-27 1999-11-08 旭硝子株式会社 コバール封着用ガラス組成物
US5437808A (en) * 1990-11-15 1995-08-01 Lockheed Corporation Nonflammable mild odor solvent cleaner
DE69209613T2 (de) * 1991-10-24 1996-10-31 Matsushita Electric Ind Co Ltd Dielektrisches-keramisches Verbundmaterial
US5281561A (en) * 1993-02-09 1994-01-25 Dumesnil Maurice E Low temperature sealing glass composition
DE19833252C2 (de) * 1998-07-23 2002-01-31 Schott Glas Komposit-Lotglas mit niedriger Aufschmelztemperatur, ein Füllstoff hierfür, ein Verfahren zu seiner Herstellung sowie deren Verwendung
US6127005A (en) * 1999-01-08 2000-10-03 Rutgers University Method of thermally glazing an article
US6583079B1 (en) * 1999-02-19 2003-06-24 Nippon Electric Glass Co., Ltd. CRT frit capable of sealing a CRT bulb at a relatively low temperature and in a short time
US6218005B1 (en) 1999-04-01 2001-04-17 3M Innovative Properties Company Tapes for heat sealing substrates
DE10159093C1 (de) * 2001-12-01 2003-08-14 Schott Glas Verfahren zum hermetischen Einglasen einer Lichtleitfaser in eine metallische Durchführungs-Hülse und danach hergestellte hermetische Einglasung
EP1679393B1 (en) * 2003-10-14 2011-12-28 JFE Mineral Company, Ltd. Piezoelectric single crystal, piezoelectric single crystal element and method for preparation thereof
CN100345786C (zh) * 2004-07-30 2007-10-31 京东方科技集团股份有限公司 一种低熔点、低膨胀系数焊料玻璃封接粉及其制备方法
JP6409501B2 (ja) * 2014-10-28 2018-10-24 セイコーエプソン株式会社 回路装置及び電子機器
CN114249529B (zh) * 2021-12-06 2024-03-01 北京北旭电子材料有限公司 锂铝硅系填料组合物、锂铝硅系填料及其制备方法、玻璃封接材料及其应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1149303A (en) * 1966-02-04 1969-04-23 Du Pont Dielectric compositions and their use
JPS4924208A (ko) * 1972-06-30 1974-03-04
DE2548736C3 (de) * 1975-10-31 1978-05-18 Jenaer Glaswerk Schott & Gen., 6500 Mainz Composit-Passivierungsglas auf der Basis PbO-B2 Okskö-ab O3) m't einem thermischen Ausdehnungskoeffizienten (200-300 Grad C) zwischen 40 und 60 mal 10"7 / Grad C für Silicium-Halbleiterbauelemente mit Aufschmelztemperaturen von höchstens 600 Grad C
JPS5358512A (en) * 1976-11-09 1978-05-26 Asahi Glass Co Ltd Sealant composition
JPS607907B2 (ja) * 1977-07-25 1985-02-27 ソニー株式会社 スイツチングレギユレータ
US4186023A (en) * 1978-05-01 1980-01-29 Technology Glass Corporation Sealing glass composition
US4405722A (en) * 1979-01-23 1983-09-20 Asahi Glass Company Ltd. Sealing glass compositions
US4415898A (en) * 1981-06-26 1983-11-15 The United States Of America As Represented By The Secretary Of The Navy Method of determining the material composition of a dielectrically coated radar target/obstacle
US4365021A (en) * 1981-07-22 1982-12-21 Owens-Illinois, Inc. Low temperature sealant glass

Also Published As

Publication number Publication date
JPH0428658B2 (ko) 1992-05-14
DE3712569C2 (ko) 1991-10-31
JPS62256741A (ja) 1987-11-09
KR900000624B1 (ko) 1990-02-01
DE3712569A1 (de) 1987-10-29
US4710479A (en) 1987-12-01

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