JPS5580738A - Seal bonding material - Google Patents

Seal bonding material

Info

Publication number
JPS5580738A
JPS5580738A JP15163378A JP15163378A JPS5580738A JP S5580738 A JPS5580738 A JP S5580738A JP 15163378 A JP15163378 A JP 15163378A JP 15163378 A JP15163378 A JP 15163378A JP S5580738 A JPS5580738 A JP S5580738A
Authority
JP
Japan
Prior art keywords
quartz glass
bonding material
dispersed
seal bonding
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15163378A
Other languages
Japanese (ja)
Inventor
Kazuo Okano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15163378A priority Critical patent/JPS5580738A/en
Publication of JPS5580738A publication Critical patent/JPS5580738A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide a seal bonding material of low permittivity for a semiconductor element, which material is protected from deterioration in insulation resistance since no alkali ion is contained, by dispersing fine quartz glass particles in low m.p. glass based on PbO and contg. B2O3, SiO2, Al2O3, etc.
CONSTITUTION: 40W150vol% Quartz glass particles of 50μm or less in average diameter are dispersed in low m.p. glass contg., by wt., PbO 70W90%, B2O3 8W 20% and SiO2+Al2O3 1W10%, the total amt. of them being 90% or more. Thus, a seal bonding material for a semiconductor element, etc. is obtd. The thermal expansion coefficient of the resulting material depends upon the amt. of quartz glass particles dispersed. In order to match the coefficient with an alumina ceramic substrate, about 20wt% quartz glass is dispersed.
COPYRIGHT: (C)1980,JPO&Japio
JP15163378A 1978-12-07 1978-12-07 Seal bonding material Pending JPS5580738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15163378A JPS5580738A (en) 1978-12-07 1978-12-07 Seal bonding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15163378A JPS5580738A (en) 1978-12-07 1978-12-07 Seal bonding material

Publications (1)

Publication Number Publication Date
JPS5580738A true JPS5580738A (en) 1980-06-18

Family

ID=15522800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15163378A Pending JPS5580738A (en) 1978-12-07 1978-12-07 Seal bonding material

Country Status (1)

Country Link
JP (1) JPS5580738A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05132365A (en) * 1991-11-12 1993-05-28 Ngk Insulators Ltd Cemented ceramic and method for cementing
JPH05132367A (en) * 1991-11-12 1993-05-28 Ngk Insulators Ltd Inorganic cementing material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05132365A (en) * 1991-11-12 1993-05-28 Ngk Insulators Ltd Cemented ceramic and method for cementing
JPH05132367A (en) * 1991-11-12 1993-05-28 Ngk Insulators Ltd Inorganic cementing material

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