DE68924521D1 - Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen. - Google Patents

Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen.

Info

Publication number
DE68924521D1
DE68924521D1 DE68924521T DE68924521T DE68924521D1 DE 68924521 D1 DE68924521 D1 DE 68924521D1 DE 68924521 T DE68924521 T DE 68924521T DE 68924521 T DE68924521 T DE 68924521T DE 68924521 D1 DE68924521 D1 DE 68924521D1
Authority
DE
Germany
Prior art keywords
pct
epoxy resin
sealing semiconductor
compositions
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68924521T
Other languages
English (en)
Other versions
DE68924521T2 (de
Inventor
Myung Kim
Ju Song
Jung Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Corp
Original Assignee
Lucky Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucky Ltd filed Critical Lucky Ltd
Publication of DE68924521D1 publication Critical patent/DE68924521D1/de
Application granted granted Critical
Publication of DE68924521T2 publication Critical patent/DE68924521T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE68924521T 1988-02-15 1989-02-15 Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen. Expired - Fee Related DE68924521T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019880001572A KR910008560B1 (ko) 1988-02-15 1988-02-15 반도체 봉지용 에폭시 수지 조성물
PCT/KR1989/000003 WO1989007627A1 (en) 1988-02-15 1989-02-15 Epoxy resin compositions for sealing semiconductor devices

Publications (2)

Publication Number Publication Date
DE68924521D1 true DE68924521D1 (de) 1995-11-16
DE68924521T2 DE68924521T2 (de) 1996-05-30

Family

ID=19272256

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68924521T Expired - Fee Related DE68924521T2 (de) 1988-02-15 1989-02-15 Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen.

Country Status (7)

Country Link
US (1) US5041474A (de)
EP (1) EP0372017B1 (de)
JP (1) JPH066626B2 (de)
KR (1) KR910008560B1 (de)
AT (1) ATE129000T1 (de)
DE (1) DE68924521T2 (de)
WO (1) WO1989007627A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082880A (en) * 1988-09-12 1992-01-21 Mitsui Toatsu Chemicals, Inc. Semiconductor sealing composition containing epoxy resin and polymaleimide
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
US5180627A (en) * 1990-11-30 1993-01-19 Ube Industries, Ltd. Heat resistant adhesive composition
KR960010844B1 (ko) * 1991-07-11 1996-08-09 제일모직 주식회사 내열성이 향상된 반도체소자 밀봉용 수지조성물
GB2279958B (en) * 1993-07-13 1997-11-05 Kobe Steel Europ Ltd Siloxane-imide block copolymers for toughening epoxy resins
US5736619A (en) * 1995-04-21 1998-04-07 Ameron International Corporation Phenolic resin compositions with improved impact resistance
US5708056A (en) * 1995-12-04 1998-01-13 Delco Electronics Corporation Hot melt epoxy encapsulation material
US6143423A (en) * 1997-04-07 2000-11-07 Shin-Etsu Chemical Co., Ltd. Flame retardant epoxy resin compositions
JP3723483B2 (ja) * 2001-10-16 2005-12-07 日本電気株式会社 電子部品装置
JP4793565B2 (ja) * 2005-03-24 2011-10-12 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
DE102005046641B4 (de) 2005-09-29 2019-08-22 Tib Chemicals Ag Verfahren zum Schutz der Aussenflächen von metallischen Werkstoffen gegen Korrosion durch Beschichtung mit härtbaren Mischungen auf der Basis von Glycidylverbindungen und aminischen Härtern
DE102005046642B4 (de) 2005-09-29 2019-08-22 Tib Chemicals Ag Verfahren zum Schutz der Innenflächen von metallischen Bauteilen gegen Korrosion
CN102108184B (zh) * 2009-12-24 2015-04-22 汉高股份有限及两合公司 一种环氧树脂组合物及其应用
JP6147561B2 (ja) * 2012-06-26 2017-06-14 株式会社日本触媒 硬化性樹脂組成物及び封止材
DE102017215298A1 (de) * 2017-09-01 2019-03-07 Robert Bosch Gmbh Verbundwerkstoff und Verfahren zu seiner Herstellung
CN110183823A (zh) * 2019-06-25 2019-08-30 苏州宇希新材料科技有限公司 一种高韧性环氧树脂组合物
CN110183822A (zh) * 2019-06-25 2019-08-30 苏州宇希新材料科技有限公司 一种高韧性环氧树脂组合物的制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1528203A (en) * 1974-10-18 1978-10-11 Matsushita Electric Ind Co Ltd Epoxy composition for encasing semi-conductor devices
JPS56136816A (en) * 1980-03-31 1981-10-26 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS56160054A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device
USRE32958E (en) * 1983-11-28 1989-06-20 Toray Silicone Co., Ltd. Thermosetting epoxy resin compositions
US4511701A (en) * 1984-02-27 1985-04-16 General Electric Company Heat curable epoxy resin compositions and epoxy resin curing agents
US4654382A (en) * 1984-06-08 1987-03-31 The Yokohama Rubber Co., Ltd. Adhesive compositions
JPS61271319A (ja) * 1985-05-24 1986-12-01 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JPS62101054A (ja) * 1985-10-28 1987-05-11 Nitto Electric Ind Co Ltd 半導体装置
JPS62210655A (ja) * 1986-03-11 1987-09-16 Nitto Electric Ind Co Ltd 半導体装置
JPS6337118A (ja) * 1986-07-31 1988-02-17 Sumitomo Chem Co Ltd 半導体封止用エポキシ樹脂組成物
FR2612195B1 (fr) * 1987-03-10 1989-06-16 Rhone Poulenc Chimie Polymeres thermostables a base de maleimides dont eventuellement un bismaleimide siloxane et de diamines siloxanes et leurs procedes de preparation
US4847154A (en) * 1987-05-29 1989-07-11 Basf Corporation Thermosetting resin systems containing secondary amine-terminated siloxane modifiers
US4808686A (en) * 1987-06-18 1989-02-28 General Electric Company Silicone-polyimides, and method for making
JPH01272619A (ja) * 1987-07-22 1989-10-31 Mitsubishi Gas Chem Co Inc エポキシ樹脂組成物
JPH01121319A (ja) * 1987-11-06 1989-05-15 Hitachi Ltd 半導体封止用エポキシ樹脂組成物及び樹脂封止型半導体装置

Also Published As

Publication number Publication date
EP0372017A4 (en) 1991-10-30
WO1989007627A1 (en) 1989-08-24
EP0372017B1 (de) 1995-10-11
KR910008560B1 (ko) 1991-10-19
KR890013755A (ko) 1989-09-25
US5041474A (en) 1991-08-20
ATE129000T1 (de) 1995-10-15
DE68924521T2 (de) 1996-05-30
EP0372017A1 (de) 1990-06-13
JPH066626B2 (ja) 1994-01-26
JPH02500315A (ja) 1990-02-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee