DE69941409D1 - Flammhemmende Harzzusammensetzung und die daraus hergestellte Halbleitervorrichtung - Google Patents

Flammhemmende Harzzusammensetzung und die daraus hergestellte Halbleitervorrichtung

Info

Publication number
DE69941409D1
DE69941409D1 DE69941409T DE69941409T DE69941409D1 DE 69941409 D1 DE69941409 D1 DE 69941409D1 DE 69941409 T DE69941409 T DE 69941409T DE 69941409 T DE69941409 T DE 69941409T DE 69941409 D1 DE69941409 D1 DE 69941409D1
Authority
DE
Germany
Prior art keywords
cured article
composition
resin composition
flame retardant
inorganic filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69941409T
Other languages
English (en)
Inventor
Yukihiro Kiuchi
Masatoshi Iji
Katsushi Terajima
Isao Katayama
Yasuo Matsui
Ken Ota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Sumitomo Bakelite Co Ltd
Original Assignee
NEC Corp
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Sumitomo Bakelite Co Ltd filed Critical NEC Corp
Application granted granted Critical
Publication of DE69941409D1 publication Critical patent/DE69941409D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69941409T 1998-10-21 1999-10-20 Flammhemmende Harzzusammensetzung und die daraus hergestellte Halbleitervorrichtung Expired - Lifetime DE69941409D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29960698A JP3349963B2 (ja) 1998-10-21 1998-10-21 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置

Publications (1)

Publication Number Publication Date
DE69941409D1 true DE69941409D1 (de) 2009-10-22

Family

ID=17874818

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69941409T Expired - Lifetime DE69941409D1 (de) 1998-10-21 1999-10-20 Flammhemmende Harzzusammensetzung und die daraus hergestellte Halbleitervorrichtung
DE69934716T Active DE69934716T8 (de) 1998-10-21 1999-10-20 Flammhemmende harzzusammensetzung und die daraus hergestellte halbleitervorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69934716T Active DE69934716T8 (de) 1998-10-21 1999-10-20 Flammhemmende harzzusammensetzung und die daraus hergestellte halbleitervorrichtung

Country Status (9)

Country Link
US (2) US7098276B1 (de)
EP (2) EP1142923B1 (de)
JP (1) JP3349963B2 (de)
KR (1) KR100443110B1 (de)
AT (2) ATE442394T1 (de)
DE (2) DE69941409D1 (de)
MY (1) MY145752A (de)
TW (1) TWI225074B (de)
WO (1) WO2000023494A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3349963B2 (ja) 1998-10-21 2002-11-25 日本電気株式会社 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置
JP3460820B2 (ja) * 1999-12-08 2003-10-27 日本電気株式会社 難燃性エポキシ樹脂組成物
JP4743932B2 (ja) * 2000-02-17 2011-08-10 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2002012741A (ja) * 2000-06-27 2002-01-15 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4742414B2 (ja) * 2000-10-04 2011-08-10 住友ベークライト株式会社 半導体装置
JP2002226557A (ja) * 2001-01-30 2002-08-14 Dainippon Ink & Chem Inc 難燃性エポキシ樹脂組成物
JP2003268079A (ja) * 2002-03-18 2003-09-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4251612B2 (ja) * 2003-01-30 2009-04-08 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． エポキシ含有物質を含むネガ型感光性樹脂組成物
JP4397601B2 (ja) * 2003-02-06 2010-01-13 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． フェノール−ビフェニレン樹脂を含むネガ型感光性樹脂組成物
US7300796B2 (en) * 2003-09-09 2007-11-27 International Business Machines Corporation Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging
JP5170493B2 (ja) 2005-10-14 2013-03-27 エア・ウォーター株式会社 フェノール系重合体、その製法及びその用途
JPWO2010053207A1 (ja) * 2008-11-07 2012-04-05 住友ベークライト株式会社 感光性樹脂組成物、感光性接着フィルムおよび受光装置
JP6124865B2 (ja) 2012-02-23 2017-05-10 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
KR101385005B1 (ko) * 2012-04-25 2014-04-16 국도화학 주식회사 에폭시몰딩컴파운드용 자기소화성 에폭시 수지 및 그 제법, 에폭시몰딩컴파운드용 에폭시 수지 조성물
JP6406847B2 (ja) 2014-03-26 2018-10-17 新日鉄住金化学株式会社 変性多価ヒドロキシ樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP6546527B2 (ja) 2015-04-27 2019-07-17 エア・ウォーター株式会社 組成物、エポキシ樹脂硬化剤、エポキシ樹脂組成物、熱硬化性組成物、硬化物、半導体装置、および層間絶縁材料
JP6867894B2 (ja) 2017-06-22 2021-05-12 エア・ウォーター株式会社 組成物、エポキシ樹脂硬化剤、エポキシ樹脂組成物、熱硬化性組成物、硬化物、半導体装置、および層間絶縁材料

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5738814A (en) * 1980-08-20 1982-03-03 Mitsubishi Petrochem Co Ltd Production of polyepoxy compound
JPS58150581A (ja) * 1982-03-02 1983-09-07 Mitsubishi Petrochem Co Ltd ポリエポキシ化合物の製造方法
JPH0788418B2 (ja) * 1987-05-08 1995-09-27 宇部興産株式会社 エポキシ樹脂組成物
JP2568584B2 (ja) * 1987-10-15 1997-01-08 日東電工株式会社 半導体装置
JP2843612B2 (ja) * 1989-09-21 1999-01-06 東レ・ダウコーニング・シリコーン株式会社 エポキシ樹脂組成物
JPH03210322A (ja) * 1990-01-11 1991-09-13 Toshiba Chem Corp 封止用樹脂組成物および半導体装置
JP2823633B2 (ja) * 1990-02-20 1998-11-11 住友ベークライト株式会社 エポキシ樹脂組成物
KR950011902B1 (ko) 1990-04-04 1995-10-12 도오레 가부시끼가이샤 반도체 장치 캡슐 봉입 에폭시 수지 조성물
JPH08333428A (ja) 1990-07-10 1996-12-17 Mitsui Toatsu Chem Inc 低軟化点フェニルフェノールアラルキル樹脂およびその樹脂を用いたエポキシ樹脂組成物
JP3205566B2 (ja) 1991-02-08 2001-09-04 新日鐵化学株式会社 多官能エポキシ樹脂及びその製造方法
JPH04258624A (ja) * 1991-02-09 1992-09-14 Toshiba Chem Corp 封止用樹脂組成物及び半導体封止装置
JP2922672B2 (ja) 1991-05-08 1999-07-26 日東電工株式会社 半導体装置の製法
JPH0597965A (ja) 1991-10-04 1993-04-20 Mitsui Toatsu Chem Inc エポキシ樹脂組成物
JPH0597970A (ja) * 1991-10-07 1993-04-20 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
JP2978313B2 (ja) 1991-11-15 1999-11-15 日東電工株式会社 半導体装置およびそれに用いる半導体封止用エポキシ樹脂組成物
JP3147317B2 (ja) 1991-12-24 2001-03-19 三井化学株式会社 エポキシ樹脂組成物
DE69307442T2 (de) * 1992-09-21 1997-08-21 Sumitomo Bakelite Co Epoxidharzzusammensetzung auf Basis des Diglycidylethers von Biphenyldiol
US5416138A (en) * 1992-09-24 1995-05-16 Sumitomo Bakelite Company Limited Epoxy resin composition
JP2948056B2 (ja) 1993-05-12 1999-09-13 住金ケミカル株式会社 半導体封止用樹脂組成物
JP3010110B2 (ja) 1993-11-04 2000-02-14 日東電工株式会社 半導体装置
JPH07153873A (ja) 1993-11-26 1995-06-16 Nitto Denko Corp 半導体装置
JPH07196772A (ja) * 1993-12-30 1995-08-01 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
JPH07216059A (ja) 1994-01-26 1995-08-15 Mitsui Toatsu Chem Inc エポキシ樹脂組成物およびこれを用いた半導体装置
JP3305097B2 (ja) * 1994-03-02 2002-07-22 住友ベークライト株式会社 エポキシ樹脂組成物
EP0749996B1 (de) * 1995-01-05 2004-08-18 Sumitomo Bakelite Co., Ltd. Epoxyharzzusammensetzung
JP3632936B2 (ja) * 1995-01-18 2005-03-30 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2896634B2 (ja) * 1995-03-02 1999-05-31 富士ゼロックス株式会社 全文登録語検索装置および全文登録語検索方法
JPH08301984A (ja) 1995-03-09 1996-11-19 Toray Ind Inc 半導体封止用エポキシ樹脂組成物および半導体装置
JPH08245754A (ja) * 1995-03-13 1996-09-24 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JPH08253551A (ja) * 1995-03-14 1996-10-01 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JPH093161A (ja) * 1995-06-20 1997-01-07 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JP3573530B2 (ja) * 1995-06-22 2004-10-06 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物およびその硬化物
WO1997003129A1 (en) * 1995-07-10 1997-01-30 Toray Industries, Inc. Epoxy resin composition
JPH09208808A (ja) 1996-02-07 1997-08-12 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JPH09268219A (ja) * 1996-03-29 1997-10-14 Nippon Kayaku Co Ltd ノボラック型樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP3611002B2 (ja) 1996-08-08 2005-01-19 信越化学工業株式会社 エポキシ樹脂組成物、その製造方法及び半導体装置
JP3618182B2 (ja) 1996-10-29 2005-02-09 日東電工株式会社 半導体封止用エポキシ樹脂組成物
JP3649540B2 (ja) * 1996-12-27 2005-05-18 住友ベークライト株式会社 エポキシ樹脂組成物
US6054222A (en) * 1997-02-20 2000-04-25 Kabushiki Kaisha Toshiba Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet
JP3806222B2 (ja) * 1997-04-18 2006-08-09 新日鐵化学株式会社 エポキシ樹脂組成物及びその硬化物
JP3074155B2 (ja) 1997-10-20 2000-08-07 日東電工株式会社 半導体装置
JPH11140277A (ja) * 1997-11-10 1999-05-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びこれを用いた半導体装置
JPH11140166A (ja) * 1997-11-11 1999-05-25 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3388537B2 (ja) * 1998-05-15 2003-03-24 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2000103839A (ja) 1998-09-25 2000-04-11 Matsushita Electric Works Ltd 封止用樹脂組成物及び半導体装置
JP3349963B2 (ja) 1998-10-21 2002-11-25 日本電気株式会社 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置
JP4421810B2 (ja) 2002-06-24 2010-02-24 日本電気株式会社 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置

Also Published As

Publication number Publication date
US7799852B2 (en) 2010-09-21
EP1142923A4 (de) 2002-06-26
ATE350411T1 (de) 2007-01-15
DE69934716T2 (de) 2007-10-25
DE69934716D1 (de) 2007-02-15
DE69934716T8 (de) 2008-04-30
EP1739112B1 (de) 2009-09-09
US7098276B1 (en) 2006-08-29
ATE442394T1 (de) 2009-09-15
MY145752A (en) 2012-03-30
KR100443110B1 (ko) 2004-08-04
TWI225074B (en) 2004-12-11
KR20010080252A (ko) 2001-08-22
US20060247393A1 (en) 2006-11-02
JP3349963B2 (ja) 2002-11-25
WO2000023494A1 (en) 2000-04-27
EP1739112A1 (de) 2007-01-03
JP2000129092A (ja) 2000-05-09
EP1142923B1 (de) 2007-01-03
EP1142923A1 (de) 2001-10-10

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