TW200615325A - Epoxy resin molding material for encapsulation and electronic components and devices - Google Patents

Epoxy resin molding material for encapsulation and electronic components and devices

Info

Publication number
TW200615325A
TW200615325A TW094145120A TW94145120A TW200615325A TW 200615325 A TW200615325 A TW 200615325A TW 094145120 A TW094145120 A TW 094145120A TW 94145120 A TW94145120 A TW 94145120A TW 200615325 A TW200615325 A TW 200615325A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
encapsulation
devices
electronic components
borate
Prior art date
Application number
TW094145120A
Other languages
Chinese (zh)
Inventor
Ryouichi Ikezawa
Hidenori Abe
Masanobu Fujii
Tomohiro Hayashi
Tomohiro Miyata
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200615325A publication Critical patent/TW200615325A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The purpose of the present invention is to provide an epoxy resin molding material for encapsulation comprising (A) an epoxy resin, (B) a curing agent, and (C) a borate flame retardant as the essential components, wherein the borate flame retardant (C) is (C1) an anhydrous borate salt, (C2) zinc borate, or (C3) anhydrous zinc borate; and electronic components or devices comprising elements encapsulated with the material. The invention provides a non-halogen and non-antimony epoxy resin material for encapsulation which is improved in flame retardance without impairing the reliability of molding properties, fluidity, moisture resistance and so on; and electronic components or devices comprising elements encapsulated with the material.
TW094145120A 2002-03-22 2002-12-13 Epoxy resin molding material for encapsulation and electronic components and devices TW200615325A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002081347 2002-03-22
JP2002081363 2002-03-22
JP2002081386 2002-03-22

Publications (1)

Publication Number Publication Date
TW200615325A true TW200615325A (en) 2006-05-16

Family

ID=28457572

Family Applications (2)

Application Number Title Priority Date Filing Date
TW91136181A TW200304472A (en) 2002-03-22 2002-12-13 Epoxy resin molding material for encapsulation and electronic components and devices
TW094145120A TW200615325A (en) 2002-03-22 2002-12-13 Epoxy resin molding material for encapsulation and electronic components and devices

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW91136181A TW200304472A (en) 2002-03-22 2002-12-13 Epoxy resin molding material for encapsulation and electronic components and devices

Country Status (4)

Country Link
JP (1) JPWO2003080726A1 (en)
AU (1) AU2002354468A1 (en)
TW (2) TW200304472A (en)
WO (1) WO2003080726A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006006592A1 (en) * 2004-07-13 2006-01-19 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing and electronic component device
JP4977973B2 (en) * 2004-07-13 2012-07-18 日立化成工業株式会社 Epoxy resin molding material for sealing and electronic component device
JP4984474B2 (en) * 2005-09-30 2012-07-25 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
JP4867339B2 (en) * 2005-12-28 2012-02-01 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
CN116598054B (en) * 2023-07-18 2023-09-12 创进电缆有限公司 High-flame-retardance fireproof cable and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5342553A (en) * 1991-11-22 1994-08-30 U. S. Borax Inc. Process of making zinc borate and fire-retarding compositions thereof
WO1997024402A1 (en) * 1995-12-28 1997-07-10 Toray Industries, Inc. Epoxy resin composition
JPH11124480A (en) * 1997-10-24 1999-05-11 Matsushita Electric Works Ltd Resin composition for sealing semiconductor and its production, and semiconductor system using the resin composition for sealing semiconductor
JP2001131393A (en) * 1999-10-29 2001-05-15 Hitachi Chem Co Ltd Epoxy resin molding material for sealing and electronic part device
JP2001181522A (en) * 1999-12-28 2001-07-03 Matsushita Electric Works Ltd Thermoplastic resin composition, its production method, and molded article
JP2001335708A (en) * 2000-05-26 2001-12-04 Matsushita Electric Works Ltd Thermoplastic resin composition, method for producing the same, and package for enclosing semiconductor element
JP2002038005A (en) * 2000-07-26 2002-02-06 Matsushita Electric Works Ltd Thermoplastic resin composition, method for manufacturing the same, and semiconductor element housing package

Also Published As

Publication number Publication date
WO2003080726A1 (en) 2003-10-02
AU2002354468A1 (en) 2003-10-08
JPWO2003080726A1 (en) 2005-07-21
TW200304472A (en) 2003-10-01

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