ATE442394T1 - Flammhemmende harzzusammensetzung und die daraus hergestellte halbleitervorrichtung - Google Patents
Flammhemmende harzzusammensetzung und die daraus hergestellte halbleitervorrichtungInfo
- Publication number
- ATE442394T1 ATE442394T1 AT06018889T AT06018889T ATE442394T1 AT E442394 T1 ATE442394 T1 AT E442394T1 AT 06018889 T AT06018889 T AT 06018889T AT 06018889 T AT06018889 T AT 06018889T AT E442394 T1 ATE442394 T1 AT E442394T1
- Authority
- AT
- Austria
- Prior art keywords
- cured article
- composition
- resin composition
- flame retardant
- inorganic filler
- Prior art date
Links
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title abstract 2
- 239000003063 flame retardant Substances 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000011342 resin composition Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 abstract 5
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 239000011256 inorganic filler Substances 0.000 abstract 3
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 238000005979 thermal decomposition reaction Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29960698A JP3349963B2 (ja) | 1998-10-21 | 1998-10-21 | 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE442394T1 true ATE442394T1 (de) | 2009-09-15 |
Family
ID=17874818
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT99949323T ATE350411T1 (de) | 1998-10-21 | 1999-10-20 | Flammhemmende harzzusammensetzung und die daraus hergestellte halbleitervorrichtung |
| AT06018889T ATE442394T1 (de) | 1998-10-21 | 1999-10-20 | Flammhemmende harzzusammensetzung und die daraus hergestellte halbleitervorrichtung |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT99949323T ATE350411T1 (de) | 1998-10-21 | 1999-10-20 | Flammhemmende harzzusammensetzung und die daraus hergestellte halbleitervorrichtung |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US7098276B1 (de) |
| EP (2) | EP1142923B1 (de) |
| JP (1) | JP3349963B2 (de) |
| KR (1) | KR100443110B1 (de) |
| AT (2) | ATE350411T1 (de) |
| DE (2) | DE69934716T8 (de) |
| MY (1) | MY145752A (de) |
| TW (1) | TWI225074B (de) |
| WO (1) | WO2000023494A1 (de) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3349963B2 (ja) | 1998-10-21 | 2002-11-25 | 日本電気株式会社 | 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置 |
| JP3460820B2 (ja) | 1999-12-08 | 2003-10-27 | 日本電気株式会社 | 難燃性エポキシ樹脂組成物 |
| JP4743932B2 (ja) * | 2000-02-17 | 2011-08-10 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2002012741A (ja) * | 2000-06-27 | 2002-01-15 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP4742414B2 (ja) * | 2000-10-04 | 2011-08-10 | 住友ベークライト株式会社 | 半導体装置 |
| JP2002226557A (ja) * | 2001-01-30 | 2002-08-14 | Dainippon Ink & Chem Inc | 難燃性エポキシ樹脂組成物 |
| JP2003268079A (ja) * | 2002-03-18 | 2003-09-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP4251612B2 (ja) * | 2003-01-30 | 2009-04-08 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | エポキシ含有物質を含むネガ型感光性樹脂組成物 |
| JP4397601B2 (ja) * | 2003-02-06 | 2010-01-13 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | フェノール−ビフェニレン樹脂を含むネガ型感光性樹脂組成物 |
| US7300796B2 (en) * | 2003-09-09 | 2007-11-27 | International Business Machines Corporation | Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging |
| JP5170493B2 (ja) | 2005-10-14 | 2013-03-27 | エア・ウォーター株式会社 | フェノール系重合体、その製法及びその用途 |
| US20110221017A1 (en) * | 2008-11-07 | 2011-09-15 | Sumitomo Bakelite Company, Ltd. | Photosensitive resin composition, photosensitive adhesive film, and light-receiving device |
| SG11201405075SA (en) | 2012-02-23 | 2014-10-30 | Nippon Steel & Sumikin Chem Co | Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof |
| KR101385005B1 (ko) | 2012-04-25 | 2014-04-16 | 국도화학 주식회사 | 에폭시몰딩컴파운드용 자기소화성 에폭시 수지 및 그 제법, 에폭시몰딩컴파운드용 에폭시 수지 조성물 |
| JP6406847B2 (ja) | 2014-03-26 | 2018-10-17 | 新日鉄住金化学株式会社 | 変性多価ヒドロキシ樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
| JP6546527B2 (ja) | 2015-04-27 | 2019-07-17 | エア・ウォーター株式会社 | 組成物、エポキシ樹脂硬化剤、エポキシ樹脂組成物、熱硬化性組成物、硬化物、半導体装置、および層間絶縁材料 |
| JP6867894B2 (ja) | 2017-06-22 | 2021-05-12 | エア・ウォーター株式会社 | 組成物、エポキシ樹脂硬化剤、エポキシ樹脂組成物、熱硬化性組成物、硬化物、半導体装置、および層間絶縁材料 |
Family Cites Families (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5738814A (en) * | 1980-08-20 | 1982-03-03 | Mitsubishi Petrochem Co Ltd | Production of polyepoxy compound |
| JPS58150581A (ja) * | 1982-03-02 | 1983-09-07 | Mitsubishi Petrochem Co Ltd | ポリエポキシ化合物の製造方法 |
| JPH0788418B2 (ja) * | 1987-05-08 | 1995-09-27 | 宇部興産株式会社 | エポキシ樹脂組成物 |
| JP2568584B2 (ja) * | 1987-10-15 | 1997-01-08 | 日東電工株式会社 | 半導体装置 |
| JP2843612B2 (ja) * | 1989-09-21 | 1999-01-06 | 東レ・ダウコーニング・シリコーン株式会社 | エポキシ樹脂組成物 |
| JPH03210322A (ja) * | 1990-01-11 | 1991-09-13 | Toshiba Chem Corp | 封止用樹脂組成物および半導体装置 |
| JP2823633B2 (ja) * | 1990-02-20 | 1998-11-11 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
| KR950011902B1 (ko) | 1990-04-04 | 1995-10-12 | 도오레 가부시끼가이샤 | 반도체 장치 캡슐 봉입 에폭시 수지 조성물 |
| JPH08333428A (ja) | 1990-07-10 | 1996-12-17 | Mitsui Toatsu Chem Inc | 低軟化点フェニルフェノールアラルキル樹脂およびその樹脂を用いたエポキシ樹脂組成物 |
| JP3205566B2 (ja) | 1991-02-08 | 2001-09-04 | 新日鐵化学株式会社 | 多官能エポキシ樹脂及びその製造方法 |
| JPH04258624A (ja) * | 1991-02-09 | 1992-09-14 | Toshiba Chem Corp | 封止用樹脂組成物及び半導体封止装置 |
| JP2922672B2 (ja) | 1991-05-08 | 1999-07-26 | 日東電工株式会社 | 半導体装置の製法 |
| JPH0597965A (ja) | 1991-10-04 | 1993-04-20 | Mitsui Toatsu Chem Inc | エポキシ樹脂組成物 |
| JPH0597970A (ja) * | 1991-10-07 | 1993-04-20 | Shin Etsu Chem Co Ltd | 熱硬化性樹脂組成物及び半導体装置 |
| JP2978313B2 (ja) | 1991-11-15 | 1999-11-15 | 日東電工株式会社 | 半導体装置およびそれに用いる半導体封止用エポキシ樹脂組成物 |
| JP3147317B2 (ja) | 1991-12-24 | 2001-03-19 | 三井化学株式会社 | エポキシ樹脂組成物 |
| DE69307442T2 (de) * | 1992-09-21 | 1997-08-21 | Sumitomo Bakelite Co | Epoxidharzzusammensetzung auf Basis des Diglycidylethers von Biphenyldiol |
| US5416138A (en) * | 1992-09-24 | 1995-05-16 | Sumitomo Bakelite Company Limited | Epoxy resin composition |
| JP2948056B2 (ja) | 1993-05-12 | 1999-09-13 | 住金ケミカル株式会社 | 半導体封止用樹脂組成物 |
| JP3010110B2 (ja) | 1993-11-04 | 2000-02-14 | 日東電工株式会社 | 半導体装置 |
| JPH07153873A (ja) | 1993-11-26 | 1995-06-16 | Nitto Denko Corp | 半導体装置 |
| JPH07196772A (ja) * | 1993-12-30 | 1995-08-01 | Hitachi Chem Co Ltd | 電子部品封止用エポキシ樹脂成形材料 |
| JPH07216059A (ja) | 1994-01-26 | 1995-08-15 | Mitsui Toatsu Chem Inc | エポキシ樹脂組成物およびこれを用いた半導体装置 |
| JP3305097B2 (ja) * | 1994-03-02 | 2002-07-22 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
| AU4356196A (en) * | 1995-01-05 | 1996-07-24 | Toray Industries, Inc. | Epoxy resin compound |
| JP3632936B2 (ja) * | 1995-01-18 | 2005-03-30 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP2896634B2 (ja) * | 1995-03-02 | 1999-05-31 | 富士ゼロックス株式会社 | 全文登録語検索装置および全文登録語検索方法 |
| JPH08301984A (ja) | 1995-03-09 | 1996-11-19 | Toray Ind Inc | 半導体封止用エポキシ樹脂組成物および半導体装置 |
| JPH08245754A (ja) * | 1995-03-13 | 1996-09-24 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
| JPH08253551A (ja) * | 1995-03-14 | 1996-10-01 | Yuka Shell Epoxy Kk | 半導体封止用エポキシ樹脂組成物 |
| JPH093161A (ja) * | 1995-06-20 | 1997-01-07 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
| JP3573530B2 (ja) * | 1995-06-22 | 2004-10-06 | 日本化薬株式会社 | エポキシ樹脂混合物、エポキシ樹脂組成物およびその硬化物 |
| WO1997003129A1 (en) * | 1995-07-10 | 1997-01-30 | Toray Industries, Inc. | Epoxy resin composition |
| JPH09208808A (ja) | 1996-02-07 | 1997-08-12 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
| JPH09268219A (ja) * | 1996-03-29 | 1997-10-14 | Nippon Kayaku Co Ltd | ノボラック型樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
| JP3611002B2 (ja) | 1996-08-08 | 2005-01-19 | 信越化学工業株式会社 | エポキシ樹脂組成物、その製造方法及び半導体装置 |
| JP3618182B2 (ja) | 1996-10-29 | 2005-02-09 | 日東電工株式会社 | 半導体封止用エポキシ樹脂組成物 |
| JP3649540B2 (ja) * | 1996-12-27 | 2005-05-18 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
| US6054222A (en) * | 1997-02-20 | 2000-04-25 | Kabushiki Kaisha Toshiba | Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet |
| JP3806222B2 (ja) * | 1997-04-18 | 2006-08-09 | 新日鐵化学株式会社 | エポキシ樹脂組成物及びその硬化物 |
| JP3074155B2 (ja) | 1997-10-20 | 2000-08-07 | 日東電工株式会社 | 半導体装置 |
| JPH11140277A (ja) * | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びこれを用いた半導体装置 |
| JPH11140166A (ja) * | 1997-11-11 | 1999-05-25 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP3388537B2 (ja) * | 1998-05-15 | 2003-03-24 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP2000103839A (ja) | 1998-09-25 | 2000-04-11 | Matsushita Electric Works Ltd | 封止用樹脂組成物及び半導体装置 |
| JP3349963B2 (ja) | 1998-10-21 | 2002-11-25 | 日本電気株式会社 | 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置 |
| JP4421810B2 (ja) | 2002-06-24 | 2010-02-24 | 日本電気株式会社 | 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置 |
-
1998
- 1998-10-21 JP JP29960698A patent/JP3349963B2/ja not_active Expired - Lifetime
-
1999
- 1999-10-20 US US09/830,016 patent/US7098276B1/en not_active Expired - Lifetime
- 1999-10-20 DE DE69934716T patent/DE69934716T8/de active Active
- 1999-10-20 EP EP99949323A patent/EP1142923B1/de not_active Expired - Lifetime
- 1999-10-20 AT AT99949323T patent/ATE350411T1/de not_active IP Right Cessation
- 1999-10-20 DE DE69941409T patent/DE69941409D1/de not_active Expired - Lifetime
- 1999-10-20 KR KR10-2001-7004927A patent/KR100443110B1/ko active IP Right Grant
- 1999-10-20 EP EP06018889A patent/EP1739112B1/de not_active Expired - Lifetime
- 1999-10-20 WO PCT/JP1999/005787 patent/WO2000023494A1/ja active IP Right Grant
- 1999-10-20 AT AT06018889T patent/ATE442394T1/de not_active IP Right Cessation
- 1999-10-21 TW TW088118357A patent/TWI225074B/zh not_active IP Right Cessation
- 1999-10-21 MY MYPI99004547A patent/MY145752A/en unknown
-
2006
- 2006-06-30 US US11/477,524 patent/US7799852B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1739112B1 (de) | 2009-09-09 |
| EP1739112A1 (de) | 2007-01-03 |
| DE69934716T8 (de) | 2008-04-30 |
| JP3349963B2 (ja) | 2002-11-25 |
| US7098276B1 (en) | 2006-08-29 |
| EP1142923A4 (de) | 2002-06-26 |
| KR100443110B1 (ko) | 2004-08-04 |
| US7799852B2 (en) | 2010-09-21 |
| KR20010080252A (ko) | 2001-08-22 |
| ATE350411T1 (de) | 2007-01-15 |
| TWI225074B (en) | 2004-12-11 |
| EP1142923A1 (de) | 2001-10-10 |
| MY145752A (en) | 2012-03-30 |
| US20060247393A1 (en) | 2006-11-02 |
| DE69934716D1 (de) | 2007-02-15 |
| EP1142923B1 (de) | 2007-01-03 |
| JP2000129092A (ja) | 2000-05-09 |
| DE69934716T2 (de) | 2007-10-25 |
| DE69941409D1 (de) | 2009-10-22 |
| WO2000023494A1 (en) | 2000-04-27 |
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