DE69915161D1 - Flammhemmende Epoxidharzmischung zur Halbleitereinkapselung - Google Patents

Flammhemmende Epoxidharzmischung zur Halbleitereinkapselung

Info

Publication number
DE69915161D1
DE69915161D1 DE69915161T DE69915161T DE69915161D1 DE 69915161 D1 DE69915161 D1 DE 69915161D1 DE 69915161 T DE69915161 T DE 69915161T DE 69915161 T DE69915161 T DE 69915161T DE 69915161 D1 DE69915161 D1 DE 69915161D1
Authority
DE
Germany
Prior art keywords
epoxy resin
flame retardant
resin mixture
semiconductor encapsulation
retardant epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69915161T
Other languages
English (en)
Other versions
DE69915161T2 (de
Inventor
Eiichi Asano
Kazutoshi Tomiyoshi
Masachika Yoshino
Toshio Shiobara
Shoichi Osada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15087893&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69915161(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE69915161D1 publication Critical patent/DE69915161D1/de
Application granted granted Critical
Publication of DE69915161T2 publication Critical patent/DE69915161T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
DE69915161T 1998-04-27 1999-04-27 Flammhemmende Epoxidharzmischung zur Halbleitereinkapselung Expired - Lifetime DE69915161T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13271598 1998-04-27
JP13271598A JP3479827B2 (ja) 1998-04-27 1998-04-27 半導体封止用エポキシ樹脂組成物及び半導体装置

Publications (2)

Publication Number Publication Date
DE69915161D1 true DE69915161D1 (de) 2004-04-08
DE69915161T2 DE69915161T2 (de) 2005-03-17

Family

ID=15087893

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69915161T Expired - Lifetime DE69915161T2 (de) 1998-04-27 1999-04-27 Flammhemmende Epoxidharzmischung zur Halbleitereinkapselung

Country Status (5)

Country Link
US (1) US6518332B2 (de)
EP (1) EP0953603B1 (de)
JP (1) JP3479827B2 (de)
KR (1) KR100547069B1 (de)
DE (1) DE69915161T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6291556B1 (en) * 1999-03-26 2001-09-18 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
TW538482B (en) * 1999-04-26 2003-06-21 Shinetsu Chemical Co Semiconductor encapsulating epoxy resin composition and semiconductor device
KR100565420B1 (ko) * 1999-12-22 2006-03-30 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
KR100679368B1 (ko) * 1999-12-31 2007-02-05 주식회사 케이씨씨 반도체소자 봉지용 에폭시 수지 조성물 및 이를 이용한반도체 장치
JP4345174B2 (ja) * 2000-02-07 2009-10-14 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
US6610406B2 (en) 2000-03-23 2003-08-26 Henkel Locktite Corporation Flame retardant molding compositions
US6432540B1 (en) 2000-03-23 2002-08-13 Loctite Corporation Flame retardant molding compositions
JP3714399B2 (ja) * 2000-06-19 2005-11-09 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2002012741A (ja) * 2000-06-27 2002-01-15 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2003026779A (ja) * 2001-07-17 2003-01-29 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
CN1250599C (zh) * 2001-09-28 2006-04-12 住友电木株式会社 环氧树脂组合物和半导体装置
US20030168731A1 (en) * 2002-03-11 2003-09-11 Matayabas James Christopher Thermal interface material and method of fabricating the same
CN100551659C (zh) * 2004-05-20 2009-10-21 雅宝公司 制成粒状的溴化阴离子苯乙烯系聚合物及其制备和应用
US7109591B2 (en) * 2004-06-04 2006-09-19 Hack Jonathan A Integrated circuit device
KR101094343B1 (ko) 2004-12-31 2011-12-20 주식회사 케이씨씨 반도체 소자 봉지용 에폭시 수지 조성물
JP2009215484A (ja) * 2008-03-12 2009-09-24 Toshiba Corp 樹脂組成物及びそれを用いた半導体装置
JP5548112B2 (ja) * 2010-12-15 2014-07-16 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性オルガノポリシロキサン組成物
KR101309822B1 (ko) 2011-05-23 2013-09-23 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
JP5779723B2 (ja) * 2012-09-21 2015-09-16 株式会社カネカ ハロゲン含有難燃繊維とその製造方法及びそれを用いた難燃繊維製品
US20140210111A1 (en) * 2013-01-25 2014-07-31 Apple Inc. Embedded package on package systems
KR102219584B1 (ko) * 2013-08-29 2021-02-23 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 밀봉용 수지조성물 및 그 경화물을 구비한 반도체 장치
CN105111505A (zh) * 2015-04-23 2015-12-02 广西华锑科技有限公司 一种锑系复配阻燃母粒及其制备方法
CN105111506A (zh) * 2015-04-23 2015-12-02 广西华锑科技有限公司 一种锑系消烟阻燃母粒及其制备方法
CN110194882A (zh) * 2018-02-24 2019-09-03 衡所华威电子有限公司 一种低alpha环氧模塑料及其制备方法
JP7076263B2 (ja) * 2018-03-30 2022-05-27 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP7475794B2 (ja) * 2021-05-12 2024-04-30 信越化学工業株式会社 封止用樹脂組成物及び半導体装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US492732A (en) * 1893-02-28 lytle
US2766139A (en) * 1955-04-13 1956-10-09 Masonite Corp Method of producing fire resistant lignocellulose hardboard products
US3398019A (en) * 1963-02-21 1968-08-20 Monsanto Co Method for fireproofing cellulosic material
US3373135A (en) * 1964-12-01 1968-03-12 Kalk Chemische Fabrik Gmbh Shaped articles of self-extinguishing epoxy resins
US3726694A (en) * 1971-02-22 1973-04-10 American Metal Climax Inc Corrosion inhibiting molybdate pigment and process for making same
JPS59182546A (ja) * 1983-03-31 1984-10-17 Nitto Electric Ind Co Ltd 半導体装置
JPS59204633A (ja) * 1983-05-06 1984-11-20 Denki Kagaku Kogyo Kk 低放射能樹脂組成物
JPS6080259A (ja) * 1983-10-07 1985-05-08 Hitachi Ltd 半導体装置
DE3401835A1 (de) * 1984-01-20 1985-07-25 Basf Ag, 6700 Ludwigshafen Halogenfreie, flammgeschuetzte thermoplastische formmasse
US5476884A (en) * 1989-02-20 1995-12-19 Toray Industries, Inc. Semiconductor device-encapsulating epoxy resin composition containing secondary amino functional coupling agents
KR950011902B1 (ko) * 1990-04-04 1995-10-12 도오레 가부시끼가이샤 반도체 장치 캡슐 봉입 에폭시 수지 조성물
DE69222670T2 (de) * 1991-02-26 1998-03-12 Toray Industries Epoxyharzzusammensetzung zur Verkapselung einer Halbleiteranordnung
CA2066497A1 (en) * 1991-05-01 1992-11-02 Michael K. Gallagher Epoxy molding composition for surface mount applications
EP0705856A2 (de) * 1994-10-07 1996-04-10 Shell Internationale Researchmaatschappij B.V. Epoxidharzzusammensetzung für Halbleitereinkapselung
JP3858353B2 (ja) * 1997-06-23 2006-12-13 日立化成工業株式会社 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
JPH1121432A (ja) * 1997-06-30 1999-01-26 Nippon Shiyaauin Uiriamuzu Kk 半導体封止材
WO1999001507A1 (en) * 1997-07-02 1999-01-14 Sumitomo Bakelite Company, Ltd. Epoxy resin compositions for encapsulating semiconductors, and semiconductor devices

Also Published As

Publication number Publication date
JP3479827B2 (ja) 2003-12-15
KR19990083454A (ko) 1999-11-25
EP0953603A3 (de) 2001-04-25
JPH11310688A (ja) 1999-11-09
US6518332B2 (en) 2003-02-11
KR100547069B1 (ko) 2006-02-01
EP0953603B1 (de) 2004-03-03
EP0953603A2 (de) 1999-11-03
DE69915161T2 (de) 2005-03-17
US20020102429A1 (en) 2002-08-01

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Legal Events

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