KR19990083454A - 반도체봉지용에폭시수지조성물및반도체장치 - Google Patents
반도체봉지용에폭시수지조성물및반도체장치 Download PDFInfo
- Publication number
- KR19990083454A KR19990083454A KR1019990014712A KR19990014712A KR19990083454A KR 19990083454 A KR19990083454 A KR 19990083454A KR 1019990014712 A KR1019990014712 A KR 1019990014712A KR 19990014712 A KR19990014712 A KR 19990014712A KR 19990083454 A KR19990083454 A KR 19990083454A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- semiconductor
- flame retardant
- weight
- Prior art date
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 71
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 71
- 239000000203 mixture Substances 0.000 title claims abstract description 43
- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 238000007789 sealing Methods 0.000 title claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000003063 flame retardant Substances 0.000 claims abstract description 28
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 27
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 claims abstract description 26
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000005011 phenolic resin Substances 0.000 claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 20
- 238000005538 encapsulation Methods 0.000 claims abstract description 16
- 239000011256 inorganic filler Substances 0.000 claims abstract description 13
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract 2
- 229910052770 Uranium Inorganic materials 0.000 claims description 6
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 claims description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 abstract description 29
- 238000000465 moulding Methods 0.000 abstract description 18
- 239000011342 resin composition Substances 0.000 abstract description 16
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000007822 coupling agent Substances 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 235000010290 biphenyl Nutrition 0.000 description 5
- 239000004305 biphenyl Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000007493 shaping process Methods 0.000 description 5
- -1 triphenol alkane Chemical class 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 4
- 238000002485 combustion reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- 244000025254 Cannabis sativa Species 0.000 description 3
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 3
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 235000009120 camo Nutrition 0.000 description 3
- 235000005607 chanvre indien Nutrition 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 239000011487 hemp Substances 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 231100000419 toxicity Toxicity 0.000 description 2
- 230000001988 toxicity Effects 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- HEXHLHNCJVXPNU-UHFFFAOYSA-N 2-(trimethoxysilylmethyl)butane-1,4-diamine Chemical compound CO[Si](OC)(OC)CC(CN)CCN HEXHLHNCJVXPNU-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QGQFOJGMPGJJGG-UHFFFAOYSA-K [B+3].[O-]N=O.[O-]N=O.[O-]N=O Chemical compound [B+3].[O-]N=O.[O-]N=O.[O-]N=O QGQFOJGMPGJJGG-UHFFFAOYSA-K 0.000 description 1
- WJPZDRIJJYYRAH-UHFFFAOYSA-N [Zn].[Mo] Chemical compound [Zn].[Mo] WJPZDRIJJYYRAH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- BVURNMLGDQYNAF-UHFFFAOYSA-N dimethyl(1-phenylethyl)amine Chemical compound CN(C)C(C)C1=CC=CC=C1 BVURNMLGDQYNAF-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 208000028626 extracranial carotid artery aneurysm Diseases 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- MXSVLWZRHLXFKH-UHFFFAOYSA-N triphenylborane Chemical compound C1=CC=CC=C1B(C=1C=CC=CC=1)C1=CC=CC=C1 MXSVLWZRHLXFKH-UHFFFAOYSA-N 0.000 description 1
- IUURMAINMLIZMX-UHFFFAOYSA-N tris(2-nonylphenyl)phosphane Chemical compound CCCCCCCCCC1=CC=CC=C1P(C=1C(=CC=CC=1)CCCCCCCCC)C1=CC=CC=C1CCCCCCCCC IUURMAINMLIZMX-UHFFFAOYSA-N 0.000 description 1
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Abstract
Description
조성 (중량부) | 실시예 | |||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | ||
에폭시수지 | 가 | 64.6 | 64.6 | |||||
나 | 52.1 | 52.1 | 16.4 | |||||
다 | 57.8 | 57.8 | 38.4 | |||||
페놀 수지경화제 | 라 | 35.4 | 35.4 | |||||
마 | 47.9 | 47.9 | ||||||
바 | 42.2 | 42.2 | 42.2 | |||||
무기 충전재 | 500 | 500 | 850 | 850 | 800 | 700 | 700 | |
경화 촉진제 | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | |
몰리브덴산아연 처리 실리카(몰리브덴산아연 함유량:중량부) | 100(19) | 5(0.95) | 100(19) | 5(0.95) | 1(0.19) | 5(0.95) | 5(0.95) | |
몰리부덴산아연 | - | - | - | - | - | - | - | |
수산화알루미늄 | - | - | - | - | - | - | - | |
삼산화안티몬 | - | - | - | - | - | - | - | |
브롬화에폭시 수지 | - | - | - | - | - | - | - | |
이형제 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | |
카본블랙 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | |
실리카 커플링제 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | |
나선 유동성 (cm) | 100 | 100 | 120 | 120 | 80 | 90 | 100 | |
성형경도 | 80 | 80 | 85 | 85 | 80 | 80 | 75 | |
난연성 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
내습성 | 0/20 | 0/20 | 0/20 | 0/20 | 0/20 | 0/20 | 0/20 |
조성 (중량부) | 비교예 | ||||
1 | 2 | 3 | 4 | ||
에폭시수지 | 가 | 64.6 | - | - | - |
나 | - | - | 52.1 | 52.1 | |
다 | - | 57.8 | - | - | |
페놀 수지경화제 | 라 | 35.4 | - | - | - |
마 | - | - | 47.9 | 47.9 | |
바 | - | 42.2 | - | - | |
무기 충전재 | 500 | 800 | 850 | 850 | |
경화 촉진제 | 1.2 | 1.2 | 1.2 | 1.2 | |
몰리브덴산아연 처리 실리카(몰리브덴산아연 함유량:중량부) | -(-) | -(-) | -(-) | -(-) | |
몰리부덴산아연 | - | 0.95 | - | - | |
수산화알루미늄 | - | - | - | 50 | |
삼산화안티몬 | - | - | 4 | - | |
브롬화에폭시 수지 | - | - | 6.2 | - | |
이형제 | 3 | 3 | 3 | 3 | |
카본블랙 | 2 | 2 | 2 | 2 | |
실리카 커플링제 | 1 | 1 | 1 | 1 | |
나선 유동성 (cm) | 100 | 40 | 125 | 100 | |
성형경도 | 80 | 80 | 85 | 40 | |
난연성 | 연소 | V-0 | V-0 | V-0 | |
내습성 | 0/20 | 0/20 | 0/20 | 0/20 |
담지 실리카 | A | B | C | D | E | F |
평균 입경 (μm) | 1 | 5 | 15 | 30 | 0.5 | 0.1 |
형상 | 구상 | 구상 | 구상 | 구상 | 파쇄상 | 구상 |
비표면적 (m2/g) | 6 | 2.5 | 1.7 | 1.2 | 18 | 35 |
몰리브덴산아연의 농도 (%) | 30 | 20 | 10 | 20 | 20 | 20 |
조성 (중량부) | 실시예 | 비교예 | ||||||
8 | 9 | 10 | 11 | 5 | 6 | 7 | ||
에폭시수지 | 가 | 64.6 | - | 64.6 | - | 64.6 | 64.6 | - |
나 | - | 52.1 | - | - | - | - | 52.1 | |
다 | - | - | - | 57.8 | - | - | - | |
페놀 수지경화제 | 라 | 35.4 | - | 35.4 | - | 35.4 | 35.4 | - |
마 | - | 47.9 | - | - | - | - | 47.9 | |
바 | - | - | - | 42.2 | - | - | - | |
무기 충전재 | 500 | 850 | 400 | 700 | 500 | 500 | 850 | |
경화 촉진제 | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | |
몰리브덴산아연 처리 실리카 | (A) | - | 5 | - | - | - | - | - |
(B) | 70 | - | - | - | - | - | - | |
(C) | - | - | 200 | 10 | - | - | - | |
(D) | - | - | - | - | 100 | - | - | |
(E) | - | - | - | - | - | 100 | - | |
(F) | 5 | |||||||
이형제 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | |
카본블랙 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | |
실리카 커플링제 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | |
나선 유동성 (cm) | 105 | 115 | 106 | 95 | 85 | 28 | 49 | |
성형경도 | 83 | 85 | 84 | 82 | 82 | 80 | 76 | |
난연성 | V-0 | V-0 | V-0 | V-0 | 연소 | V-0 | V-0 | |
내습성 | 0/20 | 0/20 | 0/20 | 0/20 | 0/20 | 0/20 | 0/20 |
Claims (5)
- (A) 에폭시 수지,(B) 페놀 수지 경화제,(C) 평균 입경이 0.2 내지 20 ㎛이고, 비표면적이 1 내지 20 ㎡/g인 구상 실리카에 몰리브덴산아연이 담지된 난연제, 및(D) 무기 충전재를 함유하는 것을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물.
- 제1항에 있어서, (C) 난연제의 함유량이 (A) 에폭시 수지와 (B) 페놀 수지 경화제의 총량 100 중량부에 대하여 1 내지 300 중량부인 것을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물.
- 제1항에 있어서, (C) 난연제 중의 몰리브덴산아연의 함유량이 (A) 에폭시 수지와 (B) 페놀 수지 경화제의 총량 100 중량부에 대하여 0.02 내지 35 중량부인 것을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물.
- 제1항 내지 제3항 중 어느 한 항에 있어서, (C) 난연제 중의 우라늄의 함유량이 10 ppb 이하인 것을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물.
- 제1항 내지 제4항 중 어느 한 항에 따른 반도체 봉지용 에폭시 수지 조성물의 경화물로 봉지한 반도체 장치.
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Application Number | Priority Date | Filing Date | Title |
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JP98-132715 | 1998-04-27 | ||
JP13271598A JP3479827B2 (ja) | 1998-04-27 | 1998-04-27 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
Publications (2)
Publication Number | Publication Date |
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KR19990083454A true KR19990083454A (ko) | 1999-11-25 |
KR100547069B1 KR100547069B1 (ko) | 2006-02-01 |
Family
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KR1019990014712A KR100547069B1 (ko) | 1998-04-27 | 1999-04-24 | 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6518332B2 (ko) |
EP (1) | EP0953603B1 (ko) |
JP (1) | JP3479827B2 (ko) |
KR (1) | KR100547069B1 (ko) |
DE (1) | DE69915161T2 (ko) |
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-
1999
- 1999-04-24 KR KR1019990014712A patent/KR100547069B1/ko not_active IP Right Cessation
- 1999-04-27 DE DE69915161T patent/DE69915161T2/de not_active Expired - Lifetime
- 1999-04-27 EP EP99303240A patent/EP0953603B1/en not_active Expired - Lifetime
-
2001
- 2001-04-25 US US09/841,046 patent/US6518332B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100587453B1 (ko) * | 1999-03-26 | 2006-06-09 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치 |
KR100781042B1 (ko) * | 2000-06-19 | 2007-11-29 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP3479827B2 (ja) | 2003-12-15 |
DE69915161D1 (de) | 2004-04-08 |
EP0953603A3 (en) | 2001-04-25 |
JPH11310688A (ja) | 1999-11-09 |
US6518332B2 (en) | 2003-02-11 |
KR100547069B1 (ko) | 2006-02-01 |
EP0953603B1 (en) | 2004-03-03 |
EP0953603A2 (en) | 1999-11-03 |
DE69915161T2 (de) | 2005-03-17 |
US20020102429A1 (en) | 2002-08-01 |
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