JPS641721A - Epoxy polymer composition for sealing semiconductor - Google Patents
Epoxy polymer composition for sealing semiconductorInfo
- Publication number
- JPS641721A JPS641721A JP15832087A JP15832087A JPS641721A JP S641721 A JPS641721 A JP S641721A JP 15832087 A JP15832087 A JP 15832087A JP 15832087 A JP15832087 A JP 15832087A JP S641721 A JPS641721 A JP S641721A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- epoxy polymer
- composition
- polymer composition
- high heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To obtain the titled composition having low modulus of elasticity and high heat shock resistance while maintaining high heat resistance, high water-vapor resistance and low coefficient of thermal expansion, containing a specific epoxy polymer.
CONSTITUTION: The aimed composition containing preferably ≥40wt.% based on an epoxy resin (preferably novolak type epoxy resin) of a cresol type trifunctional epoxy resin shown by the formula. The composition preferably contains a curing agent, a curing promoter, a filler, a flame-retardant, a mold release agent or a surface treatment.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15832087A JPH0784512B2 (en) | 1987-06-24 | 1987-06-24 | Epoxy resin composition for semiconductor encapsulation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15832087A JPH0784512B2 (en) | 1987-06-24 | 1987-06-24 | Epoxy resin composition for semiconductor encapsulation |
Publications (3)
Publication Number | Publication Date |
---|---|
JPS641721A true JPS641721A (en) | 1989-01-06 |
JPH011721A JPH011721A (en) | 1989-01-06 |
JPH0784512B2 JPH0784512B2 (en) | 1995-09-13 |
Family
ID=15669059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15832087A Expired - Lifetime JPH0784512B2 (en) | 1987-06-24 | 1987-06-24 | Epoxy resin composition for semiconductor encapsulation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0784512B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5159820A (en) * | 1989-07-05 | 1992-11-03 | Nippondenso Co., Ltd. | Oil separator integrally mounted on compressor |
US5310826A (en) * | 1989-04-26 | 1994-05-10 | Akzo N.V. | Thiolic compound polymerization cocatalysts |
-
1987
- 1987-06-24 JP JP15832087A patent/JPH0784512B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5310826A (en) * | 1989-04-26 | 1994-05-10 | Akzo N.V. | Thiolic compound polymerization cocatalysts |
US5159820A (en) * | 1989-07-05 | 1992-11-03 | Nippondenso Co., Ltd. | Oil separator integrally mounted on compressor |
Also Published As
Publication number | Publication date |
---|---|
JPH0784512B2 (en) | 1995-09-13 |
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