FI901084A0 - Epoksidihartsimuovausmassoja - Google Patents

Epoksidihartsimuovausmassoja

Info

Publication number
FI901084A0
FI901084A0 FI901084A FI901084A FI901084A0 FI 901084 A0 FI901084 A0 FI 901084A0 FI 901084 A FI901084 A FI 901084A FI 901084 A FI901084 A FI 901084A FI 901084 A0 FI901084 A0 FI 901084A0
Authority
FI
Finland
Prior art keywords
epoxy resin
aromatic
sheathing
epoxide
fillers
Prior art date
Application number
FI901084A
Other languages
English (en)
Swedish (sv)
Other versions
FI96035B (fi
FI96035C (fi
Inventor
Gentzkow Wolfgang Von
Jurgen Huber
Wolfgang Rogler
Dieter Wilhelm
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI901084A0 publication Critical patent/FI901084A0/fi
Publication of FI96035B publication Critical patent/FI96035B/fi
Application granted granted Critical
Publication of FI96035C publication Critical patent/FI96035C/fi

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
FI901084A 1989-03-03 1990-03-02 Epoksidihartsimuovausmassoja FI96035C (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP89103801 1989-03-03
EP89103801A EP0384939B1 (de) 1989-03-03 1989-03-03 Epoxidharz-Formmassen

Publications (3)

Publication Number Publication Date
FI901084A0 true FI901084A0 (fi) 1990-03-02
FI96035B FI96035B (fi) 1996-01-15
FI96035C FI96035C (fi) 1996-04-25

Family

ID=8201039

Family Applications (1)

Application Number Title Priority Date Filing Date
FI901084A FI96035C (fi) 1989-03-03 1990-03-02 Epoksidihartsimuovausmassoja

Country Status (7)

Country Link
US (1) US5364893A (fi)
EP (1) EP0384939B1 (fi)
JP (1) JPH02272014A (fi)
KR (1) KR900014456A (fi)
AT (1) ATE107676T1 (fi)
DE (1) DE58907952D1 (fi)
FI (1) FI96035C (fi)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI902943A0 (fi) * 1989-07-19 1990-06-12 Siemens Ag I hetta haerdbara reaktionshartsblandningar.
DE4303824A1 (de) * 1993-02-10 1994-08-11 Ruetgerswerke Ag Epoxidharzsystem
DE4308187A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
DE4340834A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung sowie ihre Verwendung
DE4427456A1 (de) * 1994-08-03 1996-02-08 Siemens Ag Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung und ihre Verwendung
TW294693B (fi) * 1994-09-09 1997-01-01 Siemens Ag
EP0742261B1 (en) * 1995-04-10 2000-08-02 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin compositions suitable for semiconductor encapsulation, their manufacture and use, semiconductor devices encapsulated therewith
DE19548026A1 (de) * 1995-12-21 1997-06-26 Bayer Ag Polyaminvernetzer-Zubereitung und ihre Herstellung
DE19608612C2 (de) * 1996-03-06 1998-12-24 Clariant Gmbh Phosphormodifizierte Überzugsmassen, ein Verfahren zu ihrer Herstellung und ihre Verwendung als Intumeszenzbeschichtungen
DE19608611A1 (de) * 1996-03-06 1997-09-11 Hoechst Ag Phosphormodifizierte Überzugsmassen, ein Verfahren zu ihrer Herstellung und ihre Verwendung
DE19608613C2 (de) * 1996-03-06 2002-01-17 Celanese Ventures Gmbh Lagerstabile, phosphormodifizierte Epoxidharze
EP0799846B1 (de) * 1996-04-01 2000-06-14 Clariant GmbH Phosphormodifizierte Epoxid-harzmischungen aus Expoxid-harzen, phosphorhaltigen Verbindungen und einem Härter
DE19613063C2 (de) * 1996-04-01 1998-09-17 Clariant Gmbh Phosphormodifizierte Epoxidharze und ein Verfahren zu ihrer Herstellung
DE19613066C2 (de) * 1996-04-01 1998-09-10 Clariant Gmbh Verfahren zur Herstellung phosphormodifizierter Epoxidharze
DE19613064C2 (de) * 1996-04-01 1998-12-17 Clariant Gmbh Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, Verfahren zu ihrer Herstellung und ihre Verwendung
DE19613067C2 (de) * 1996-04-01 1998-12-03 Clariant Gmbh Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, ein Verfahren zu deren Herstellung und ihre Verwendung
DE19613061C2 (de) * 1996-04-01 1998-07-02 Clariant Gmbh Phosphormodifizierte Epoxidharze aus Epoxidharzen und phosphorhaltigen Verbindungen
AU736608B2 (en) * 1996-09-26 2001-08-02 Siemens Aktiengesellschaft Epoxy resin mixtures
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
WO2001042253A2 (en) * 1999-12-13 2001-06-14 The Dow Chemical Company Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
KR100721697B1 (ko) 1999-12-13 2007-05-28 다우 글로벌 테크놀로지스 인크. 난연성 인 원소 함유 에폭시 수지 조성물
EP1508583B1 (de) 2002-05-29 2006-10-11 Nippon Chemical Industrial Company Limited Phosphorhaltiges epoxidharz, phosphorhaltiges epoxidharz enthaltende zusammensetzung, herstellungsverfahren dafür und dichtungsmasse und laminat, jeweils dieses enthaltend oder damit hergestellt
US7239016B2 (en) * 2003-10-09 2007-07-03 Denso Corporation Semiconductor device having heat radiation plate and bonding member
KR101148353B1 (ko) 2004-05-28 2012-05-21 다우 글로벌 테크놀로지스 엘엘씨 내인화성 할로겐 무함유 중합체의 제조에 유용한 인 함유화합물
DE102004039758A1 (de) 2004-08-17 2006-03-02 Clariant Gmbh Brandschutzbeschichtung
US20110065838A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins
US20110065870A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins
WO2012064703A1 (en) 2010-11-12 2012-05-18 Albemarle Corporation Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions
CN103382242B (zh) 2013-06-25 2015-06-24 江苏雅克科技股份有限公司 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物
CN107266639B (zh) 2014-08-15 2019-08-27 江苏雅克科技股份有限公司 含磷酚醛树脂化合物及以其为原料制备的含磷阻燃环氧树脂固化物
CN107033343B (zh) 2014-11-06 2019-01-08 江苏雅克科技股份有限公司 含磷官能化聚(亚芳基醚)及包含含磷官能化聚(亚芳基醚)的可固化组合物
CN106750226B (zh) 2014-11-11 2019-01-08 江苏雅克科技股份有限公司 含磷聚酯化合物组成及含磷阻燃环氧树脂固化物的制备方法
WO2018164833A1 (en) 2017-03-07 2018-09-13 Icl-Ip America Inc. Non-migratory, high-melting/softening polymeric phosphorus-containing flame retardant for printed wiring boards

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS557852B2 (fi) * 1972-08-31 1980-02-28
JPS51143620A (en) * 1975-06-06 1976-12-10 Matsumoto Seiyaku Kogyo Kk Process for preparation of epoxydiphosphonate
US4347343A (en) * 1981-01-21 1982-08-31 The Dow Chemical Company Thickened vinyl ester resin compositions
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
EP0271772A3 (de) * 1986-12-15 1988-12-14 Siemens Aktiengesellschaft Epoxidharz-Formmassen

Also Published As

Publication number Publication date
EP0384939B1 (de) 1994-06-22
ATE107676T1 (de) 1994-07-15
US5364893A (en) 1994-11-15
JPH02272014A (ja) 1990-11-06
DE58907952D1 (de) 1994-07-28
FI96035B (fi) 1996-01-15
EP0384939A1 (de) 1990-09-05
FI96035C (fi) 1996-04-25
KR900014456A (ko) 1990-10-24

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Legal Events

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MM Patent lapsed
MM Patent lapsed

Owner name: SIEMENS AKTIENGESELLSCHAFT