JPS6475565A - Thermosetting polymer composition - Google Patents

Thermosetting polymer composition

Info

Publication number
JPS6475565A
JPS6475565A JP23325287A JP23325287A JPS6475565A JP S6475565 A JPS6475565 A JP S6475565A JP 23325287 A JP23325287 A JP 23325287A JP 23325287 A JP23325287 A JP 23325287A JP S6475565 A JPS6475565 A JP S6475565A
Authority
JP
Japan
Prior art keywords
filler
thermosetting polymer
composition
curing agent
blending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23325287A
Other languages
Japanese (ja)
Inventor
Hitoshi Takahira
Kiyoshi Saito
Kazuhiko Mogami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP23325287A priority Critical patent/JPS6475565A/en
Publication of JPS6475565A publication Critical patent/JPS6475565A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To obtain the titled composition having merits of low-temperature rapid curing properties, high fluidity and low coefficient of thermal expansion and excellent shelf stability, by blending a composition liquid at normal temperature, consisting of a thermosetting polymer, a curing agent and a filler, with a specific benzylidene compound. CONSTITUTION:The aimed composition which is obtained by blending 100pts.wt. sum of (A) a thermosetting polymer (e.g. epoxy polymer) and (B) a curing agent (e.g. amine compound) with (C) 1-20pts.wt. benzylidene compound shown by formula I or II (R is halogen, lower alkyl or lower alkoxy; n is 0-5; m is 0 or 1) and (D) 30-400pts.wt. filler (e.g. silica powder), will not cause settling of the filler and shows stable characteristics of cured material to various uses such as adhesive, molding material and sealing material.
JP23325287A 1987-09-17 1987-09-17 Thermosetting polymer composition Pending JPS6475565A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23325287A JPS6475565A (en) 1987-09-17 1987-09-17 Thermosetting polymer composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23325287A JPS6475565A (en) 1987-09-17 1987-09-17 Thermosetting polymer composition

Publications (1)

Publication Number Publication Date
JPS6475565A true JPS6475565A (en) 1989-03-22

Family

ID=16952158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23325287A Pending JPS6475565A (en) 1987-09-17 1987-09-17 Thermosetting polymer composition

Country Status (1)

Country Link
JP (1) JPS6475565A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996006839A1 (en) * 1994-08-29 1996-03-07 Kao Corporation Synthetic lubricating oil
JP2014101414A (en) * 2012-11-16 2014-06-05 Kaneka Corp Temperature-sensitive gelation agent inclusion thermosetting resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996006839A1 (en) * 1994-08-29 1996-03-07 Kao Corporation Synthetic lubricating oil
JP2014101414A (en) * 2012-11-16 2014-06-05 Kaneka Corp Temperature-sensitive gelation agent inclusion thermosetting resin composition

Similar Documents

Publication Publication Date Title
ATE107676T1 (en) EPOXY RESIN MOLDING COMPOUNDS.
MY115318A (en) Liquid epoxy resin composition.
KR870011177A (en) Curable composition containing beta-hydroxyalkylcarbamylmethylatedaminotriazine and the compound
EP0276327A4 (en) Resin composition and process for its preparation.
MY138699A (en) Epoxy compound, preparation method thereof, and use thereof
EP0852249A4 (en) Polyphenylene sulfide resin composition
JPS5560517A (en) Epoxy resin composition
ES2160928T3 (en) MATERIAL FOR WORKING WITH EPOXY RESIN TOOLS OF A COMPONENT.
JPS6475565A (en) Thermosetting polymer composition
ES2007540A6 (en) Curable epoxy resin compositions containing a tetraglycidyl ether of a tetramethylol compound
WO2003037985A1 (en) Curable epoxy resin compositions and process for production thereof
EP0342027A3 (en) Epoxy-aromatic polysiloxane compositions
DE69824115D1 (en) Low temperature curable one-component powder coating composition
ATE106922T1 (en) LOW TEMPERATURE CURING COMPOSITIONS BASED ON POLYAROMATIC COMPOUNDS CONTAINING ALDEHYDE GROUPS AND KETIMINATED POLYAMINO COMPOUNDS.
DE59009715D1 (en) Epoxy resin mixtures.
JPS64151A (en) Vibration-damping material
SE8802699L (en) HARDWARE EPOXY RESIN MIXTURES
JPS5545731A (en) Epoxy resin composition
SU975750A1 (en) Polymeric composition
JPH0245554A (en) Resin composition for semiconductor sealing use
JPS55147550A (en) Room-temperature curing polyorganosiloxane composition
JPS5471197A (en) Curable resin composition
JPS5723624A (en) Epoxy resin composition
JPS6431816A (en) Epoxy resin composition for semiconductor sealing use
JPS57119946A (en) Modified epoxy resin composition