JPS57119946A - Modified epoxy resin composition - Google Patents
Modified epoxy resin compositionInfo
- Publication number
- JPS57119946A JPS57119946A JP496181A JP496181A JPS57119946A JP S57119946 A JPS57119946 A JP S57119946A JP 496181 A JP496181 A JP 496181A JP 496181 A JP496181 A JP 496181A JP S57119946 A JPS57119946 A JP S57119946A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- powder
- composition
- iii
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: The title composition with good moldability, high thermal deformation temp. and excellent thermal shock resistance, prepd. by adding 2,3,3',4'-biphenyl- tetracarboxylic acid dianhydride curing agent and a quartz powder and/or glass powder each in a specified amt. to an epoxy resin.
CONSTITUTION: 100pts.wt. epoxy resin (i) such as a bisphenol A type epoxy resin is compounded with 2,3,3',4'-bisphenoltetracarboxylic acid dianhydride curing agent (ii) in an amt. corresponding to an eq. ratio to the epoxy resin (i) of 0.2W1.5 and 50W350pts.wt. quartz powder and/or glass powder (iii), to obtain the purpose composition. In said composition, it is possible to replace 50wt% or less component (iii) by an aluminum powder, calcium carbonate, an asbestos powder and/or clay powder. Said composition can be molded by cast molding and cures at 120W250°C.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP496181A JPS57119946A (en) | 1981-01-19 | 1981-01-19 | Modified epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP496181A JPS57119946A (en) | 1981-01-19 | 1981-01-19 | Modified epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57119946A true JPS57119946A (en) | 1982-07-26 |
Family
ID=11598174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP496181A Pending JPS57119946A (en) | 1981-01-19 | 1981-01-19 | Modified epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57119946A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016145647A1 (en) * | 2015-03-19 | 2016-09-22 | Ablestik (Shanghai) Ltd. | Epoxy molding compound using anhydride hardener, manufacturing process and use thereof |
-
1981
- 1981-01-19 JP JP496181A patent/JPS57119946A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016145647A1 (en) * | 2015-03-19 | 2016-09-22 | Ablestik (Shanghai) Ltd. | Epoxy molding compound using anhydride hardener, manufacturing process and use thereof |
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