JPS57119946A - Modified epoxy resin composition - Google Patents

Modified epoxy resin composition

Info

Publication number
JPS57119946A
JPS57119946A JP496181A JP496181A JPS57119946A JP S57119946 A JPS57119946 A JP S57119946A JP 496181 A JP496181 A JP 496181A JP 496181 A JP496181 A JP 496181A JP S57119946 A JPS57119946 A JP S57119946A
Authority
JP
Japan
Prior art keywords
epoxy resin
powder
composition
iii
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP496181A
Other languages
Japanese (ja)
Inventor
Toshihiro Inaike
Katsuhiko Ushimi
Shunji Oe
Kazunori Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP496181A priority Critical patent/JPS57119946A/en
Publication of JPS57119946A publication Critical patent/JPS57119946A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: The title composition with good moldability, high thermal deformation temp. and excellent thermal shock resistance, prepd. by adding 2,3,3',4'-biphenyl- tetracarboxylic acid dianhydride curing agent and a quartz powder and/or glass powder each in a specified amt. to an epoxy resin.
CONSTITUTION: 100pts.wt. epoxy resin (i) such as a bisphenol A type epoxy resin is compounded with 2,3,3',4'-bisphenoltetracarboxylic acid dianhydride curing agent (ii) in an amt. corresponding to an eq. ratio to the epoxy resin (i) of 0.2W1.5 and 50W350pts.wt. quartz powder and/or glass powder (iii), to obtain the purpose composition. In said composition, it is possible to replace 50wt% or less component (iii) by an aluminum powder, calcium carbonate, an asbestos powder and/or clay powder. Said composition can be molded by cast molding and cures at 120W250°C.
COPYRIGHT: (C)1982,JPO&Japio
JP496181A 1981-01-19 1981-01-19 Modified epoxy resin composition Pending JPS57119946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP496181A JPS57119946A (en) 1981-01-19 1981-01-19 Modified epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP496181A JPS57119946A (en) 1981-01-19 1981-01-19 Modified epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS57119946A true JPS57119946A (en) 1982-07-26

Family

ID=11598174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP496181A Pending JPS57119946A (en) 1981-01-19 1981-01-19 Modified epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57119946A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016145647A1 (en) * 2015-03-19 2016-09-22 Ablestik (Shanghai) Ltd. Epoxy molding compound using anhydride hardener, manufacturing process and use thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016145647A1 (en) * 2015-03-19 2016-09-22 Ablestik (Shanghai) Ltd. Epoxy molding compound using anhydride hardener, manufacturing process and use thereof

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