JPS57198724A - Epoxy resin molding composition - Google Patents

Epoxy resin molding composition

Info

Publication number
JPS57198724A
JPS57198724A JP8291781A JP8291781A JPS57198724A JP S57198724 A JPS57198724 A JP S57198724A JP 8291781 A JP8291781 A JP 8291781A JP 8291781 A JP8291781 A JP 8291781A JP S57198724 A JPS57198724 A JP S57198724A
Authority
JP
Japan
Prior art keywords
epoxy resin
molding composition
inorganic filler
resin molding
mechanical strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8291781A
Other languages
Japanese (ja)
Inventor
Takanori Kushida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP8291781A priority Critical patent/JPS57198724A/en
Publication of JPS57198724A publication Critical patent/JPS57198724A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: An epoxy resin molding composition that is produced by adding a porous inorganic filler of particle sizes in a specific range and a curing agent to an epoxy resin, thus giving moldings of high mechanical strength by no use of fiber glass.
CONSTITUTION: The objective molding composition comprises 20W30pts.wt. of an epoxy resin such as bisphenol-A epoxy resin, 3W6pts. of a curing agent such as dicyandiamde, 55W65pts. of an inorganic filler containing particles of 10W5μ sizes by 30W40wt%, of 5W2μ by 45W55wt% such as kieselguhr, and when necessary, 0.3W0.7wt%, based on the inorganic filler, of an aminosilane coupling agent such as γ-aminopropyltriethoxysilane.
EFFECT: The formed products have high mechanical strength.
COPYRIGHT: (C)1982,JPO&Japio
JP8291781A 1981-05-30 1981-05-30 Epoxy resin molding composition Pending JPS57198724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8291781A JPS57198724A (en) 1981-05-30 1981-05-30 Epoxy resin molding composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8291781A JPS57198724A (en) 1981-05-30 1981-05-30 Epoxy resin molding composition

Publications (1)

Publication Number Publication Date
JPS57198724A true JPS57198724A (en) 1982-12-06

Family

ID=13787594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8291781A Pending JPS57198724A (en) 1981-05-30 1981-05-30 Epoxy resin molding composition

Country Status (1)

Country Link
JP (1) JPS57198724A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100504289B1 (en) * 2001-12-28 2005-07-27 제일모직주식회사 Epoxy Molding Compound Composition With Excellent Crack Resistance At High Temperature

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100504289B1 (en) * 2001-12-28 2005-07-27 제일모직주식회사 Epoxy Molding Compound Composition With Excellent Crack Resistance At High Temperature

Similar Documents

Publication Publication Date Title
JPS5580445A (en) Thermoplastic resin composition and prevention of deterioration
EP0347598A3 (en) Polyphenylene ether/rubber modified polystyrene composition suitable for blow molding large parts
DE3270661D1 (en) Setting resin masses and moulding compositions prepared therewith
JPS57198724A (en) Epoxy resin molding composition
JPS56136838A (en) Thermoplastic polyester resin composition
JPS55125168A (en) Long-term rust-preventive coating composition
JPS56122145A (en) Resin composition for sealing semiconductor device
JPS53123457A (en) Molding resin composition
JPS57180651A (en) Phenolic resin molding material
JPS57200454A (en) Thermosetting resin molding material
JPS57158259A (en) Curable soundproof composition
FR2406487A1 (en) PROCESS FOR THE MANUFACTURING OF MODELS AND MOLDING EQUIPMENT
JPS5747323A (en) Epoxy resin composition having improved resistance to hot water at high temperature
GB1352225A (en) Process for the production of plastics mouldings
JPS57162747A (en) Epoxy resin composition
JPS5776041A (en) Filler-containing propylene polymer composition
JPS57185343A (en) Phenolic resin molding material
JPS56166259A (en) Resin composition
JPS5513749A (en) Foamable coating powder composition
JPS57187355A (en) Molding material
JPS56152861A (en) Epoxy resin composition
JPS53126095A (en) Preparation of phenolic resin molding compound
JPS6454022A (en) Epoxy resin casting composition
JPS55106257A (en) Phenol resin composition for molding
JPS57119946A (en) Modified epoxy resin composition