JPS57198724A - Epoxy resin molding composition - Google Patents
Epoxy resin molding compositionInfo
- Publication number
- JPS57198724A JPS57198724A JP8291781A JP8291781A JPS57198724A JP S57198724 A JPS57198724 A JP S57198724A JP 8291781 A JP8291781 A JP 8291781A JP 8291781 A JP8291781 A JP 8291781A JP S57198724 A JPS57198724 A JP S57198724A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding composition
- inorganic filler
- resin molding
- mechanical strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: An epoxy resin molding composition that is produced by adding a porous inorganic filler of particle sizes in a specific range and a curing agent to an epoxy resin, thus giving moldings of high mechanical strength by no use of fiber glass.
CONSTITUTION: The objective molding composition comprises 20W30pts.wt. of an epoxy resin such as bisphenol-A epoxy resin, 3W6pts. of a curing agent such as dicyandiamde, 55W65pts. of an inorganic filler containing particles of 10W5μ sizes by 30W40wt%, of 5W2μ by 45W55wt% such as kieselguhr, and when necessary, 0.3W0.7wt%, based on the inorganic filler, of an aminosilane coupling agent such as γ-aminopropyltriethoxysilane.
EFFECT: The formed products have high mechanical strength.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8291781A JPS57198724A (en) | 1981-05-30 | 1981-05-30 | Epoxy resin molding composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8291781A JPS57198724A (en) | 1981-05-30 | 1981-05-30 | Epoxy resin molding composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57198724A true JPS57198724A (en) | 1982-12-06 |
Family
ID=13787594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8291781A Pending JPS57198724A (en) | 1981-05-30 | 1981-05-30 | Epoxy resin molding composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57198724A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100504289B1 (en) * | 2001-12-28 | 2005-07-27 | 제일모직주식회사 | Epoxy Molding Compound Composition With Excellent Crack Resistance At High Temperature |
-
1981
- 1981-05-30 JP JP8291781A patent/JPS57198724A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100504289B1 (en) * | 2001-12-28 | 2005-07-27 | 제일모직주식회사 | Epoxy Molding Compound Composition With Excellent Crack Resistance At High Temperature |
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