WO2016145647A1 - Epoxy molding compound using anhydride hardener, manufacturing process and use thereof - Google Patents
Epoxy molding compound using anhydride hardener, manufacturing process and use thereof Download PDFInfo
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- WO2016145647A1 WO2016145647A1 PCT/CN2015/074566 CN2015074566W WO2016145647A1 WO 2016145647 A1 WO2016145647 A1 WO 2016145647A1 CN 2015074566 W CN2015074566 W CN 2015074566W WO 2016145647 A1 WO2016145647 A1 WO 2016145647A1
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- UFWIBTONFRDIAS-UHFFFAOYSA-N c1cc2ccccc2cc1 Chemical compound c1cc2ccccc2cc1 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 0 O=*(c1c2ccc(*C(/C=*/C(O3)=[U])=CC=CC3=O)c1)OC2=[U] Chemical compound O=*(c1c2ccc(*C(/C=*/C(O3)=[U])=CC=CC3=O)c1)OC2=[U] 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Definitions
- the molded products produced from the epoxy molding compounds can have Tg higher than 250°C, which can stand high working temperature, and thus can be used in high temperature applications, especially in high power electrical or electronic devices.
- the amount of the epoxy resin (a) in the epoxy molding compound is preferably 3 ⁇ 20 wt. %, more preferably 3 ⁇ 10 wt. % based on the total weight of the epoxy molding compound.
- R represents a direct bond, -S-, -O-, -CH2-,
- the curing accelerator (c) used in the epoxy molding compound of the present invention various compounds can be used, for example, phosphorus-based compounds, tertiary amines, imidazoles, organic acid metal salts, Lewis acids, amine complex salts, and the like.
- 2-ethyl-4-methylimidazole is preferred as one of the imidazoles
- triphenylphosphine (TPP) is preferred as one of the phosphorus-based compounds
- DBU 1,8-diazabicyclo- [5.4.0] -undecene
- Any of the above listed curing accelerators can be used alone or in a combination of two or more.
- the amount of additive (e) in the epoxy molding compound is preferably 0 ⁇ 2 wt. %, more preferably 0.5 ⁇ 1 wt. % based on the total weight of the epoxy molding compound.
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Provided is an epoxy molding compound comprising (a) an epoxy resin; (b) an anhydride hardener with specific structures; (c) a curing accelerator; (d) a filler; and optionally (e) one or more additives. By using anhydrides with specific structures as hardeners for epoxy resins, the molded products produced from the epoxy molding compounds can have Tg higher than 250℃, which can stand high working temperature, and thus can be used in high temperature applications, especially in high power electrical or electronic devices.
Description
The present invention relates to an epoxy molding compound, particularly, relates to an epoxy molding compound using an anhydride with specific structure as hardener, and to a manufacturing process and use of the epoxy molding compound.
Background Art
Molded epoxy resin products are widely used as component parts in electrical and electronic devices, such as transistors and integrated circuit boards, because epoxy resin has well balanced properties including molding property, electrical property, moisture resistance, heat resistance, mechanical property and adhesion to component inserted therein, etc.
Molded epoxy resin products are produced from epoxy molding compounds. A typical epoxy molding compound comprises an epoxy resin, a curing agent (hardener) , a curing accelerator (catalyst) , and optionally fillers and additives. An epoxy molding compound can be molded and cured to a solid shaped article in a mold at elevated temperature and for a certain time. Afterwards, the demolded article is usually post-cured at elevated temperatures to complete the curing reaction and obtain a resin article with the ultimate desired properties.
For high power electrical or electronic devices, due to the high working temperature, the molded epoxy resin products used therein should have high temperature resistance, which is associated with Tg of the products. Tg (glass transition temperature) of a conventional molded epoxy resin is usually in the range of 100℃ to 180℃, but many high power electrical or electronic devices usually work under 200℃, since the higher the power is, the higher the working temperature is.
Quit a lot of works have been carried out trying to improve the heat resistance of molded epoxy resin products by selecting and designing the components of the epoxy molding compounds.
US 6207789 B1 discloses a molding composition consisting of an epoxy resin, a phenolic resin hardener and inorganic filler, wherein the phenolic resin hardener contains in the backbone chain a structure unit represented by the following formula:
The Tg values of the cured epoxy products are no more than 145℃.
US 8394911 B2 discloses a phenol resin composition used as a curing agent for epoxy resins, wherein the phenol resin composition includes a naphthol novolac resin (a1) represented by general formula (1) ,
and a compound (a2) represented by general formula (2)
The cured epoxy resins using the above phenol resin composition as curing agent got a Tg around 230℃.
There is still a demand of designing and selecting the components of an epoxy molding compound to get higher Tg, preferably higher than 250℃, for the molded epoxy resin to meet the requirements of high temperature applications, especially for high power electrical or electronic devices.
Summary of the Invention
Accordingly, the object of the present invention is to provide an epoxy molding compound, from which a molded epoxy resin having higher Tg, preferably higher than 250℃, can be obtained.
In one aspect, the present invention provides an epoxy molding compound, comprising
(a) an epoxy resin；
(b) a hardener；
(c) a curing accelerator；
(d) a filler； and optionally
(e) an additives,
wherein said hardener is one or more bi-anhydride compounds represented by the following structure (1) :
wherein, R represents a direct bond, -S-, -O-, -CH2-, 
In another aspect the present invention provides a process for manufacturing the epoxy molding compound of the present invention, comprising steps of:
(1) Weighing up all of the components and putting them in a high speed mixer to get a premixed powder； and
(2) Putting the premixed powder into an extruder to further mix the premixed powder and then crushing the extruded material into powder.
Yet in another aspect, the present invention provides the use of the epoxy molding compound of the present invention as transistor material, such as diode material and triode material； printed circuit board material, electronic circuit board material, adhesives, interlayer insulating materials, etc.
According to the present invention, by using anhydrides with specific structures as hardeners for epoxy resins, the molded products produced from the epoxy molding compounds can have Tg higher than 250℃, which can stand high working temperature, and thus can be used in high temperature applications, especially in high power electrical or electronic devices.
Detailed description
In the following passages the present invention is described in more detail.
Each aspect so described may be combined with any other aspect or aspects unless clearly indicated to the contrary. In particular, any feature indicated as being preferred or advantageous may be combined with any other feature or features indicated as being preferred or advantageous.
In the context of the present invention, the terms used are to be construed in accordance with the following definitions, unless a context dictates otherwise. As used herein, the singular forms “a” , “an” and “the” include both singular and plural referents unless the context clearly dictates otherwise.
The terms “comprising” , “comprises” and “comprised of” as used herein are synonymous with “including” , “includes” or “containing” , “contains” , and are inclusive or open-ended and do not exclude additional, non-recited members, elements or method steps.
The recitation of numerical end points includes all numbers and fractions subsumed within the respective ranges, as well as the recited end points.
When an amount, a concentration or other values or parameters is/are expressed in form of a range, a preferable range, or a preferable upper limit value and a preferable lower limit value, it should be understood as that any ranges obtained by combining any upper limit or preferable value with any lower limit or preferable value are specifically disclosed, without considering whether the obtained ranges are clearly mentioned in the context.
All references cited in the present specification are hereby incorporated by reference in their entirety.
Unless otherwise defined, all terms used in the disclosure of the invention, including technical and scientific terms, have the meaning as commonly understood by one of the ordinary skill in the art to which this invention belongs to. By means of further guidance, term definitions are included to better appreciate the teaching of the present invention.
The present invention provides an epoxy molding compound, comprising (a) an epoxy resin； (b) an anhydride hardener； (c) a curing accelerator； (d) a filler； and optionally (e) one or more additives.
Epoxy resin (a)
As used herein, the term “epoxy resin” means a polymer containing generally two or more epoxide groups per molecule.
As the epoxy resin (a) used in the epoxy molding compound of the present invention, any epoxy resins commonly used are suitable. There are no particular limitations. Examples thereof Include but not limited to bisphenol epoxy resins such as bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, and the like； biphenyl epoxy resins such as biphenyl epoxy reins, tetramethylbiphenyl epoxy resins, and the like； novolac epoxy resins such as phenol novolac epoxy resins, cresol novolac epoxy resins, bisphenol A novolac epoxy resins, epoxy compounds of condensates of phenols and phenolic hydroxyl group-containing aromatic aldehyde, biphenyl novolac epoxy resins, and the like； triphenylmethane epoxy resins； tetraphenylethane epoxy resins； dicyclopentadiene phenol addition reaction-type epoxy resins； phenolaralkyl epoxy resins； epoxy resins each having a naphthalene skeleton in its molecular structure, such as naphthol novolac epoxy resins, naphtholaralkyl epoxy resins, and the like； brominated bisphenol epoxy resins, alicyclic epoxy resins, and glycidyl ether epoxy resins. These epoxy resins may be used alone or as a mixture of two or more.
Among the above-described epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, biphenyl epoxy resins, tetramethylbiphenyl epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, naphthol novolac epoxy resins, naphtholaralkyl epoxy resins, brominated bisphenol epoxy resins, alicyclic epoxy resins, glycidyl ether epoxy resins are preferred.
The amount of the epoxy resin (a) in the epoxy molding compound is preferably 3～20 wt. ％, more preferably 3～10 wt. ％ based on the total weight of the epoxy molding compound.
Anhydride hardener (b)
As used herein, the term “hardener” is of the same meaning as “curing agent” , which may perform different functions, such as react covalently with the functional groups of the epoxy resin to propagate the crosslinking of the resin and to get a thermoset resin.
The hardener (b) used in the epoxy molding compound of the present invention is at least one bi-anhydride represented by the following structure (1) :
wherein, R represents a direct bond, -S-, -O-, -CH2-, 
Among the above-described bi-anhydride hardeners, compounds with R being direct bond, -S-, -O-, -CH2-, 
in which n is 1 –3, or 
are preferred.
Anhydride compounds with R being -O-, 
or
are specially preferred.
As hardener (b) , one or more of the above-mentioned bi-anhydride hardeners
may be used, and any other conventionally known curing agent may be also used in combination.
The amount of the anhydride hardener (b) in the epoxy molding compound is preferably 3～15 wt. ％, more preferably 5～12 wt. ％ based on the total weight of the epoxy molding compound.
Curing accelerator (c)
As used herein, the term “curing accelerator” has the same meaning as “catalyst” , which catalyzes or accelerates the curing reaction between the epoxy resin and the hardener.
As the curing accelerator (c) used in the epoxy molding compound of the present invention, various compounds can be used, for example, phosphorus-based compounds, tertiary amines, imidazoles, organic acid metal salts, Lewis acids, amine complex salts, and the like. In particular, from the viewpoint of excellent curability, heat resistance, electric characteristics, and wetproof reliability, 2-ethyl-4-methylimidazole is preferred as one of the imidazoles, triphenylphosphine (TPP) is preferred as one of the phosphorus-based compounds, and 1,8-diazabicyclo- [5.4.0] -undecene (DBU) is preferred as one of the tertiary amines. Any of the above listed curing accelerators can be used alone or in a combination of two or more.
In the case when a curing accelerator (c) is used, the amount of the curing accelerator (c) in the epoxy molding compound is preferably 0.05～1 wt. ％, more preferably 0.1～0.3 wt. ％ based on the total weight of the epoxy molding compound.
Filler (d)
A wide range of fillers may be used in the epoxy molding compound of the present invention to improve certain properties of the molded product, such as abrasion resistance, moisture resistance, thermal conductivity or electrical properties.
As filler (d) used in the epoxy molding compound of the present invention, it can be inorganic, such as silica, alumina, titania, aluminium hydroxide, silicon nitride, talc, clay, glass fiber and the like； or organic such as powdered PVC, polyamides, polyethylene, polyester or cured epoxy resins. When the amount
of the filler required is particularly high, fused silica is preferably used. Although either crushed or spherical fused silica can be used, the spherical fused silica is preferably used for increasing the amount of the fused silica mixed in and suppressing an increase in melt viscosity of the molding material. Any of the above listed fillers can be used alone or in a combination of two or more.
In the case when a filler (d) is used, the amount of filler (d) in the epoxy molding compound is preferably 60～90 wt. ％, more preferably 75～85 wt. ％ based on the total weight of the epoxy molding compound.
Additive (e)
As used herein, the term “additive” means any compounding additives conventionally employed in molding resin compound.
If required, one or more additives (e) can be used in the epoxy molding compound of the present application. Examples of additive (e) include releasing agent such as Carnarba wax, PE wax or others； coupling agent such as gamma glycidoxytrimethoxy silane； pigment such as carbon black； stress modifier such as rubber； flame retardant such as Antimony (III) oxide； emulsifiers, and stabilizers, etc.
In the case when an additive (e) is used, the amount of additive (e) in the epoxy molding compound is preferably 0～2 wt. ％, more preferably 0.5～1 wt. ％ based on the total weight of the epoxy molding compound.
In a preferred embodiment of the present invention, an epoxy molding compound comprises:
(a) 3 to 20 wt. ％ of the epoxy resin；
(b) 3 to 15 wt. ％ of the anhydride hardener；
(c) 0.05 to 1 wt. ％ of the curing accelerator；
(d) 60 to 90 wt. ％ of the filler； and
(e) 0 to 2 wt. ％ of the one or more additives,
wherein the weight percentages are based on the total weight of the epoxy molding compound.
In a further preferred embodiment of the present invention, an epoxy molding compound comprises:
(a) 3 to 10 wt. ％ of the epoxy resin；
(b) 5 to 12 wt. ％ of the hardener；
(c) 0.1 to 0.3 wt. ％ of the curing accelerator；
(d) 75 to 85 wt. ％ of the filler； and
(e) 0.5 to 1 wt. ％ of the one or more additives.
wherein the weight percentages are based on the total weight of the epoxy molding compound.
There is no special limit for the manufacturing method of the epoxy molding compound of the present invention. In a preferred embodiment, the epoxy molding compound is manufactured by a process comprising steps of:
(1) Weighing up all of the components (a) to (e) and putting them in a high speed mixer to get a premixed powder at 50～500rpm, preferably 200～400rpm； and
(2) Putting the premixed powder into an extruder to mix the premixed powder at 80～120℃ with the rotation speed of the paddle being 50～200 rpm and then crushing the extruded material into powder.
The epoxy molding compound of the present invention can be used as transistor material, such as diode material and triode material； printed circuit board material, electronic circuit board material, adhesives, interlayer insulating materials, etc. By using the anhydride hardeners with specific structures, the molded products produced from the epoxy molding compounds can have Tg higher than 250℃, which can stand high working temperature, and thus can be used in high temperature applications, especially in high power electrical or electronic devices.
Examples
The present invention will be illustrated in details by means of examples below. However, It is to be understood by one of ordinary skill in the art that this part is a description of exemplary embodiments only, and is not intended as limiting the broader aspects of the present invention.
Raw materials
Tactix 742, an epoxy resin obtained from Huntsman Advanced Materials, US； MEH-7500-3S, a multi-functional phenol resin obtained from Meiwa, Japan； 4,4'- (Hexafluoroisopropylidene) diphthalic anhydride, obtained from TCI, Japan；
3,3',4,4'-benzophenonetetracarboxylic dianhydride, obtained from TCI, Japan；
4-4'-oxydiphthalic acid anhydride, obtained from TCI, Japan；
TPP (triphenylphosphine) , a curing accelerator obtained from HOKKO, Japan；
Spherical silica, FB-950 obtained from Denka, Japan；
Polyethylene, 161-P obtained from Sanyo, Japan；
Trimethoxy epoxysilane, KH-560 obtained from Chenguang chemical, China.
Test methods
The spiral flow and gel time of each of the epoxy molding compounds as well as the Tg of the molded product thereof were tested with the following test methods, respectively.
SPIRAL FLOW
In the spiral flow test the flow property of the epoxy molding compound was determined by measuring the length and weight of the resin flowing along the path of a spiral cavity. Sample for the spiral flow test was the powder sample of the epoxy molding compound. No additional preparation was required. The spiral flow test was done according to the method EMI-1-66. Test conditions were set as follows: temperature 175 ℃, pressure 70km/cm2 and cure time 90s.
GEL TIME
In the gel time test the gelation point of the epoxy molding compound was tested. In the test, a hot plate was heated to the temperature of 175℃. The powder sample of the epoxy molding compound was placed on the hot plate and let it stand as long as the sample was gelled, with stopwatch gelling time was measured (stopwatch was started immediately when the sample is placed on the hot plate and stopped when gelling was complete) .
GLASS TRANSITION TEMPERATURE Tg
In the glass transition temperature test the Tg of the molded product was tested. In the test, the sample from the extruder was made to be a sheet by a moulding machine at a moulding temperature of 180 ℃ for 150s. After moulding, put the sheet into an oven at a temperature of 180℃ for 6 hours. The sheet parameter is 5cm*1cm*0.4cm. Tg of the sheet was measured using DMA (Dynamic thermo-mechanical analysis) , where the sample was placed in the DMA machine, the heating rate was 3℃/min, the heating was carried out until 300℃, the frequency was 5Hz and the Tg was the peak of tan δ figure.
Examples 1-3 and Comparative Example 1
Preparation of Epoxy Molding Compounds
Table 1
The raw materials used for the epoxy molding compound of each of Examples 1-3 according to the present invention and Comparative Example 1 were weighed up as shown in Table 1. All the raw materials were added into a high speed mixture, and were mixed for 15 minutes at 300r/min under room temperature to get a premixed powder； The premixed powder was then put into the feeding bucket of an extruder, and was extruded at about 100℃ with the rotation speed of the paddle being 120rpm； The extruded material was obtained and crushed into powder.
The obtained powdered epoxy molding compounds were tested for their spiral flow and gel time properties, and molded sheet were obtained from each of the epoxy molding compounds for Tg test.
The results of the spiral flow test, gel time test and Tg test of Examples 1-3 and Comparative Example 1 are shown in Table 2.
Table 2
As shown in Table 2, the spiral flow values of the epoxy molding compounds of the present invention are higher than 60cm and the gel time values of the epoxy molding compounds of the present invention are over 20 s. These two properties are comparable with the corresponding values of the Comparative Example 1. While the Tg values of the moulded samples of the present invention are higher than 260℃, which is much higher than the Tg value of the comparative molded sample of the Comparative Example 1.
Although the multi-functional phenol hardener used in the Comparative Example 1 has a quite high cross density, but the Tg of the moulded sample is still not high enough to meet high power device’ working temperature demand. By using the specific bi-anhydride hardeners, the molded samples produced from the epoxy molding compounds of the present invention show much higher Tg and these kind of materials can be used in the applications of high power electrical or electronic devices.
Claims (10)
- An epoxy molding compound, comprising(a) an epoxy resin；(b) a hardener；(c) a curing accelerator；(d) a filler； and optionally(e) an additives,wherein said hardener is one or more bi-anhydride compounds represented by the following structure (1) :
wherein, R represents a direct bond, -S-, -O-, -CH2-,
in which n is 1 –3,
- An epoxy molding compound according to claim 1, wherein the epoxy resin (a) is selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, biphenyl epoxy resins, tetramethylbiphenyl epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, naphthol novolac epoxy resins, naphtholaralkyl epoxy resins, brominated bisphenol epoxy resins, alicyclic epoxy resins, glycidyl ether epoxy resins, and mixtures thereof.
- An epoxy molding compound according to claim 1, wherein the bi-anhydride hardener (b) is one or more compounds represented by the following structure (1) :
wherein R represents a direct bond, -S-, -O-, -CH2-,
- An epoxy molding compound according to claim 1, wherein the curing accelerator (c) is one or more selected from the group consisting of imidazole-based curing accelerators, phosphor-based curing accelerators, and amine-based curing accelerators.
- An epoxy molding compound according to claim 1, wherein the filler (d) is one or more selected from the group consisting of silica, alumina, titania, aluminium hydroxide, silicon nitride, talc, clay, and glass fiber.
- An epoxy molding compound according to claim 1, wherein the additive (e) is one or more selected from the group consisting of releasing agents, coupling agents, pigments, stress modifiers, and flame retardants.
- An epoxy molding compound according to any one of claims 1 to 6, wherein the compound comprises:(a) 3 to 20 wt. ％of the epoxy resin；(b) 3 to 15 wt. ％of the anhydride hardener；(c) 0.05 to 1 wt. ％of the curing accelerator；(d) 60 to 90 wt. ％of the filler； and(e) 0 to 2 wt. ％of the additives,wherein the weight percentages are based on the total weight of the epoxy molding compound.
- An epoxy molding compound according to any one of claims 1 to 6, wherein the compound comprises:(a) 3 to 10 wt. ％of the epoxy resin；(b) 5 to 12 wt. ％of the hardener；(c) 0.1 to 0.3 wt. ％of the curing accelerator；(d) 75 to 85 wt. ％of the filler； and(e) 0.5 to 1 wt. ％of the additives.wherein the weight percentages are based on the total weight of the epoxy molding compound.
- A process for manufacturing the epoxy molding compound according to any one of claims 1 to 8, comprising steps of:(1) Weighing up all of the components (a) to (e) and putting them in a high speed mixer to get a premixed powder； and(2) Putting the premixed powder into an extruder to further mix the premixed powder at 80～120℃ and then crushing the extruded material into powder.
- Use of the epoxy molding compound according to any one of claims 1 to 8 as transistor material, printed circuit board material, electronic circuit board material, adhesives, and interlayer insulating materials in electrical and electronic devices.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201580077933.3A CN108350148A (en) | 2015-03-19 | 2015-03-19 | Use the epoxy molding compounds of anhydride hardener, preparation method and use |
| PCT/CN2015/074566 WO2016145647A1 (en) | 2015-03-19 | 2015-03-19 | Epoxy molding compound using anhydride hardener, manufacturing process and use thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/074566 WO2016145647A1 (en) | 2015-03-19 | 2015-03-19 | Epoxy molding compound using anhydride hardener, manufacturing process and use thereof |
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| WO2016145647A1 true WO2016145647A1 (en) | 2016-09-22 |
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| CN112250837B (en) * | 2020-10-26 | 2023-05-05 | 南京先进生物材料与过程装备研究院有限公司 | Bio-based furan epoxy resin and method for preparing bio-based furan epoxy resin by thermal curing of solvent-free anhydride |
Citations (7)
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| CN103396529B (en) * | 2013-07-11 | 2016-01-06 | 东华大学 | A kind of high temperature resistant electric insulation veneer sheet matrix resin and preparation method thereof |
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- 2015-03-19 WO PCT/CN2015/074566 patent/WO2016145647A1/en active Application Filing
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| GB1467275A (en) * | 1973-06-22 | 1977-03-16 | Gen Electric | Dianhydrides |
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| JPS57119946A (en) * | 1981-01-19 | 1982-07-26 | Ube Ind Ltd | Modified epoxy resin composition |
| JPH0258527A (en) * | 1988-08-24 | 1990-02-27 | Sumitomo Bakelite Co Ltd | Substrate for optical disc |
| US6207789B1 (en) * | 1997-06-03 | 2001-03-27 | Hitachi Chemical Co., Ltd. | Phenolic resin, resin composition, molding material for encapsulation, and electronic component device |
| CN1313872A (en) * | 1998-06-25 | 2001-09-19 | Abb团体研究有限公司 | Resin system |
| JP2001072831A (en) * | 1999-09-06 | 2001-03-21 | Shin Etsu Chem Co Ltd | Liquid epoxy resin composition for sealing semiconductor |
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| CN108350148A (en) | 2018-07-31 |
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