KR890013755A - 반도체 봉지용 에폭시 수지 조성물 - Google Patents

반도체 봉지용 에폭시 수지 조성물 Download PDF

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Publication number
KR890013755A
KR890013755A KR1019880001572A KR880001572A KR890013755A KR 890013755 A KR890013755 A KR 890013755A KR 1019880001572 A KR1019880001572 A KR 1019880001572A KR 880001572 A KR880001572 A KR 880001572A KR 890013755 A KR890013755 A KR 890013755A
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KR
South Korea
Prior art keywords
epoxy resin
bismaleimide
semiconductor encapsulation
noblock
resin composition
Prior art date
Application number
KR1019880001572A
Other languages
English (en)
Other versions
KR910008560B1 (ko
Inventor
박정옥
김명중
송주옥
Original Assignee
허신구
주식회사 럭키
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 허신구, 주식회사 럭키 filed Critical 허신구
Priority to KR1019880001572A priority Critical patent/KR910008560B1/ko
Priority to EP89902660A priority patent/EP0372017B1/en
Priority to US07/411,495 priority patent/US5041474A/en
Priority to AT89902660T priority patent/ATE129000T1/de
Priority to DE68924521T priority patent/DE68924521T2/de
Priority to PCT/KR1989/000003 priority patent/WO1989007627A1/en
Priority to JP1502464A priority patent/JPH066626B2/ja
Publication of KR890013755A publication Critical patent/KR890013755A/ko
Application granted granted Critical
Publication of KR910008560B1 publication Critical patent/KR910008560B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음.

Description

반도체 봉지용 에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. (1) 다관능 에폭시 화합물7-20중량부 (2) 이미드 변성실리콘 화합물 0.1-13중량부 (3) 노블락형 페놀수지 2.5-15중량부 (4) 무기충진제 60-80중량부가 구성된 것을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물에 관한 것이다.
  2. 제1항에 있어서, 다관능 에폭시 화합물이 에목시 당량이 180-240이고, 연화점이 60-110℃임이 특징인 반도체 봉지 에폭시 수지 조성물.
  3. 제1항 또는 제2항에 있어서, 다관능 에폭시 화합물이 1분자중에 2개 이상의 에폭시기를 함유하는 에폭시 수지로서 글리시딜 에테르형 에폭시 수지, 페놀 노블락형 에폭시수지, 크레졸 노블락형 에폭시 수지, 글리시딜 에스테르형 에폭시수지, 글리시딜 아민형 에폭시 수지, 선형 지방족 에폭시수지, 지환형 에폭시수지, 복소환형 에폭시 수지 및 할로겐화 에폭시 수지임이 특징인 반도체 봉지용 에폭시 수지 조성물.
  4. 제1항에 있어서, 이미드 변성실리콘 화합물이 아민기를 함유하는 폴리실록산과 이미드를 반응시켜 얻어짐이 특징인 반도체 봉지용 에폭시 수지 조성물.
  5. 제4항에 있어서, 아민기를 함유한 폴리실록산이 디메틸 실리콘, 메틸페닐 실리콘, 에폭시 변성실리콘, 디메틸 디페닐 공중합 실리콘, 지방산 변성실리콘, 실리콘 폴리에테르 공중합임이 특징인 반도체 봉지용 에폭시 수지 조성물.
  6. 제4항에 있어서, 이미드가 비스말레이미드로서 N,N'-1,3페닐렌 비스말레이미드, N,N'-1,3-페닐렌비스말레이미드, N,N'-4,4'-디페닐메탄 비스말레이미드, N,N'-4,4'-디페닐 에테르 비스말레이미드, N,N'-4,4'-디페닐설폰 비스말레이미드, N,N'-3,4-디페닐설폰 비스말레이미드, N,N'-4,4'-디사이클로핵실메탄 비스말레이미드, N,N'-4,4'-디페닐 사이클로헥산 비스말레이미드, N,N'-1,3-자일리렌 비스말레이미드, 2,4-비스말레이미드 톨루엔, 2,6-비스말레이미드 톨루엔에서 선택된 것이 특징인 반도체 봉지용 에폭시 수지 조성물.
  7. 제1항에 있어서, 노블락형 페놀수지는 페놀 노블락수지, 크레졸 노블락 수지, 테트라 부틸 페놀 노블락 수지에서 선택된 것이 특징인 반도체 봉지용 에폭시 수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880001572A 1988-02-15 1988-02-15 반도체 봉지용 에폭시 수지 조성물 KR910008560B1 (ko)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1019880001572A KR910008560B1 (ko) 1988-02-15 1988-02-15 반도체 봉지용 에폭시 수지 조성물
EP89902660A EP0372017B1 (en) 1988-02-15 1989-02-15 Epoxy resin compositions for sealing semiconductor devices
US07/411,495 US5041474A (en) 1988-02-15 1989-02-15 Epoxy resin compositions for sealing semiconductor devices
AT89902660T ATE129000T1 (de) 1988-02-15 1989-02-15 Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen.
DE68924521T DE68924521T2 (de) 1988-02-15 1989-02-15 Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen.
PCT/KR1989/000003 WO1989007627A1 (en) 1988-02-15 1989-02-15 Epoxy resin compositions for sealing semiconductor devices
JP1502464A JPH066626B2 (ja) 1988-02-15 1989-02-15 半導体装置封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019880001572A KR910008560B1 (ko) 1988-02-15 1988-02-15 반도체 봉지용 에폭시 수지 조성물

Publications (2)

Publication Number Publication Date
KR890013755A true KR890013755A (ko) 1989-09-25
KR910008560B1 KR910008560B1 (ko) 1991-10-19

Family

ID=19272256

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880001572A KR910008560B1 (ko) 1988-02-15 1988-02-15 반도체 봉지용 에폭시 수지 조성물

Country Status (7)

Country Link
US (1) US5041474A (ko)
EP (1) EP0372017B1 (ko)
JP (1) JPH066626B2 (ko)
KR (1) KR910008560B1 (ko)
AT (1) ATE129000T1 (ko)
DE (1) DE68924521T2 (ko)
WO (1) WO1989007627A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496588B1 (ko) * 1997-04-07 2005-09-09 신에쓰 가가꾸 고교 가부시끼가이샤 난연성에폭시수지조성물
KR100556981B1 (ko) * 2001-10-16 2006-03-03 닛토덴코 가부시키가이샤 전자부품

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US5082880A (en) * 1988-09-12 1992-01-21 Mitsui Toatsu Chemicals, Inc. Semiconductor sealing composition containing epoxy resin and polymaleimide
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
US5180627A (en) * 1990-11-30 1993-01-19 Ube Industries, Ltd. Heat resistant adhesive composition
KR960010844B1 (ko) * 1991-07-11 1996-08-09 제일모직 주식회사 내열성이 향상된 반도체소자 밀봉용 수지조성물
GB2279958B (en) * 1993-07-13 1997-11-05 Kobe Steel Europ Ltd Siloxane-imide block copolymers for toughening epoxy resins
US5736619A (en) * 1995-04-21 1998-04-07 Ameron International Corporation Phenolic resin compositions with improved impact resistance
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JP4793565B2 (ja) * 2005-03-24 2011-10-12 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
DE102005046641B4 (de) 2005-09-29 2019-08-22 Tib Chemicals Ag Verfahren zum Schutz der Aussenflächen von metallischen Werkstoffen gegen Korrosion durch Beschichtung mit härtbaren Mischungen auf der Basis von Glycidylverbindungen und aminischen Härtern
DE102005046642B4 (de) 2005-09-29 2019-08-22 Tib Chemicals Ag Verfahren zum Schutz der Innenflächen von metallischen Bauteilen gegen Korrosion
CN102108184B (zh) * 2009-12-24 2015-04-22 汉高股份有限及两合公司 一种环氧树脂组合物及其应用
JP6147561B2 (ja) * 2012-06-26 2017-06-14 株式会社日本触媒 硬化性樹脂組成物及び封止材
DE102017215298A1 (de) * 2017-09-01 2019-03-07 Robert Bosch Gmbh Verbundwerkstoff und Verfahren zu seiner Herstellung
CN110183823A (zh) * 2019-06-25 2019-08-30 苏州宇希新材料科技有限公司 一种高韧性环氧树脂组合物
CN110183822A (zh) * 2019-06-25 2019-08-30 苏州宇希新材料科技有限公司 一种高韧性环氧树脂组合物的制备方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496588B1 (ko) * 1997-04-07 2005-09-09 신에쓰 가가꾸 고교 가부시끼가이샤 난연성에폭시수지조성물
KR100556981B1 (ko) * 2001-10-16 2006-03-03 닛토덴코 가부시키가이샤 전자부품

Also Published As

Publication number Publication date
EP0372017A4 (en) 1991-10-30
WO1989007627A1 (en) 1989-08-24
EP0372017B1 (en) 1995-10-11
KR910008560B1 (ko) 1991-10-19
DE68924521D1 (de) 1995-11-16
US5041474A (en) 1991-08-20
ATE129000T1 (de) 1995-10-15
DE68924521T2 (de) 1996-05-30
EP0372017A1 (en) 1990-06-13
JPH066626B2 (ja) 1994-01-26
JPH02500315A (ja) 1990-02-01

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