KR930007996A - 다가 페놀, 및 에폭시 수지와 그로부터 유도된 에폭시 수지 조성물 - Google Patents

다가 페놀, 및 에폭시 수지와 그로부터 유도된 에폭시 수지 조성물 Download PDF

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KR930007996A
KR930007996A KR1019920018513A KR920018513A KR930007996A KR 930007996 A KR930007996 A KR 930007996A KR 1019920018513 A KR1019920018513 A KR 1019920018513A KR 920018513 A KR920018513 A KR 920018513A KR 930007996 A KR930007996 A KR 930007996A
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South Korea
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epoxy resin
carbon atoms
alkyl
general formula
polyhydric phenols
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KR1019920018513A
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English (en)
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KR100225165B1 (ko
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노리아끼 사이또
다까시 모리모또
가즈오 다께베
유따까 시오미
시게끼 나이또오
슈이찌 가나가와
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모리 히데오
스미또모가가꾸고오교 가부시끼가이샤
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Publication of KR930007996A publication Critical patent/KR930007996A/ko
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Publication of KR100225165B1 publication Critical patent/KR100225165B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

하기 일반식의 다가 페놀 :
(상기식에서, R1~R4는 독립적으로 수소, 탄소수 1~9의 알킬 또는 시클로알킬기, 또는 할로겐을 나타내고, X는 수소, 탄소수 1~9의 알킬기, 또는 아릴기를 나타내며 n은 평균 반복 단위수 0.1~10을 나타낸다) 출발물질로서 상기의 다가 페놀을 사용하여, 하기일반식의 에폭시수지를 제공한다.
(상기식에서, R1~R4, X 및 n은 상기에 정의한 바와 같다)
또한, 상기의 에폭시 수지와 경화제를 함유하는 에폭시 수지 조성물을 제공한다. 상기의 에폭시 수지 유래의 경화된 생성물은 작은 흡습성과, 내열성과 경화성의 균형면에서 우수하다.

Description

다가 페놀, 및 에폭시 수지와 그로부터 유도된 에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. 하기 일반식(1)의 다가 페놀 :
  3. (상기식에서, R1~R4는 독립적으로 수소, 탄소수 1~9의 알킬 또는 시클로알킬기, 또는 할로겐을 나타내고, X는 수소, 탄소수 1~9의 알킬기, 또는 아릴기를 나타내며, n은 평균 반복 단위수 0.1~10을 나타낸다).
  4. 하기 일반식(2)의 에폭시 수지 :
  6. (상기식에서, R1~R4는 독립적으로 수소, 탄소수 1~9의 알킬 또는 시클로알킬기, 또는 할로겐을 나타내고, X는 수소, 탄소수 1~9의 알킬기, 또는 아릴기를 나타내며, n은 평균 반복 단위수 0.1~10을 나타낸다).
  7. 제2항에서 정의된 에폭시 수지 및 경화제를 함유하는 에폭시 수지 조성물.
  8. 제3항에 있어서, 경화제가 다가 페놀인 에폭시 수지 조성물.
  9. 반도체 장치의 캡슐화용 제3항 또는 제4항의 에폭시 수지 조성물.
  10. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920018513A 1991-10-09 1992-10-08 다가페놀 및 에폭시 수지와 그로부터 유도된 에폭시수지 조성물 KR100225165B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3261898A JPH0597948A (ja) 1991-10-09 1991-10-09 多価フエノール、それから誘導されるエポキシ樹脂及びエポキシ樹脂組成物
JP91-261898 1991-10-09
US91-261898 1991-10-09

Publications (2)

Publication Number Publication Date
KR930007996A true KR930007996A (ko) 1993-05-20
KR100225165B1 KR100225165B1 (ko) 1999-10-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920018513A KR100225165B1 (ko) 1991-10-09 1992-10-08 다가페놀 및 에폭시 수지와 그로부터 유도된 에폭시수지 조성물

Country Status (9)

Country Link
US (3) US5395912A (ko)
EP (1) EP0536749B1 (ko)
JP (1) JPH0597948A (ko)
KR (1) KR100225165B1 (ko)
CA (1) CA2079991A1 (ko)
DE (1) DE69224694T2 (ko)
MY (2) MY107554A (ko)
SG (1) SG47416A1 (ko)
TW (1) TW206248B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3161022B2 (ja) * 1992-04-30 2001-04-25 住友化学工業株式会社 エポキシ樹脂組成物及び樹脂封止型半導体装置
JP2002037859A (ja) * 2000-07-19 2002-02-06 Sumitomo Chem Co Ltd 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
CN100378165C (zh) * 2003-11-03 2008-04-02 长春人造树脂厂股份有限公司 光半导体封装用的环氧树脂组合物
DE112011100378T5 (de) * 2010-01-29 2012-12-06 Nippon Kayaku Kabushiki Kaisha Phenolische Verbindung, Epoxyharz, Epoxyharz-Zusammensetzung, Prepreg, und gehärtetes Produkt daraus
GB2533776B (en) * 2014-12-23 2020-11-04 Hexcel Composites Ltd Resin Composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1873849A (en) * 1928-11-26 1932-08-23 Celanese Corp Synthetic resin and process of making the same
US2844553A (en) * 1953-04-24 1958-07-22 Sherwin Williams Co Polyhydric phenol-aldehyde-epihalo-hydrin resins
JPS511436B2 (ko) * 1971-10-30 1976-01-17
US4550128A (en) * 1984-04-16 1985-10-29 International Business Machines Corporation Epoxy composition
DE4031575A1 (de) * 1990-06-13 1991-12-19 Hoechst Ag Phenolharz, verfahren zu seiner herstellung und verwendung

Also Published As

Publication number Publication date
EP0536749A1 (en) 1993-04-14
KR100225165B1 (ko) 1999-10-15
MY107554A (en) 1996-04-08
TW206248B (ko) 1993-05-21
US5560968A (en) 1996-10-01
DE69224694T2 (de) 1998-07-23
DE69224694D1 (de) 1998-04-16
CA2079991A1 (en) 1993-04-10
US5462997A (en) 1995-10-31
EP0536749B1 (en) 1998-03-11
JPH0597948A (ja) 1993-04-20
US5395912A (en) 1995-03-07
MY111999A (en) 2001-03-31
SG47416A1 (en) 1998-04-17

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