KR880014051A - 에폭시수지 조성물 - Google Patents

에폭시수지 조성물 Download PDF

Info

Publication number
KR880014051A
KR880014051A KR1019880006366A KR880006366A KR880014051A KR 880014051 A KR880014051 A KR 880014051A KR 1019880006366 A KR1019880006366 A KR 1019880006366A KR 880006366 A KR880006366 A KR 880006366A KR 880014051 A KR880014051 A KR 880014051A
Authority
KR
South Korea
Prior art keywords
ethyl
methyl
benzene
epoxy resin
tert
Prior art date
Application number
KR1019880006366A
Other languages
English (en)
Inventor
에이키 도가시
도시마사 다카타
Original Assignee
다케바야시 쇼고
미쓰이세키유 가가쿠고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다케바야시 쇼고, 미쓰이세키유 가가쿠고교 가부시키가이샤 filed Critical 다케바야시 쇼고
Publication of KR880014051A publication Critical patent/KR880014051A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/93—Reaction product of a polyhydric phenol and epichlorohydrin or diepoxide, having a molecular weight of over 5,000, e.g. phenoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

에폭시수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. (A)하기일반식
    (식중, R1내지 R3은, 수소원자 또는 탄소원자수 6이하의 알킬기, R4내지 R11은, 수소원자, 탄소원자수 6이하의 알킬기 또는 할로겐원자이고, 이들 R1내지 R11의 각기는 서로 동일한 기 이어도 좋다). 로 표시되는 페놀 유도체와, 에피클로로 히드린과의 축합반응에 의하여 얻어지는 3관능성 에폭시수지, 및 (B)노볼락형 페놀수지로 구성되는 것을 특징으로 하는 에폭시수지 조성물.
  2. 제 1 항에 있어서, 상기 노볼락형 페놀수지는, 상기 에폭시수지 100 중량부당 20 내지 120 중량부의 비율로 사용되는 것을 특징으로 하는 조성물.
  3. 제 1 항에 있어서, 상기 페놀 유도체는 일반식(1)에서 3개의 페놀성 수산기가 각 페놀기의 파라위치에 결합해있는 에폭시수지인 것을 특징으로 하는 조성물.
  4. 제 1 항에 있어서, 상기 페놀 유도체는 일반식(Ⅰ)에서 R1내지 R4가 탄소수 4이하인 알칼기인 것을 특징으로 하는 조성물.
  5. 제 4 항에 있어서, 상기 페놀 유도체는 일반식(Ⅰ)에서 R4내지 R4가 메틸기인것을 특징으로 하는 조성물.
  6. 제 1 항에 있어서, 상기 페놀 유도체는 일반식(Ⅰ)에서 R4내지 R11이 수소원자, 메틸기 또는 3차 부틸기중 하나인것을 특징으로 하는 조성물.
  7. 제 1 항에 있어서, 상기 3관능성 에폭시수지는, 1-[α-메틸-α-(4'글리시드옥시페닐)에틸]-4-[α',α-비스(4'-글리시드옥시페닐)에틸]벤젠, 1-[α-메틸-α-(2'-메틸-4'-글리시드옥시-5'-3차부틸페닐)에틸]-4-[α',α-비스(2'-메틸-4'-글리시드옥시-5'-3차부틸페닐)에틸]벤젠, 1-[α-메틸-α-(3'-5'-디메틸-4'-글리시드옥시페닐)에틸]벤젠, -4-[α',α-비스(3'-5'-디메틸-4'-글리시드옥시페닐)에틸]벤젠, 1-[α-메틸-α-(3'-3차부틸-4'-글리시드옥시페닐)에틸]-4-[α',α-비스(3'-3차부틸-4'-글리시드옥시페닐)에틸]벤젠, 1-[α-메틸-α-(3'-메틸-4'-글리시드옥시-5'-3차부틸페닐)에틸]-4-[α',α-비스(3'-메틸-4'-글리시드옥시-5'-3차부틸페닐)에틸]벤젠, 1-[α-메틸-α-(2'-5'-디메틸-4'-글리시드옥시페닐)에틸]-4-[α',α-비스(2'-5'-디메틸-4'-글리시드옥시페닐)에틸]벤젠으로 구성되는 군에서 선택되는 것을 특징으로 하는 조성물.
  8. 제 1 항의 에폭시수지 조성물로 구성되는 반도체 봉지용 재료.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880006366A 1987-05-30 1988-05-30 에폭시수지 조성물 KR880014051A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP?62-133518 1987-05-30
JP62133518A JPH0733430B2 (ja) 1987-05-30 1987-05-30 エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
KR880014051A true KR880014051A (ko) 1988-12-22

Family

ID=15106654

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880006366A KR880014051A (ko) 1987-05-30 1988-05-30 에폭시수지 조성물

Country Status (4)

Country Link
US (1) US4835240A (ko)
EP (1) EP0294148A3 (ko)
JP (1) JPH0733430B2 (ko)
KR (1) KR880014051A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714744B2 (ja) * 1988-12-15 1995-02-22 旭有機材工業株式会社 集積回路用トレー
US4999135A (en) * 1989-04-17 1991-03-12 Hiroshi Matsuda Rust-proof sealing composition
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
JPH0314818A (ja) * 1989-06-13 1991-01-23 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
CA2206384A1 (en) * 1996-05-29 1997-11-29 Eiki Togashi A method of injection-molding for epoxy resin moldings and an injection-moldable epoxy resin composition
JPH10245473A (ja) * 1997-03-03 1998-09-14 Yuka Shell Epoxy Kk エポキシ樹脂組成物
US6783918B2 (en) 2000-08-30 2004-08-31 Lexmark International, Inc. Radiation curable resin layer
US20080090967A1 (en) * 2006-10-13 2008-04-17 Indspec Chemical Corporation Modified Alkylresorcinol Resins and Applications Thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3218370A (en) * 1958-05-28 1965-11-16 Union Carbide Corp Heat hardenable compositions of tri- or tetra-glycidyl ethers and phenolic resins
US3309339A (en) 1963-11-12 1967-03-14 Allied Chem New trisphenols and epoxide resins prepared therefrom
DE1645202A1 (de) 1966-04-02 1970-04-23 Reichhold Albert Chemie Ag Heisshaertbare Formmasse auf der Grundlage von aromatischen Diglycidylaethern
US3941850A (en) * 1972-05-12 1976-03-02 The Quaker Oats Company α,α,α',α'-TETRAKIS(4-HYDROXY-3,5-DISUBSTITUTED PHENYL)XYLENE
US4216298A (en) * 1976-11-12 1980-08-05 Bayer Aktiengesellschaft Process for the preparation of carbonic acid bis-diphenol esters of polyester-diols and their use for the preparation of high-molecular segmented polyester/polycarbonates which can be processed as thermoplastics
JPS57141419A (en) * 1981-02-27 1982-09-01 Mitsubishi Petrochem Co Ltd Production of polyepoxide
US4505844A (en) * 1982-11-17 1985-03-19 Chevron Research Company P-Type polyphenoxazine electroactive polymers
DE3506519A1 (de) * 1985-02-23 1986-08-28 Bayer Ag, 5090 Leverkusen Spezielle epoxid-harze
US4558116A (en) * 1985-03-04 1985-12-10 The Dow Chemical Company Process for preparing relatively high molecular weight epoxy resins
JPS6274923A (ja) * 1985-09-30 1987-04-06 Mitsui Petrochem Ind Ltd 新規エポキシ樹脂
US4663400A (en) * 1986-04-28 1987-05-05 The Dow Chemical Company Epoxy resins prepared from trisphenols and dicyclopentadiene
EP0251431B1 (en) * 1986-06-24 1993-07-28 Mitsui Petrochemical Industries, Ltd. Epoxy resin
US4731423A (en) * 1986-08-13 1988-03-15 The Dow Chemical Company Meta-halo-phenolic alkylation products and epoxy systems
JPH0784510B2 (ja) * 1986-12-24 1995-09-13 三井石油化学工業株式会社 耐熱難燃性エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS63301219A (ja) 1988-12-08
EP0294148A2 (en) 1988-12-07
JPH0733430B2 (ja) 1995-04-12
EP0294148A3 (en) 1989-05-31
US4835240A (en) 1989-05-30

Similar Documents

Publication Publication Date Title
KR880007589A (ko) 다기능(Multifunctional)에폭시드 수지
KR940014674A (ko) 접착성 실리콘 고무 조성물
KR890005200A (ko) 에폭시 수지에 대한 경화제인 시아노구아니딘
KR910009771A (ko) 용융시에 이방성을 나타내는 폴리에스테르 수지 및 수지조성물
KR920019866A (ko) 열 경화성 수지 조성물
KR880014051A (ko) 에폭시수지 조성물
KR910006365A (ko) 나프톨계 에폭시 수지, 그의 중간체와 그의 제조법 및 이러한 나프톨계 에폭시 수지를 함유하는 에폭시 수지 조성물
KR880002050A (ko) 고내열성 포지티브형 포토레지스트 조성물
KR920015158A (ko) 네거티브 포토레지스트 조성물
KR920001243A (ko) 포지티브 감 방사선성 레지스트 조성물
KR910016854A (ko) 반도체 봉지용 에폭시 수지 조성물
KR870008290A (ko) 광 기록원판
KR900018279A (ko) 반도체밀봉용 수지조성물.
KR870010099A (ko) 트리스페놀 및 디사이클로펜타디엔으로부터 제조된 에폭시수지
KR920001242A (ko) 포지티브 레지스트 조성물
KR930007996A (ko) 다가 페놀, 및 에폭시 수지와 그로부터 유도된 에폭시 수지 조성물
KR930004806A (ko) 포지티브 레지스트 조성물
KR930006068A (ko) 노볼락 수지 및 이의 제조방법
KR910004693A (ko) 에폭시 수지용 경화제
KR940011518A (ko) 에폭시수지조성물 및 수지봉지형 반도체장치
KR930004387A (ko) 에폭시 수지 조성물
KR900018280A (ko) 반도체밀봉용 수지조성물
KR970027186A (ko) 개선된 점착제를 함유한 타이어 고무조성물
KR920008136A (ko) 에폭시 수지 조성물 및 반도체장치
KR870004082A (ko) 폴리올레핀 조성물

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid