KR920008136A - 에폭시 수지 조성물 및 반도체장치 - Google Patents
에폭시 수지 조성물 및 반도체장치 Download PDFInfo
- Publication number
- KR920008136A KR920008136A KR1019910019058A KR910019058A KR920008136A KR 920008136 A KR920008136 A KR 920008136A KR 1019910019058 A KR1019910019058 A KR 1019910019058A KR 910019058 A KR910019058 A KR 910019058A KR 920008136 A KR920008136 A KR 920008136A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- semiconductor devices
- resin compositions
- epoxy
- resins
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (2)
- (1)(a) 한 분자 중에 에폭시지를 적어도 2개 갖는 에폭시수지 및 (b) 하기 일반식(I)(상기, 식중 R는 수소원자, 할로겐원자 또는 탄소원자수 1 내지 5개의 1가 탄화수소이고, n은 0 내지 5의 정수임)의 에폭시 수지를 중량비 (a)/(b)=0내지 95/100내지 5의 비율로 혼합한 에폭시 수지, 및 (2) 페놀수지를 함유하고, 또한 상기 에폭시 수지(a) 및 (또는) 페놀수지의 일부 또는 전부가 치환되거나 또는 비치환된 나프탈렌 고리를 한 분자 중에 적어도 1개 갖는 것을 특징으로 하는 에폭시 수지 조성물.
- 제1항 기재의 에폭시 수지 조성물의 경화물로 봉입된 반도체 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2292715A JPH082940B2 (ja) | 1990-10-30 | 1990-10-30 | エポキシ樹脂組成物及び半導体装置 |
| JP90-292715 | 1990-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR920008136A true KR920008136A (ko) | 1992-05-27 |
Family
ID=17785377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019910019058A KR920008136A (ko) | 1990-10-30 | 1991-10-29 | 에폭시 수지 조성물 및 반도체장치 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH082940B2 (ko) |
| KR (1) | KR920008136A (ko) |
| DE (1) | DE4135533A1 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3428699B2 (ja) * | 1993-09-24 | 2003-07-22 | ジャパンエポキシレジン株式会社 | エポキシ樹脂組成物 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2938174B2 (ja) * | 1990-10-16 | 1999-08-23 | 住友ベークライト株式会社 | 樹脂組成物 |
-
1990
- 1990-10-30 JP JP2292715A patent/JPH082940B2/ja not_active Expired - Fee Related
-
1991
- 1991-10-28 DE DE4135533A patent/DE4135533A1/de not_active Withdrawn
- 1991-10-29 KR KR1019910019058A patent/KR920008136A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04164917A (ja) | 1992-06-10 |
| JPH082940B2 (ja) | 1996-01-17 |
| DE4135533A1 (de) | 1992-05-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |