KR920018141A - 에폭시 수지 조성물 및 반도체 장치 - Google Patents

에폭시 수지 조성물 및 반도체 장치 Download PDF

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Publication number
KR920018141A
KR920018141A KR1019920005191A KR920005191A KR920018141A KR 920018141 A KR920018141 A KR 920018141A KR 1019920005191 A KR1019920005191 A KR 1019920005191A KR 920005191 A KR920005191 A KR 920005191A KR 920018141 A KR920018141 A KR 920018141A
Authority
KR
South Korea
Prior art keywords
epoxy resin
semiconductor devices
resin compositions
resin composition
hydrogen atom
Prior art date
Application number
KR1019920005191A
Other languages
English (en)
Inventor
도시오 시오바라
고지 후따쯔모리
Original Assignee
카나가와 치히로
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 카나가와 치히로, 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 카나가와 치히로
Publication of KR920018141A publication Critical patent/KR920018141A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

내용 없음

Description

에폭시 수지 조성물 및 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. (A) 하기 구조식(1) 및 하기 구조식(2)로 표시되는 나프탈렌 고리 함유 에폭시 수지에서 선택되는 1종 또는 2종 이상의 에폭시 수지, (B) 페놀 수지, 및 (C) 무기질 충전제를 필수 성분으로 하는 에폭시 수지 조성물.
    상기 식 중, E는를 나타내고, R0는 수소 원자 또는, R1은 수소 원자 또는 탄소수 1 내지 6의 1가 탄화 수소기, n은 0 내지 5의 정수를 나타낸다.
  2. 제1항 기재의 에폭시 수지 조성물의 경화물로 봉지된 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920005191A 1991-03-29 1992-03-28 에폭시 수지 조성물 및 반도체 장치 KR920018141A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3091474A JPH04300915A (ja) 1991-03-29 1991-03-29 エポキシ樹脂組成物及び半導体装置
JP91-091474 1991-03-29

Publications (1)

Publication Number Publication Date
KR920018141A true KR920018141A (ko) 1992-10-21

Family

ID=14027395

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920005191A KR920018141A (ko) 1991-03-29 1992-03-28 에폭시 수지 조성물 및 반도체 장치

Country Status (3)

Country Link
EP (1) EP0506359A3 (ko)
JP (1) JPH04300915A (ko)
KR (1) KR920018141A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100364227B1 (ko) * 1997-11-27 2003-02-19 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
KR20030057107A (ko) * 2001-12-28 2003-07-04 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1261171B (it) * 1992-03-03 1996-05-09 Ruetgerswerke Ag Miscuglio resinoso a basso contenuto di prodotti di scissione.
SG63803A1 (en) * 1997-01-23 1999-03-30 Toray Industries Epoxy-resin composition to seal semiconductors and resin-sealed semiconductor device
WO2020145083A1 (ja) * 2019-01-07 2020-07-16 日東シンコー株式会社 樹脂組成物、該樹脂組成物の製造方法、及び、熱伝導性シート

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02189326A (ja) * 1989-01-18 1990-07-25 Mitsubishi Petrochem Co Ltd 電子部品封止用エポキシ樹脂組成物
JPH02258830A (ja) * 1989-03-31 1990-10-19 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
KR950009152B1 (ko) * 1990-01-25 1995-08-16 신에쓰 가가꾸 고오교 가부시끼가이샤 에폭시 수지 조성물 및 반도체 장치
JP2807341B2 (ja) * 1990-11-29 1998-10-08 日東電工株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100364227B1 (ko) * 1997-11-27 2003-02-19 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
KR20030057107A (ko) * 2001-12-28 2003-07-04 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물

Also Published As

Publication number Publication date
EP0506359A3 (en) 1993-02-03
EP0506359A2 (en) 1992-09-30
JPH04300915A (ja) 1992-10-23

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