KR930008057A - 열경화성 수지 조성물 및 반도체 장치 - Google Patents

열경화성 수지 조성물 및 반도체 장치 Download PDF

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Publication number
KR930008057A
KR930008057A KR1019920018244A KR920018244A KR930008057A KR 930008057 A KR930008057 A KR 930008057A KR 1019920018244 A KR1019920018244 A KR 1019920018244A KR 920018244 A KR920018244 A KR 920018244A KR 930008057 A KR930008057 A KR 930008057A
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KR
South Korea
Prior art keywords
resin composition
thermosetting resin
semiconductor device
low
integer
Prior art date
Application number
KR1019920018244A
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English (en)
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KR100235164B1 (ko
Inventor
도시오 시오바라
가즈또시 도미요시
다까유끼 아오끼
하쓰지 시라이시
Original Assignee
카나가와 치히로
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR930008057A publication Critical patent/KR930008057A/ko
Application granted granted Critical
Publication of KR100235164B1 publication Critical patent/KR100235164B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

본 발명은 유동성이 양호함과 동시에 저 팽창 계수, 저 응력, 높은 유리 전이 온도를 갖고, 더구나 접착성이 양호하며, 저 흡습성의 경화물을 제공하고, 반도체의 봉지용 수지로서 매우 적합한 열경화성 수지 조성물에 관한 것이다.
본 발명의 열경화성 수지 조성물은 (a)나프탈렌 고리 함유 에폭시 수지, (b)하기 일반식(1)로 표시되는 디시클로펜타디엔 변성 페놀 수지
(식 중 R1은 수소 원자 또는 탄소수 1 내지 6의 알킬기이고, n=0내지 15의 정수이다), 및 (c) 무기질 총진재를 배합해서 이루어진다.
이 열경화성 수지 조성물의 경화물로 반도체 장치를 봉지한다.

Description

열경화성 수지 조성물 및 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. (a)나프탈렌 고리 함유 에폭시 수지, (b)하기 일반식(1)로 표시되는 디시클로펜타디엔 변성 페놀 수지 및 (c)무기질 충전재를 배합해서 이루어진 것을 특징으로 하는 열경화성 수지 조성물.
    (식 중 R1은 수소 원자 또는 탄소수 1 내지 6의 알킬기이고, n=0 내지 15의 정수이다).
  2. 제1항에 기재한 열경화성 수지 조성물의 경화물로 봉지된 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920018244A 1991-10-07 1992-10-06 열경화성 수지 조성물 및 반도체 장치 KR100235164B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3286993A JPH0597970A (ja) 1991-10-07 1991-10-07 熱硬化性樹脂組成物及び半導体装置
JP91-286993 1991-10-07

Publications (2)

Publication Number Publication Date
KR930008057A true KR930008057A (ko) 1993-05-21
KR100235164B1 KR100235164B1 (ko) 1999-12-15

Family

ID=17711633

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920018244A KR100235164B1 (ko) 1991-10-07 1992-10-06 열경화성 수지 조성물 및 반도체 장치

Country Status (4)

Country Link
US (1) US5312878A (ko)
JP (1) JPH0597970A (ko)
KR (1) KR100235164B1 (ko)
DE (1) DE4233450C2 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3288185B2 (ja) * 1994-10-07 2002-06-04 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料及びそれを用いた半導体装置
JP3734602B2 (ja) * 1997-05-29 2006-01-11 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物および半導体封止用エポキシ樹脂組成物
TW452944B (en) * 1997-06-03 2001-09-01 Hitachi Chemical Co Ltd Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
JPH11140277A (ja) * 1997-11-10 1999-05-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びこれを用いた半導体装置
JP3349963B2 (ja) * 1998-10-21 2002-11-25 日本電気株式会社 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置
US7943706B2 (en) * 2005-03-24 2011-05-17 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
JP4835851B2 (ja) * 2005-11-07 2011-12-14 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
ES2374844T3 (es) * 2006-06-16 2012-02-22 Huntsman Advanced Materials (Switzerland) Gmbh Sistema de revestimiento.
US20110221017A1 (en) * 2008-11-07 2011-09-15 Sumitomo Bakelite Company, Ltd. Photosensitive resin composition, photosensitive adhesive film, and light-receiving device
KR101678256B1 (ko) * 2009-10-09 2016-11-21 스미토모 베이클리트 컴퍼니 리미티드 반도체 장치
JP7074278B2 (ja) 2018-04-10 2022-05-24 エルジー・ケム・リミテッド 半導体パッケージ用熱硬化性樹脂組成物、プリプレグおよび金属箔積層板
EP3853283A4 (en) 2018-09-21 2022-07-27 Toray Industries, Inc. EPOXY RESIN COMPOSITION, PREPREG AND FIBER REINFORCED COMPOSITES

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JPS60237081A (ja) * 1984-05-10 1985-11-25 Agency Of Ind Science & Technol 新規ポリグリシジルエ−テル及びその製法
JPS6296521A (ja) * 1985-10-23 1987-05-06 Mitsubishi Gas Chem Co Inc エポキシ樹脂組成物
JPS62201923A (ja) * 1985-10-31 1987-09-05 Sanyo Kokusaku Pulp Co Ltd エポキシ樹脂組成物
JPH0791446B2 (ja) * 1987-03-31 1995-10-04 株式会社東芝 樹脂封止半導体装置
JPH01105562A (ja) * 1987-10-19 1989-04-24 Sumitomo Bakelite Co Ltd 樹脂封止型半導体装置
MY104894A (en) * 1988-12-08 1994-06-30 Sumitomo Bakelite Co Epoxy resin composition for semiconductor sealing.
JPH02189326A (ja) * 1989-01-18 1990-07-25 Mitsubishi Petrochem Co Ltd 電子部品封止用エポキシ樹脂組成物
JPH0617440B2 (ja) * 1989-05-30 1994-03-09 新日鐵化学株式会社 新規エポキシ樹脂及びその製造法
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JPH06296521A (ja) * 1993-04-12 1994-10-25 Michiko Nakamura リユツクサツクのベルト収納部

Also Published As

Publication number Publication date
JPH0597970A (ja) 1993-04-20
DE4233450A1 (de) 1993-04-08
DE4233450C2 (de) 1997-06-05
US5312878A (en) 1994-05-17
KR100235164B1 (ko) 1999-12-15

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