KR940011518A - 에폭시수지조성물 및 수지봉지형 반도체장치 - Google Patents

에폭시수지조성물 및 수지봉지형 반도체장치 Download PDF

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Publication number
KR940011518A
KR940011518A KR1019930023527A KR930023527A KR940011518A KR 940011518 A KR940011518 A KR 940011518A KR 1019930023527 A KR1019930023527 A KR 1019930023527A KR 930023527 A KR930023527 A KR 930023527A KR 940011518 A KR940011518 A KR 940011518A
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
same
semiconductor device
encapsulated semiconductor
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KR1019930023527A
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English (en)
Inventor
야수히데 수기야마
유타카 시오미
타카시 모리모토
노리아키 사이토오
신이치로오 키타야마
미치오 수주키
카주오 사키야마
Original Assignee
코오니시 아키오
수미토모카가쿠코오교오 카부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 코오니시 아키오, 수미토모카가쿠코오교오 카부시키가이샤 filed Critical 코오니시 아키오
Publication of KR940011518A publication Critical patent/KR940011518A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/22—Ethers with hydroxy compounds containing no oxirane rings with monohydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내열성, 저흡습성에 더하여 접착성이 높고 내균열성에 우수한 경화물을 제공하는 에폭시수지조성물 및 이것을 사용하여 봉지한 반도체장치를 제공한다.
일반식(1)
(식중, R1은 수소원자, 탄소수 1∼6의 알킬 또는 시클로알킬기, 치환 또는 비치환페닐기 또는 할로겐원자를 나타내고, 2개 이상의 R1이 동일 또는 다른 고리중에 존재할 경우 서로 동일하거나 달라도 좋다. m은 0∼4의 정수를 나타낸다)로 표시되는 에폭시수지와 경화제로서 다가(多價)페놀을 필수성분으로 함유하는 에폭시수지조성물.

Description

에폭시수지조성물 및 수지봉지형 반도체장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. 일반식(1)
    (식중, R1은 수소원자, 탄소수 1∼6의 알킬 또는 시클로알킬기, 치환 또는 비치환페닐기 또는 할로겐원자를 나타내고, 2개 이상의 R1이 동일 또는 다른 고리중에 존재할 경우 서로 동일하거나 달라도 좋다. m은 0∼4의 정수를 나타낸다)로 표시되는 에폭시수지와 경화제로서 다가(多價)페놀을 필수성분으로 함유하는 에폭시수지조성물.
  2. 청구범위 제1항의 에폭시수지조성물을 사용하여 반도체소자를 봉지하여 이루어지는 수지봉지형 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930023527A 1992-11-10 1993-11-06 에폭시수지조성물 및 수지봉지형 반도체장치 KR940011518A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4299702A JPH06199990A (ja) 1992-11-10 1992-11-10 エポキシ樹脂組成物および樹脂封止型半導体装置
JP92-299702 1992-11-10

Publications (1)

Publication Number Publication Date
KR940011518A true KR940011518A (ko) 1994-06-21

Family

ID=17875942

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930023527A KR940011518A (ko) 1992-11-10 1993-11-06 에폭시수지조성물 및 수지봉지형 반도체장치

Country Status (4)

Country Link
EP (1) EP0598302A1 (ko)
JP (1) JPH06199990A (ko)
KR (1) KR940011518A (ko)
CA (1) CA2102653A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6320020B1 (en) * 1998-09-08 2001-11-20 Mitsui Chemicals, Inc. Sulfur-containing (thio)ether (co)polymer and a use thereof
JP2001279064A (ja) * 2000-03-31 2001-10-10 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
JP2001288338A (ja) * 2000-04-10 2001-10-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN1518578A (zh) * 2001-01-19 2004-08-04 О 用于环氧树脂的固化剂和环氧树脂组合物
JP4675777B2 (ja) * 2003-02-03 2011-04-27 新日鐵化学株式会社 エポキシ樹脂、その製造方法、それを用いたエポキシ樹脂組成物及び硬化物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6701600A (ko) * 1967-02-02 1967-04-25
FR1541474A (fr) * 1967-10-18 1968-10-04 Dow Chemical Co Procédé pour préparer des éthers de composés de thiobisphénols
JPS4945152B1 (ko) * 1970-05-28 1974-12-02
JP2767310B2 (ja) * 1990-02-16 1998-06-18 油化シエルエポキシ株式会社 半導体封止用エポキシ樹脂組成物

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Publication number Publication date
JPH06199990A (ja) 1994-07-19
CA2102653A1 (en) 1994-05-11
EP0598302A1 (en) 1994-05-25

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