KR930010622A - 네가티브형 레지스터 조성물 - Google Patents

네가티브형 레지스터 조성물 Download PDF

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KR930010622A
KR930010622A KR1019920021369A KR920021369A KR930010622A KR 930010622 A KR930010622 A KR 930010622A KR 1019920021369 A KR1019920021369 A KR 1019920021369A KR 920021369 A KR920021369 A KR 920021369A KR 930010622 A KR930010622 A KR 930010622A
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South Korea
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group
carbon atoms
hydrogen atom
alkali
acid
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KR1019920021369A
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KR100241478B1 (ko
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도오루 가지따
에이이찌 고바야시
도시유끼 오오다
다꾸오 미우라
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아사구라 다쓰오
니혼 고오세이 고무 가부시끼가이샤
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0755Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/38Treatment before imagewise removal, e.g. prebaking
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C37/00Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
    • C07C37/11Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms
    • C07C37/16Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms by condensation involving hydroxy groups of phenols or alcohols or the ether or mineral ester group derived therefrom
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C37/00Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
    • C07C37/11Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms
    • C07C37/20Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms using aldehydes or ketones
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/0226Quinonediazides characterised by the non-macromolecular additives
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)

Abstract

본 발명은 (A)알칼리 가용성 수지(B)방사선 조사에 의해 산을 발생하는 화합물 및 (C)방향족 고리에 직결한 관능기로서 -OR기(여기에서, R은 치환 메틸기, 치환에틸기, 실릭기, 알콕시카르보닐기 또는 아실기임) 및 -CH₂OX(여기에서, X는 수소원자, 탄소수1-5의 알킬기 또는 상기 R을 정의할 수 있는 것임)을 갖고 산 존재하에서 상기 알칼리 가용성 수지를 가교할 수 있는 방향족 화합물로 이루어진 네가티브형 레지스트 조성물에 관한 것이다.

Description

네가티브형 레지스터 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. (A)알칼리 가용성 수지(B)방사선 조사에 의해 산을 발생하는 화합물, 및 (C)방향족 고리에 직결한 관응기로서 -OR기(여기에서, R은 치환 메틸기, 치환에틸기, 실릴기, 알콕시카르보닐기 또는 아실기임) 및 -CH₂OX(여기에서, X는 수소원자, 탄소수1-5-의 알킬기 또는 상기 R을 정의할 수 있는 것임)을 갖고, 산 존재하에서 상기 알칼리 가용성 수지를 가교할 수 있는 방향족 화합물로 이루어진 네가티브형 레지스트 조성물.
  2. 제1항에 있어서, 하기 구조식(1)로 나타내는 페놀 화합물을 함유하는 네가티브형 레지스트 조성물.
    여기에서 R1∼R8은 수소원자, 탄소수 4이하의 알킬기 및 탄소수 1∼4의 알콕시기에서 선택되는 치환기이고, A는 단일결합,에서 선택되는 결합을 나타내며, 여기서 R9및 R10은 수소원자, 탄소수 4이하의 알킬기, 페닐기 히드록시페닐기에서 선택되는 치환기를 나타내고, R9및 R10이 모두 탄소수 4이하의 알킬기인 경우, 이 알킬기는 서로 단일결합에 의해서 결합되어 있어도 좋다.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920021369A 1991-11-15 1992-11-13 네가티브형 레지스트 조성물 KR100241478B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-326748 1991-11-15
JP3326748A JP3016231B2 (ja) 1991-11-15 1991-11-15 ネガ型レジスト組成物

Publications (2)

Publication Number Publication Date
KR930010622A true KR930010622A (ko) 1993-06-22
KR100241478B1 KR100241478B1 (ko) 2000-03-02

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KR1019920021369A KR100241478B1 (ko) 1991-11-15 1992-11-13 네가티브형 레지스트 조성물

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US (1) US5376498A (ko)
EP (1) EP0542572A1 (ko)
JP (1) JP3016231B2 (ko)
KR (1) KR100241478B1 (ko)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2782150B2 (ja) * 1992-07-15 1998-07-30 松下電器産業株式会社 新規なネガ型レジスト材料及びパタ−ン形成方法
JPH075687A (ja) * 1993-06-18 1995-01-10 Mitsui Toatsu Chem Inc 液状エッチングレジスト及びエッチングレジスト被膜を形成した銅張り積層板
DE69407879T2 (de) * 1993-06-30 1998-04-30 Fuji Photo Film Co Ltd Phenolverbindungen, die Methoxymethylgruppen oder Hydroxymethylgruppen enthalten
KR960015081A (ko) * 1993-07-15 1996-05-22 마쯔모또 에이이찌 화학증폭형 레지스트 조성물
EP0675410B1 (en) * 1994-03-28 1999-08-04 Wako Pure Chemical Industries Ltd Resist composition for deep ultraviolet light
TW332264B (en) * 1994-09-07 1998-05-21 Mitsubishi Chem Corp Photosensitive resin composition and method for forming a photoresist pattern
US5547812A (en) * 1995-06-05 1996-08-20 International Business Machines Corporation Composition for eliminating microbridging in chemically amplified photoresists comprising a polymer blend of a poly(hydroxystyrene) and a copolymer made of hydroxystyrene and an acrylic monomer
US5609989A (en) * 1995-06-06 1997-03-11 International Business Machines, Corporation Acid scavengers for use in chemically amplified photoresists
JP3433017B2 (ja) * 1995-08-31 2003-08-04 株式会社東芝 感光性組成物
US6132935A (en) * 1995-12-19 2000-10-17 Fuji Photo Film Co., Ltd. Negative-working image recording material
JP3627465B2 (ja) 1997-08-15 2005-03-09 Jsr株式会社 感放射線性樹脂組成物
JP3929653B2 (ja) 1999-08-11 2007-06-13 富士フイルム株式会社 ネガ型レジスト組成物
JP4070393B2 (ja) * 2000-01-17 2008-04-02 富士フイルム株式会社 ネガ型レジスト組成物
JP4990344B2 (ja) * 2009-12-04 2012-08-01 富士フイルム株式会社 ネガ型レジスト組成物及びそれを用いたパターン形成方法
RU2573636C2 (ru) * 2010-05-31 2016-01-27 Бриджстоун Корпорейшн Содержащий гидроксильные группы метилстирол и полимеры на его основе
JP5793399B2 (ja) * 2011-11-04 2015-10-14 富士フイルム株式会社 パターン形成方法及びその方法に用いる架橋層形成用組成物
MY167572A (en) 2012-02-28 2018-09-20 Kaneka Corp Coating composition and coating film obtained from coating composition
JP5894106B2 (ja) 2012-06-18 2016-03-23 信越化学工業株式会社 レジスト下層膜形成用化合物、これを用いたレジスト下層膜材料、レジスト下層膜形成方法、パターン形成方法
WO2015008777A1 (ja) 2013-07-16 2015-01-22 株式会社カネカ 有機・無機基材被覆用活性エネルギー線硬化性樹脂組成物
JP6313604B2 (ja) * 2014-02-05 2018-04-18 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、感活性光線性又は感放射線性膜を備えたマスクブランクス、パターン形成方法、及び電子デバイスの製造方法
CN103836645A (zh) * 2014-03-20 2014-06-04 莱芜钢铁集团有限公司 一种低煤气单耗的烧结点火方法
CN107533290B (zh) 2015-03-30 2021-04-09 三菱瓦斯化学株式会社 抗蚀基材、抗蚀剂组合物及抗蚀图案形成方法
US10747112B2 (en) 2015-03-30 2020-08-18 Mitsubishi Gas Chemical Company, Inc. Compound, resin, and purification method thereof, material for forming underlayer film for lithography, composition for forming underlayer film, and underlayer film, as well as resist pattern forming method and circuit pattern forming method
US20230416460A1 (en) * 2021-03-31 2023-12-28 Tdk Corporation Compound, resin composition, resin sheet, resin cured product, and laminated substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE436174C (de) * 1925-12-12 1926-11-02 Messgeraete Boykow G M B H Kreiselantrieb
US4931381A (en) * 1985-08-12 1990-06-05 Hoechst Celanese Corporation Image reversal negative working O-quinone diazide and cross-linking compound containing photoresist process with thermal curing treatment
US4929536A (en) * 1985-08-12 1990-05-29 Hoechst Celanese Corporation Image reversal negative working O-napthoquinone diazide and cross-linking compound containing photoresist process with thermal curing
US5217840A (en) * 1985-08-12 1993-06-08 Hoechst Celanese Corporation Image reversal negative working o-quinone diazide and cross-linking compound containing photoresist process with thermal curing treatment and element produced therefrom
JPH01501176A (ja) * 1986-10-20 1989-04-20 マクダーミッド,インコーポレーテッド 像反転可能なシステム及びプロセス
KR900005226A (ko) * 1988-09-29 1990-04-13 윌리엄 비이 해리스 감광성 조성물 및 양화 상과 음화 상의 생성방법
JPH02120366A (ja) * 1988-10-31 1990-05-08 Hitachi Ltd 放射線感応性組成物およびそれを用いたパターン形成法
JPH02170165A (ja) * 1988-12-23 1990-06-29 Hitachi Ltd 放射線感応性組成物及びそれを用いたパターン形成法
DE3943413A1 (de) * 1989-12-30 1991-07-04 Basf Ag Strahlungsempfindliches gemisch und verfahren zur herstellung von reliefstrukturen

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Publication number Publication date
US5376498A (en) 1994-12-27
JPH05134412A (ja) 1993-05-28
EP0542572A1 (en) 1993-05-19
JP3016231B2 (ja) 2000-03-06
KR100241478B1 (ko) 2000-03-02

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