KR920701869A - 포지티브 레지스트 조성물 - Google Patents
포지티브 레지스트 조성물Info
- Publication number
- KR920701869A KR920701869A KR1019910700940A KR910700940A KR920701869A KR 920701869 A KR920701869 A KR 920701869A KR 1019910700940 A KR1019910700940 A KR 1019910700940A KR 910700940 A KR910700940 A KR 910700940A KR 920701869 A KR920701869 A KR 920701869A
- Authority
- KR
- South Korea
- Prior art keywords
- resist composition
- group
- positive resist
- alkyl group
- atom
- Prior art date
Links
- 150000001875 compounds Chemical class 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 125000003342 alkenyl group Chemical group 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 125000004429 atom Chemical group 0.000 claims 1
- 125000000753 cycloalkyl group Chemical group 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- -1 quinone diazide compound Chemical class 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- CSCPPACGZOOCGX-MICDWDOJSA-N 1-deuteriopropan-2-one Chemical compound [2H]CC(C)=O CSCPPACGZOOCGX-MICDWDOJSA-N 0.000 description 1
- CSCPPACGZOOCGX-WFGJKAKNSA-N acetone d6 Chemical compound [2H]C([2H])([2H])C(=O)C([2H])([2H])[2H] CSCPPACGZOOCGX-WFGJKAKNSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials For Photolithography (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 합성예 1에서 제조한 화합물의1H-NMR 스펙트럼(용매 : 아세톤-d6,TMS)이고, 제2도는 합성예2에서 제조한 화합물의1H-NMR 스펙트럼(용매 : 아세톤-d6,TMS)이다.
Claims (4)
- 알칼리 가용성 수지, 감방사선 성분으로서 퀴논 디아지드 화합물 및 하기식(I)의 화합물을 함유하는 포지티브 레지스트 조성물.〔식중, Z1~Z9은 독립적으로 수소원자, 알킬기, 할로겐원자 또는 히드록실기(단, Z1~Z9중 적어도 하나는 히드록 실기이다)이며, R1~R6는 독립적으로 수소원자, 알킬기, 알케닐기, 시클로알킬기 또는 아릴기이다. 〕
- 제1항에 있어서, Z1~Z9의 알킬기가 C1~C4알킬기인 포지티브 레지스트 조성물.
- 제1항에 있어서, R1~R6의 알킬기가 C1~C10알킬기인 포지티브 레지스트 조성물.
- 제1항에 있어서, 알케닐기가 C1~C4알케닐기인 포지티브 레지스트 조성물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP331995/89 | 1989-12-20 | ||
JP1331995A JP2629990B2 (ja) | 1989-12-20 | 1989-12-20 | ポジ型レジスト用組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920701869A true KR920701869A (ko) | 1992-08-12 |
KR0166368B1 KR0166368B1 (ko) | 1999-01-15 |
Family
ID=18249965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910700940A KR0166368B1 (ko) | 1989-12-20 | 1990-12-20 | 포지티브 레지스트 조성물 |
Country Status (7)
Country | Link |
---|---|
US (2) | US5290657A (ko) |
EP (1) | EP0458988B1 (ko) |
JP (1) | JP2629990B2 (ko) |
KR (1) | KR0166368B1 (ko) |
CA (1) | CA2046908A1 (ko) |
DE (1) | DE69032204T2 (ko) |
WO (1) | WO1991009346A1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3039048B2 (ja) * | 1991-11-01 | 2000-05-08 | 住友化学工業株式会社 | ポジ型感放射線性レジスト組成物 |
JP3391471B2 (ja) * | 1992-02-25 | 2003-03-31 | 住友化学工業株式会社 | ポジ型レジスト組成物 |
US5726257A (en) * | 1994-08-30 | 1998-03-10 | Sumitomo Chemical Company, Ltd. | Esterified resorcinol-carbonyl compound condensates and epoxy resins therewith |
JPH0954437A (ja) | 1995-06-05 | 1997-02-25 | Fuji Photo Film Co Ltd | 化学増幅型ポジレジスト組成物 |
JP3562673B2 (ja) | 1996-01-22 | 2004-09-08 | 富士写真フイルム株式会社 | ポジ型フォトレジスト組成物 |
TW475926B (en) * | 1996-06-06 | 2002-02-11 | Sumitomo Chemical Co | Novel ester compound and thermosetting resin composition using the same |
SG78412A1 (en) | 1999-03-31 | 2001-02-20 | Ciba Sc Holding Ag | Oxime derivatives and the use thereof as latent acids |
JP3931486B2 (ja) | 1999-06-24 | 2007-06-13 | 住友化学株式会社 | ポジ型レジスト組成物 |
AU2002210686A1 (en) * | 2000-10-18 | 2002-04-29 | Ribotargets Limited | Flavan compounds, their preparation and their use in therapy |
US6964838B2 (en) | 2001-01-17 | 2005-11-15 | Tokyo Ohka Kogyo Co., Ltd. | Positive photoresist composition |
US7462436B2 (en) | 2003-07-16 | 2008-12-09 | Tokyo Ohka Kogyo Co., Ltd. | Positive photoresist composition and method of forming resist pattern |
KR101758398B1 (ko) | 2009-09-11 | 2017-07-14 | 제이에스알 가부시끼가이샤 | 감방사선성 조성물 및 신규 화합물 |
EP3253735B1 (en) | 2015-02-02 | 2021-03-31 | Basf Se | Latent acids and their use |
JP6783540B2 (ja) | 2015-03-31 | 2020-11-11 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4626492A (en) * | 1985-06-04 | 1986-12-02 | Olin Hunt Specialty Products, Inc. | Positive-working o-quinone diazide photoresist composition containing a dye and a trihydroxybenzophenone compound |
DK556286A (da) * | 1985-11-27 | 1987-05-28 | Int Flavors & Fragrances Inc | Fremgangsmaade til fremstilling af frugt- groensags- eller krydderidsserter. |
EP0244763B1 (de) * | 1986-05-02 | 1993-03-10 | Hoechst Celanese Corporation | Positiv-arbeitendes lichtempfindliches Gemisch und daraus hergestelltes lichtempfindliches Aufzeichnungsmaterial |
US4732836A (en) * | 1986-05-02 | 1988-03-22 | Hoechst Celanese Corporation | Novel mixed ester O-quinone photosensitizers |
US4732837A (en) * | 1986-05-02 | 1988-03-22 | Hoechst Celanese Corporation | Novel mixed ester O-quinone photosensitizers |
DE3718416A1 (de) * | 1987-06-02 | 1988-12-15 | Hoechst Ag | Lichtempfindliches gemisch auf basis von 1,2-naphthochinondiaziden, daraus hergestelltes aufzeichnungsmaterial und dessen verwendung |
JPH0814696B2 (ja) * | 1987-09-17 | 1996-02-14 | 富士写真フイルム株式会社 | 感光性樹脂組成物 |
JP2625883B2 (ja) * | 1988-05-17 | 1997-07-02 | 住友化学工業株式会社 | ポジ型レジスト組成物 |
JP2625882B2 (ja) * | 1988-05-17 | 1997-07-02 | 住友化学工業株式会社 | ポジ型レジスト用組成物 |
JPH061377B2 (ja) * | 1989-12-28 | 1994-01-05 | 日本ゼオン株式会社 | ポジ型レジスト組成物 |
JPH06224241A (ja) * | 1993-01-25 | 1994-08-12 | Toyota Autom Loom Works Ltd | 樹脂封止回路装置の成形方法 |
JPH06324244A (ja) * | 1993-05-11 | 1994-11-25 | Canon Inc | 駆動装置 |
-
1989
- 1989-12-20 JP JP1331995A patent/JP2629990B2/ja not_active Expired - Lifetime
-
1990
- 1990-12-20 CA CA002046908A patent/CA2046908A1/en not_active Abandoned
- 1990-12-20 WO PCT/JP1990/001659 patent/WO1991009346A1/ja active IP Right Grant
- 1990-12-20 KR KR1019910700940A patent/KR0166368B1/ko not_active IP Right Cessation
- 1990-12-20 DE DE69032204T patent/DE69032204T2/de not_active Expired - Lifetime
- 1990-12-20 US US07/743,299 patent/US5290657A/en not_active Expired - Lifetime
- 1990-12-20 EP EP91900939A patent/EP0458988B1/en not_active Expired - Lifetime
-
1993
- 1993-11-08 US US08/148,346 patent/US5374742A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0458988A4 (en) | 1992-07-01 |
JP2629990B2 (ja) | 1997-07-16 |
EP0458988A1 (en) | 1991-12-04 |
DE69032204D1 (de) | 1998-05-07 |
US5374742A (en) | 1994-12-20 |
US5290657A (en) | 1994-03-01 |
JPH03191351A (ja) | 1991-08-21 |
WO1991009346A1 (en) | 1991-06-27 |
EP0458988B1 (en) | 1998-04-01 |
CA2046908A1 (en) | 1991-06-21 |
DE69032204T2 (de) | 1998-07-23 |
KR0166368B1 (ko) | 1999-01-15 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20100910 Year of fee payment: 13 |
|
EXPY | Expiration of term |