KR910006416A - 열경화성 수지 조성물 - Google Patents

열경화성 수지 조성물 Download PDF

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Publication number
KR910006416A
KR910006416A KR1019900014251A KR900014251A KR910006416A KR 910006416 A KR910006416 A KR 910006416A KR 1019900014251 A KR1019900014251 A KR 1019900014251A KR 900014251 A KR900014251 A KR 900014251A KR 910006416 A KR910006416 A KR 910006416A
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KR
South Korea
Prior art keywords
resin composition
thermosetting resin
maleimide
integer
note
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KR1019900014251A
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English (en)
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KR950005314B1 (ko
Inventor
도시오 시오하라
히사시 시미즈
Original Assignee
고사까 유따로
신에쓰 가가꾸 고오교 가부시끼가이샤
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Publication of KR910006416A publication Critical patent/KR910006416A/ko
Application granted granted Critical
Publication of KR950005314B1 publication Critical patent/KR950005314B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
    • C08G73/127—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1444—Monoalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/125—Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

열경화성 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. (a) 하기 일반식(1)
    (식중, n은 1이상의 정수임)으로 표시되는 구조 단위를 가진 말레이미드와, (b) 방향족기에 공액하는 이중결합을 가진 에폭시 수지들을 배합하여 이루어진 것을 특징으로 하는 열경화성 수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900014251A 1989-09-11 1990-09-10 열경화성 수지 조성물 KR950005314B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23530689 1989-09-11
JP235306/1989 1989-09-11
JP235306 1989-09-11

Publications (2)

Publication Number Publication Date
KR910006416A true KR910006416A (ko) 1991-04-29
KR950005314B1 KR950005314B1 (ko) 1995-05-23

Family

ID=16984163

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900014251A KR950005314B1 (ko) 1989-09-11 1990-09-10 열경화성 수지 조성물

Country Status (4)

Country Link
US (1) US5070154A (ko)
JP (1) JPH082938B2 (ko)
KR (1) KR950005314B1 (ko)
DE (1) DE4028845C2 (ko)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3128291B2 (ja) * 1990-10-31 2001-01-29 株式会社東芝 マレイミド樹脂組成物およびこれを用いた樹脂封止型半導体装置
KR100204629B1 (ko) * 1991-04-04 1999-06-15 카나가와 치히로 열 경화성 수지 조성물
US5240981A (en) * 1991-06-03 1993-08-31 Ciba-Geigy Corporation Flame retardant polyimide system
US5637387A (en) * 1991-06-03 1997-06-10 Ciba-Geigy Corporation Storage-stable advanced polymaleimide compositions
US5290882A (en) * 1991-08-13 1994-03-01 Shin-Etsu Chemical Co., Ltd. Thermosetting resin compositions
JP2669247B2 (ja) * 1992-02-13 1997-10-27 信越化学工業株式会社 熱硬化性樹脂組成物
WO1996020969A1 (en) * 1995-01-05 1996-07-11 Toray Industries, Inc. Epoxy resin composition
FR2753197B1 (fr) * 1996-09-12 1998-11-27 Cray Valley Sa Polymeres fonctionnalises par des groupements maleimide, leur procede de fabrication et leurs applications
US6306923B1 (en) 1996-09-12 2001-10-23 Sartomer Company, Inc. Ultraviolet or visible light polymerizable and/or crosslinkable maleimide-functional coating compositions
US6271339B1 (en) 1996-09-12 2001-08-07 Sartomer Company, Inc. Prepolymers having maleimide functions the process for preparing them and their uses
FR2753198B1 (fr) * 1996-09-12 1998-11-27 Cray Valley Sa Compositions de revetement polymerisables par la lumiere ultraviolette ou visible
JP3184485B2 (ja) * 1997-11-06 2001-07-09 三井金属鉱業株式会社 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板
US6316566B1 (en) * 1998-07-02 2001-11-13 National Starch And Chemical Investment Holding Corporation Package encapsulant compositions for use in electronic devices
US6063828A (en) * 1998-07-02 2000-05-16 National Starch And Chemical Investment Holding Corporation Underfill encapsulant compositions for use in electronic devices
US6057381A (en) * 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
US6281314B1 (en) * 1998-07-02 2001-08-28 National Starch And Chemical Investment Holding Corporation Compositions for use in the fabrication of circuit components and printed wire boards
SG82001A1 (en) * 1998-07-02 2001-07-24 Nat Starch Chem Invest Method of making an electronic component using reworkable underfill encapsulants
DE10051051A1 (de) * 2000-10-14 2002-04-18 Bosch Gmbh Robert Silikonmodifizierte Einkomponentenvergußmasse
EP2195365B1 (en) * 2007-10-02 2012-11-21 LG Chem, Ltd. Curing composition and cured product prepared by using the same
JP5458493B2 (ja) * 2008-01-23 2014-04-02 日本メクトロン株式会社 樹脂組成物
WO2010016946A2 (en) * 2008-08-08 2010-02-11 Henkel Corporation Low temperature curing compositions
JP5136331B2 (ja) * 2008-09-26 2013-02-06 住友ベークライト株式会社 回路基板用樹脂組成物、回路基板用プリプレグおよび積層板
EP3144289A1 (en) 2015-09-16 2017-03-22 Evonik Technochemie GmbH [(2-ethoxy-5-trans-1-propen-1-yl)-phenoxyl]-terminated compounds
EP3144290A1 (en) 2015-09-16 2017-03-22 Evonik Technochemie GmbH Alkenylphenoxy-substituted 1,1-diphenylethylenes, processes for their preparation, and their use
JP2017105898A (ja) * 2015-12-08 2017-06-15 Dic株式会社 エポキシ樹脂、エポキシ樹脂の製造方法、硬化性樹脂組成物及びその硬化物
CA3043647A1 (en) 2016-11-15 2018-05-24 Evonik Technochemie Gmbh Asymmetrically substituted bis-alkenyl diphenyl ethers, their preparation and use
JPWO2020196819A1 (ko) * 2019-03-27 2020-10-01
CN112920378B (zh) * 2021-01-28 2023-06-13 深圳市宝安区新材料研究院 一种羟基树脂及其制备方法和应用

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CH615935A5 (ko) * 1975-06-19 1980-02-29 Ciba Geigy Ag
CH621811A5 (ko) * 1976-06-17 1981-02-27 Ciba Geigy Ag
JPS5948009B2 (ja) * 1977-01-14 1984-11-22 旭電化工業株式会社 硬化性樹脂組成物
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EP0013258B1 (de) * 1978-12-29 1982-07-07 Ciba-Geigy Ag Propenylsubstituierte Phenolglycidyläther, Verfahren zu ihrer Herstellung und ihre Verwendung
CH647249A5 (de) * 1981-12-23 1985-01-15 Ciba Geigy Ag Lagerstabile, waermehaertbare, einen polymerisationskatalysator enthaltende mischungen auf polyimidbasis.
EP0225174A3 (en) * 1985-11-26 1989-04-12 Sumitomo Chemical Company, Limited Thermosetting resin composition and a composite material comprising the cured product of the resin composition as its matrix
US4851483A (en) * 1987-09-25 1989-07-25 The Dow Chemical Company Styrylaza vinyl esters
US4945138A (en) * 1987-09-25 1990-07-31 The Dow Chemical Company Styrylaza vinyl esters

Also Published As

Publication number Publication date
DE4028845A1 (de) 1991-03-14
KR950005314B1 (ko) 1995-05-23
JPH03174433A (ja) 1991-07-29
JPH082938B2 (ja) 1996-01-17
US5070154A (en) 1991-12-03
DE4028845C2 (de) 1996-08-29

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