KR910014485A - 접착제 조성물 - Google Patents

접착제 조성물 Download PDF

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Publication number
KR910014485A
KR910014485A KR1019910000998A KR910000998A KR910014485A KR 910014485 A KR910014485 A KR 910014485A KR 1019910000998 A KR1019910000998 A KR 1019910000998A KR 910000998 A KR910000998 A KR 910000998A KR 910014485 A KR910014485 A KR 910014485A
Authority
KR
South Korea
Prior art keywords
adhesive composition
weight
parts
carboxyl group
butadiene copolymer
Prior art date
Application number
KR1019910000998A
Other languages
English (en)
Other versions
KR0152090B1 (ko
Inventor
하지메 야마자키
히로유키 와카마쓰
도시노부 다카하시
나오야 아다치
Original Assignee
모토야마 가즈오
요코하마고무 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 모토야마 가즈오, 요코하마고무 가부시키가이샤 filed Critical 모토야마 가즈오
Publication of KR910014485A publication Critical patent/KR910014485A/ko
Application granted granted Critical
Publication of KR0152090B1 publication Critical patent/KR0152090B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

접착제 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. 에폭시 수지(A), 카복실기 함유 아크릴로니트릴, 부타디엔 공중합체 또는 카복실기 함유 메타크릴로니트릴, 부타디엔 공중합체(B), 말레이미드 유도체(C) 및 이미다졸 화합물(D)를 함유하며 (A)의 100중량부에 대해 (B)를 5내지 50중량부 및 (D)를 0.5 내지 20중량부 배합하고 (C)를 (B)의 배합량에 대해 1(B)/(C)10(중합비)의 비율로 배합하여 이루어짐을 특징으로 하는 접착제 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910000998A 1990-01-24 1991-01-22 접착제 조성물 KR0152090B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2-12512 1990-01-24
JP1251290 1990-01-24
JP2228177A JPH03250084A (ja) 1990-01-24 1990-08-31 接着剤組成物
JP2-228177 1990-08-31

Publications (2)

Publication Number Publication Date
KR910014485A true KR910014485A (ko) 1991-08-31
KR0152090B1 KR0152090B1 (ko) 1998-10-01

Family

ID=11807402

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910000998A KR0152090B1 (ko) 1990-01-24 1991-01-22 접착제 조성물

Country Status (3)

Country Link
JP (1) JPH03250084A (ko)
KR (1) KR0152090B1 (ko)
GB (1) GB2240546B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010081833A (ko) * 2000-02-19 2001-08-29 권문구 유리전이온도 조정에 의한 반도체 패키지용 드라이 패드형탄성접착제의 탄성률 고안

Also Published As

Publication number Publication date
GB9101010D0 (en) 1991-02-27
GB2240546A (en) 1991-08-07
JPH03250084A (ja) 1991-11-07
GB2240546B (en) 1993-07-14
KR0152090B1 (ko) 1998-10-01

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