KR930006070A - 신규한 이미드-에폭시수지와 그 제조방법 - Google Patents

신규한 이미드-에폭시수지와 그 제조방법 Download PDF

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Publication number
KR930006070A
KR930006070A KR1019910016824A KR910016824A KR930006070A KR 930006070 A KR930006070 A KR 930006070A KR 1019910016824 A KR1019910016824 A KR 1019910016824A KR 910016824 A KR910016824 A KR 910016824A KR 930006070 A KR930006070 A KR 930006070A
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KR
South Korea
Prior art keywords
epoxy resin
imide
general formula
resin composition
integer
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KR1019910016824A
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English (en)
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KR960005064B1 (ko
Inventor
김환건
남태영
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이대원
제일모직 주식회사
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Priority to KR1019910016824A priority Critical patent/KR960005064B1/ko
Priority to JP3312021A priority patent/JP2501056B2/ja
Priority to US07/803,041 priority patent/US5189082A/en
Publication of KR930006070A publication Critical patent/KR930006070A/ko
Application granted granted Critical
Publication of KR960005064B1 publication Critical patent/KR960005064B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Plural Heterocyclic Compounds (AREA)

Abstract

본 발명은 하기 일반식(Ⅰ)의 신규한 이미드-에폭시수지 및 그 제조방법, 이를 첨가한 에폭시 수지조성물에 관한 것으로 특히 에폭시수지, 경화제 경화촉진제, 가소성부여제 등과 함께 일반식(Ⅰ)의 이미드-에폭시수지를 0.1 내지 20중량% 함유시켜서 된 내열성 및 내습성등이 향상된 반도체소자 밀봉용 에폭시수지 조성물이다.
(여기서, R1및 R2는 H 또는

Description

신규한 이미드-에폭시수지와 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 하기 일반식(Ⅰ)로 표시되는 것을 특징으로 한 이미드-에폭시수지.
    (단, R1및 R2는 H 또는기이고, n은 0 또는 1 이상의 정수이다.)
  2. 파라-아미노페놀과 에피클로로 히드린을 디메틸포름 아미드에 용해시켜 반응시킨 후(반응식 ①) 이를 다시 일반식(Ⅱ) 비스말레이미드의 반응시킴(반응식 ②)을 특징으로 하는 일반식(Ⅰ)의 이미드-에폭시 수지의 제조방법.
    (여기서, R1및 R2는 H 또는기이고, n은 0 또는 1 이상의 정수이다.)
  3. 클레졸 노블락형 에폭시수지와 경화제, 경화촉진제 및 무기충진제로 이루어진 에폭시수지 조성물에 있어서 하기 일반식(Ⅰ)로 표시되는 이미드-에폭시수지가 첨가됨을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물.
    (R1및 R2의 기에 대한 정의는 상기 1항과 같다.)
  4. 제3항에 있어서, 일반식(Ⅰ)로 표시되는 이미드-에폭시수지는 전체 수지조성물에 대하여 0.1∼20.0wt% 만큼 첨가되는 것을 특징으로 하는 반도체소자 밀봉용 에폭시 수시 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910016824A 1991-09-26 1991-09-26 신규한 이미드-에폭시수지와 그 제조방법 KR960005064B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019910016824A KR960005064B1 (ko) 1991-09-26 1991-09-26 신규한 이미드-에폭시수지와 그 제조방법
JP3312021A JP2501056B2 (ja) 1991-09-26 1991-11-27 イミドエポキシ樹脂と耐熱性樹脂組成物
US07/803,041 US5189082A (en) 1991-09-26 1991-12-06 Imide epoxy resins for sealing semiconductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910016824A KR960005064B1 (ko) 1991-09-26 1991-09-26 신규한 이미드-에폭시수지와 그 제조방법

Publications (2)

Publication Number Publication Date
KR930006070A true KR930006070A (ko) 1993-04-20
KR960005064B1 KR960005064B1 (ko) 1996-04-20

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Country Status (3)

Country Link
US (1) US5189082A (ko)
JP (1) JP2501056B2 (ko)
KR (1) KR960005064B1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0794535B2 (ja) * 1991-11-30 1995-10-11 第一毛織株式会社 半導体素子密封用エポキシ樹脂組成物
KR960010845B1 (ko) * 1992-01-18 1996-08-09 제일모직 주식회사 반도체소자 밀봉용 에폭시수지 조성물
JP3681082B2 (ja) * 1996-06-27 2005-08-10 住友ベークライト株式会社 イミド環含有エポキシ樹脂及びエポキシ樹脂組成物
US8104148B2 (en) * 2008-05-22 2012-01-31 Iteq (Dongguan) Corporation Kind of prepolymer and its product-thermosetting resins composite
US8470936B2 (en) 2011-07-29 2013-06-25 Namics Corporation Liquid epoxy resin composition for semiconductor encapsulation
US20130026660A1 (en) * 2011-07-29 2013-01-31 Namics Corporation Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
CN107615151A (zh) * 2015-10-26 2018-01-19 积水化学工业株式会社 液晶显示元件用密封剂、上下导通材料及液晶显示元件

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JPS5889619A (ja) * 1981-11-25 1983-05-28 Mitsui Toatsu Chem Inc 硬化性樹脂組成物
JPS58215452A (ja) * 1982-06-09 1983-12-14 Toshiba Chem Corp 封止用成形材料
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Publication number Publication date
JPH05117366A (ja) 1993-05-14
JP2501056B2 (ja) 1996-05-29
KR960005064B1 (ko) 1996-04-20
US5189082A (en) 1993-02-23

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