KR930016493A - 반도체소자 밀봉용 에폭시수지 조성물 - Google Patents

반도체소자 밀봉용 에폭시수지 조성물 Download PDF

Info

Publication number
KR930016493A
KR930016493A KR1019920000704A KR920000704A KR930016493A KR 930016493 A KR930016493 A KR 930016493A KR 1019920000704 A KR1019920000704 A KR 1019920000704A KR 920000704 A KR920000704 A KR 920000704A KR 930016493 A KR930016493 A KR 930016493A
Authority
KR
South Korea
Prior art keywords
epoxy resin
resin composition
semiconductor device
imide
positive integer
Prior art date
Application number
KR1019920000704A
Other languages
English (en)
Other versions
KR960010845B1 (ko
Inventor
김환건
이지윤
Original Assignee
이대원
제일모직 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이대원, 제일모직 주식회사 filed Critical 이대원
Priority to KR1019920000704A priority Critical patent/KR960010845B1/ko
Priority to JP4281187A priority patent/JP2501071B2/ja
Priority to US08/001,082 priority patent/US5266612A/en
Publication of KR930016493A publication Critical patent/KR930016493A/ko
Priority to KR1019960012981A priority patent/KR960007929B1/ko
Application granted granted Critical
Publication of KR960010845B1 publication Critical patent/KR960010845B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3236—Heterocylic compounds
    • C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

본 발명은 에폭시수지, 경화제, 경화촉진제, 무기충진제, 가소성부여제로 이루어진 에폭시 조성물에 일반식(Ⅰ)의 아미드 에폭시수지를 전체 조성물에 대해 0.1 내지 20중량% 함유시켜서된 내열성 및 내습성등이 향상된 반도체소자 밀봉용 에폭시수지 조성물에 관한 것이다.
(여기에서 R1,R2는 H 또는 (CH2)nCH3기이고 n은 0 또는 1 이상의 양의 정수이다.)

Description

반도체소자 밀봉용 에폭시수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 크레졸노블락형 에폭시수지와 경화제, 경화촉진제, 무기충진제로 이루어지는 반도체소자 밀봉용 에폭시수지 조성물에 있어서, 하기 일반식(Ⅰ)으로 표시되는 이미드-에폭시수지가 첨가됨을 특징으로하는 내열성 및 내습성이 향상된 반도체소자 밀봉용 에폭시수지 조성물.
    (여기에서 R1,R2는 H 또는 (CH2)nCH3기이고 n은 0 또는 1 이상의 양의 정수이다.)
  2. 제1항에 있어서, 상기 이미드-에폭시수지는 전체 수지조성물에 대하여 0.1-20.0중량% 만큼 첨가되는 것을 특징으로 하는 반도체 소자 밀봉용 에폭시수지 조성물.
  3. 하기 구조식(Ⅱ)의 에폭시수지를 유기용매중에서 소량의 촉매와 1-브로모-2,5-피롤리딘디온을 적하하여 브롬치환 에폭시수지를 수득하고, 이를 알콕시아민과 반응시켜 아민이 치환된 에폭시수지를 얻은후, 다시 하기 구조식(Ⅲ)의 말레이미드와 반응시켜 하기 일반식(Ⅰ)의 아미드 에폭시수지를 얻는 것을 특징으로 하는 이미드 에폭시수지의 제조방법.
    (여기에서 R1,R2는 H 또는 (CH2)nCH3기이고 n은 0 또는 1 이상의 양의 정수이다.)
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920000704A 1992-01-18 1992-01-18 반도체소자 밀봉용 에폭시수지 조성물 KR960010845B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019920000704A KR960010845B1 (ko) 1992-01-18 1992-01-18 반도체소자 밀봉용 에폭시수지 조성물
JP4281187A JP2501071B2 (ja) 1992-01-18 1992-10-20 半導体素子密封用エポキシ樹脂組成物
US08/001,082 US5266612A (en) 1992-01-18 1993-01-06 Imide epoxy resin composition for sealing semiconductor elements
KR1019960012981A KR960007929B1 (ko) 1992-01-18 1996-04-25 이미드 에폭시수지의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920000704A KR960010845B1 (ko) 1992-01-18 1992-01-18 반도체소자 밀봉용 에폭시수지 조성물

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1019960012981A Division KR960007929B1 (ko) 1992-01-18 1996-04-25 이미드 에폭시수지의 제조방법

Publications (2)

Publication Number Publication Date
KR930016493A true KR930016493A (ko) 1993-08-26
KR960010845B1 KR960010845B1 (ko) 1996-08-09

Family

ID=19328071

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019920000704A KR960010845B1 (ko) 1992-01-18 1992-01-18 반도체소자 밀봉용 에폭시수지 조성물
KR1019960012981A KR960007929B1 (ko) 1992-01-18 1996-04-25 이미드 에폭시수지의 제조방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1019960012981A KR960007929B1 (ko) 1992-01-18 1996-04-25 이미드 에폭시수지의 제조방법

Country Status (3)

Country Link
US (1) US5266612A (ko)
JP (1) JP2501071B2 (ko)
KR (2) KR960010845B1 (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5981629A (en) * 1995-03-31 1999-11-09 Cork; Michael S. Epoxy system for bonding to unsanded polymer-coated fiberglass surfaces
EP1763569B1 (de) * 2004-07-02 2018-01-17 Merck Patent GmbH Flüssigkristallmedium und dieses enthaltende elektrooptische anzeige
US8310442B2 (en) 2005-02-23 2012-11-13 Pixtronix, Inc. Circuits for controlling display apparatus
US8519945B2 (en) 2006-01-06 2013-08-27 Pixtronix, Inc. Circuits for controlling display apparatus
US8159428B2 (en) 2005-02-23 2012-04-17 Pixtronix, Inc. Display methods and apparatus
US9261694B2 (en) 2005-02-23 2016-02-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US9229222B2 (en) * 2005-02-23 2016-01-05 Pixtronix, Inc. Alignment methods in fluid-filled MEMS displays
US8482496B2 (en) 2006-01-06 2013-07-09 Pixtronix, Inc. Circuits for controlling MEMS display apparatus on a transparent substrate
US9158106B2 (en) 2005-02-23 2015-10-13 Pixtronix, Inc. Display methods and apparatus
US20070205969A1 (en) 2005-02-23 2007-09-06 Pixtronix, Incorporated Direct-view MEMS display devices and methods for generating images thereon
US7999994B2 (en) 2005-02-23 2011-08-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US9082353B2 (en) 2010-01-05 2015-07-14 Pixtronix, Inc. Circuits for controlling display apparatus
US8526096B2 (en) 2006-02-23 2013-09-03 Pixtronix, Inc. Mechanical light modulators with stressed beams
US9176318B2 (en) 2007-05-18 2015-11-03 Pixtronix, Inc. Methods for manufacturing fluid-filled MEMS displays
US8169679B2 (en) 2008-10-27 2012-05-01 Pixtronix, Inc. MEMS anchors
EP2531997A1 (en) 2010-02-02 2012-12-12 Pixtronix Inc. Circuits for controlling display apparatus
EP2826777B1 (en) 2012-03-14 2020-08-05 Korea Institute of Industrial Technology Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group
US9134552B2 (en) 2013-03-13 2015-09-15 Pixtronix, Inc. Display apparatus with narrow gap electrostatic actuators
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943048B2 (ja) * 1978-04-28 1984-10-19 三菱電機株式会社 耐熱性硬化性樹脂組成物
JPS58215452A (ja) * 1982-06-09 1983-12-14 Toshiba Chem Corp 封止用成形材料
JPS62477A (ja) * 1985-06-26 1987-01-06 Toray Ind Inc 新規エポキシ樹脂およびその製造方法
JPS627719A (ja) * 1985-07-03 1987-01-14 Sanyo Kokusaku Pulp Co Ltd エポキシ樹脂の製法
JPS627723A (ja) * 1985-07-03 1987-01-14 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPS62106920A (ja) * 1985-11-05 1987-05-18 Asahi Chem Ind Co Ltd 半導体封止用樹脂組成物
US4720521A (en) * 1985-12-03 1988-01-19 Becton, Dickinson And Company Film-forming silicone compositions having lubricating properties
JPS62260817A (ja) * 1986-05-08 1987-11-13 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS63230725A (ja) * 1987-03-20 1988-09-27 Fujitsu Ltd 半導体封止用エポキシ樹脂組成物
KR960005064B1 (ko) * 1991-09-26 1996-04-20 제일모직주식회사 신규한 이미드-에폭시수지와 그 제조방법

Also Published As

Publication number Publication date
US5266612A (en) 1993-11-30
JP2501071B2 (ja) 1996-05-29
KR960010845B1 (ko) 1996-08-09
JPH07188384A (ja) 1995-07-25
KR960007929B1 (ko) 1996-06-17

Similar Documents

Publication Publication Date Title
KR930016493A (ko) 반도체소자 밀봉용 에폭시수지 조성물
MY107113A (en) Epoxy resin composition for semiconductor sealing.
KR910014459A (ko) 에폭시 수지 조성물 및 반도체 장치
KR910015651A (ko) 반도체 요소를 캡슐화하기 위한 에폭시 수지 조성물
FI862398A (fi) Bis-maleinimidsammansaettning.
KR930006070A (ko) 신규한 이미드-에폭시수지와 그 제조방법
KR910016854A (ko) 반도체 봉지용 에폭시 수지 조성물
KR890010096A (ko) 에폭시 수지 및 방향족 디아민 경화제를 포함하는 조성물
KR930010114A (ko) 반도체 봉지용 에폭시 수지 조성물 및 반도체장치
MY105582A (en) Resin composition for sealing semiconductors.
MY118833A (en) Epoxy resin composition and resin- encapsulated semiconductor device
KR880002928A (ko) 액상 에폭시 수지 조성물
KR910012053A (ko) 내열성을 향상시킨 반도체소자 밀봉용 수지조성물
KR920002699A (ko) 반도체소자 밀봉용 에폭시수지조성물
KR920002698A (ko) 반도체소자 밀봉용 에폭시수지조성물
KR930010116A (ko) 반도체소자 밀봉용 에폭시 수지조성물
KR910012060A (ko) 반도체소자 밀봉용 에폭시수지조성물
KR910000920A (ko) 반도체소자 밀봉용 에폭시 수지조성물
KR920016533A (ko) 열경화성 분말 조성물
KR910006410A (ko) 고강력 폴리아미드 연신 시이트 조성물
DE59907469D1 (de) Ungesättigte oligophenolcyanate
KR930010115A (ko) 반도체소자 밀봉용 에폭시 수지조성물
KR940003003A (ko) 반도체 소자 봉지용 에폭시 수지 조성물(2)
MY105581A (en) Resin composition for sealing semiconductors.
KR880004029A (ko) 반도체 봉지용 에폭시수지 조성물

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080623

Year of fee payment: 13

LAPS Lapse due to unpaid annual fee