KR920016533A - 열경화성 분말 조성물 - Google Patents

열경화성 분말 조성물 Download PDF

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Publication number
KR920016533A
KR920016533A KR1019920003213A KR920003213A KR920016533A KR 920016533 A KR920016533 A KR 920016533A KR 1019920003213 A KR1019920003213 A KR 1019920003213A KR 920003213 A KR920003213 A KR 920003213A KR 920016533 A KR920016533 A KR 920016533A
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KR
South Korea
Prior art keywords
group
compound
epoxy resin
represented
general formula
Prior art date
Application number
KR1019920003213A
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English (en)
Inventor
가즈야 오모
마사오 구보
구니미쓰 마쓰자끼
가쓰지 기따가와
Original Assignee
원본미기재
소마루 가부시끼가이샤
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Application filed by 원본미기재, 소마루 가부시끼가이샤 filed Critical 원본미기재
Publication of KR920016533A publication Critical patent/KR920016533A/ko

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/24Homopolymers or copolymers of amides or imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085Unsaturated polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용 없음

Description

열경화성 분말 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. (a)비스말레이미드 화합물 및 폴리말레이미드 화합물로 구성되면서, 이러한 폴리말레이미드 화합물에 대한 비스말레이미드 화합물의 중량비가 1:9~9:1이고, 비스말레이미드 화합물이 다음 일반식 (I):
    (여기에서, R1은 말레이미드기를 갖지 않는 유기기이고, R2및 R3는 서로 독립적으로 수소원자, 할로겐원자, 알킬기 또는 아릴기이다)으로 표시되고, 폴리말레이미드 화합물이 다음 일반식 (Ⅱ):
    (여기서, M은 치환되거나 치환안된 말레이미드기이고, Ph는 치환되거나 치환 안된 페닐렌기이며, n은 0이상의 정수이다)으로 표시되는 혼합물, (b)에폭시 수지, (c)이러한 에폭시 수지용 경화제, 및 (d)경화 촉진제를 함유하면서, 상기 혼합물이 이러한 혼합물과 에폭시 수지의 총량을 기준하여 20~80%의 양으로 존재하는 열경화성 분말 조성물.
  2. 제1항에 있어서, -Ph-M이 다음 일반식(Ⅲ)의 기인 조성물:
    상기 식에서, R4및 R5는 서로 독립적으로, 수소원자, 할로겐원자, 아킬기 또는 알릴기이며, R6은 수소 또는 저급알킬기이고, n은 0~2의 정수이다.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920003213A 1991-02-28 1992-02-28 열경화성 분말 조성물 KR920016533A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-58065 1991-02-28
JP3058065A JPH04275321A (ja) 1991-02-28 1991-02-28 熱硬化性粉体組成物

Publications (1)

Publication Number Publication Date
KR920016533A true KR920016533A (ko) 1992-09-25

Family

ID=13073508

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920003213A KR920016533A (ko) 1991-02-28 1992-02-28 열경화성 분말 조성물

Country Status (3)

Country Link
EP (1) EP0508579A1 (ko)
JP (1) JPH04275321A (ko)
KR (1) KR920016533A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI678393B (zh) * 2017-09-07 2019-12-01 台燿科技股份有限公司 樹脂組成物、以及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816531A (en) * 1987-02-05 1989-03-28 Shell Oil Company Bismaleimide resin composition containing epoxy resin and a phenolic curing agent therefor
US5015674A (en) * 1988-08-05 1991-05-14 Mitsui Toatsu Chemicals, Inc. Composition of vinyl polymer-grafted, silicone polymer-modified epoxy resin and polymaleimide

Also Published As

Publication number Publication date
EP0508579A1 (en) 1992-10-14
JPH04275321A (ja) 1992-09-30

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