KR910016818A - 경화성 수지, 그의 제조 방법 및 전자부품용 보호막 - Google Patents

경화성 수지, 그의 제조 방법 및 전자부품용 보호막 Download PDF

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Publication number
KR910016818A
KR910016818A KR1019910004557A KR910004557A KR910016818A KR 910016818 A KR910016818 A KR 910016818A KR 1019910004557 A KR1019910004557 A KR 1019910004557A KR 910004557 A KR910004557 A KR 910004557A KR 910016818 A KR910016818 A KR 910016818A
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South Korea
Prior art keywords
curable resin
organic group
integer
structural formula
protective film
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KR1019910004557A
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English (en)
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히로시게 오끼노시마
히데또 가또
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카나가와 치히로
신에쓰 가가꾸 고교 가부시끼가이샤
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Application filed by 카나가와 치히로, 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 카나가와 치히로
Publication of KR910016818A publication Critical patent/KR910016818A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Indole Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Paints Or Removers (AREA)

Abstract

내용 없음

Description

경화성 수지, 그의 제조 방법 및 전자부품용 보호막
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 하기 구조식(Ⅰ)의 경화성 수지.
    상기 식 중, R1및 R2는 서로 동일하거나 또는 상이한 것으로서, 탄소수 1 내지 10의 치환되지 않거나 또는 치환된 1가 탄화수소기이고, R3은 2가 유기기이며, X는 방향족 고리를 함유하는 4가 유기기이고, Y는 2가 유기기이며, m은 1 내지 3의 정수이고, n은 1 이상의 정수이다.
  2. 하기 구조식(Ⅱ)의 폴리이미드와 하기 구조식(Ⅲ)의 아미노실리콘 화합물을 반응시킴을 특징으로 하는 하기 구조식(Ⅰ)의 경화성 수지를 제조하는 방법.
    (R'O)mR2 (3-m)SiR3NH2(Ⅲ)
    상기 식 중 R1및 R2는 서로 동일하거나 또는 상이한 것으로서, 탄소수 1 내지 10의 치환되지 않거나 또는 치환된 1가 탄화수소기이고, R3은 2가 유기기이며, X는 방향족 고리를 함유하는 4가 유기기이고, Y는 2가 유기기이며, m은 1 내지 3의 정수이고, n은 1 이상의 정수이다.
  3. 제1항 기재의 경화성 수지를 경화시킨 전자부품 보호막.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910004557A 1990-03-23 1991-03-22 경화성 수지, 그의 제조 방법 및 전자부품용 보호막 KR910016818A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2-73971 1990-03-23
JP2073971A JP2606402B2 (ja) 1990-03-23 1990-03-23 硬化性樹脂及びその製造方法

Publications (1)

Publication Number Publication Date
KR910016818A true KR910016818A (ko) 1991-11-05

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ID=13533482

Family Applications (1)

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KR1019910004557A KR910016818A (ko) 1990-03-23 1991-03-22 경화성 수지, 그의 제조 방법 및 전자부품용 보호막

Country Status (3)

Country Link
EP (1) EP0448359A1 (ko)
JP (1) JP2606402B2 (ko)
KR (1) KR910016818A (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2712993B2 (ja) * 1992-01-17 1998-02-16 信越化学工業株式会社 硬化性樹脂、その溶液及びその製造法並びに電子部品用保護膜
JP2674415B2 (ja) * 1992-01-27 1997-11-12 信越化学工業株式会社 感光性樹脂組成物及び電子部品用保護膜
DE4240274B4 (de) * 1992-12-01 2004-02-12 Minnesota Mining And Manufacturing Co., Saint Paul Polysiloxane mit fluoraliphaten- und carboxylhaltigen terminalen Gruppen, ihre Herstellung und ihre Verwendung bei der Behandlung von Fasersubstraten
MY124687A (en) * 1998-05-20 2006-06-30 Hitachi Chemical Co Ltd Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same
US8071693B2 (en) 2006-06-22 2011-12-06 Sabic Innovative Plastics Ip B.V. Polysiloxane/polyimide copolymers and blends thereof
US8491997B2 (en) 2006-06-22 2013-07-23 Sabic Innovative Plastics Ip B.V. Conductive wire comprising a polysiloxane/polyimide copolymer blend
US20080236864A1 (en) * 2007-03-28 2008-10-02 General Electric Company Cross linked polysiloxane/polyimide copolymers, methods of making, blends thereof, and articles derived therefrom
US8013251B2 (en) 2008-03-17 2011-09-06 Sabic Innovative Plastics Ip B.V. Electrical wire comprising an aromatic polyketone and polysiloxane/polyimide block copolymer composition
TWI635139B (zh) * 2017-03-02 2018-09-11 律勝科技股份有限公司 感光性透明樹脂
JP7088640B2 (ja) * 2017-08-01 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
JP7088636B2 (ja) * 2017-07-11 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
JP7088639B2 (ja) * 2017-08-01 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
JP2019029556A (ja) * 2017-08-01 2019-02-21 旭化成株式会社 半導体装置、及びその製造方法
JP7088638B2 (ja) * 2017-08-01 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948835A (en) * 1973-06-07 1976-04-06 Ciba-Geigy Corporation Silicon-modified prepolymers
US4758476A (en) * 1984-12-12 1988-07-19 Hitachi Chemical Company, Ltd. Polyimide precursor resin composition and semiconductor device using the same
JPS61207438A (ja) * 1985-03-11 1986-09-13 Chisso Corp 可溶性ポリイミドシロキサン前駆体及びその製造方法
JPH0617474B2 (ja) * 1985-05-31 1994-03-09 チッソ株式会社 高接着性シリコン含有ポリアミド酸の製造法
US4609700A (en) * 1985-06-19 1986-09-02 Chisso Corporation Soluble imide oligomer and a method for producing the same
JPS61293227A (ja) * 1985-06-21 1986-12-24 Chisso Corp ｓ−トリアジン環を有する可溶性ポリイミドシロキサン前駆体の製造法
JPH0768347B2 (ja) * 1985-09-25 1995-07-26 株式会社日立製作所 有機ケイ素末端ポリイミド前駆体とポリイミドの製造方法
JPH0623251B2 (ja) * 1986-02-03 1994-03-30 チッソ株式会社 架橋ポリイミドシロキサンの製造方法
JPH0791378B2 (ja) * 1986-02-04 1995-10-04 チッソ株式会社 架橋シリコン含有ポリイミドの製造法
US4795680A (en) * 1986-05-09 1989-01-03 General Electric Company Polyimide-siloxanes, method of making and use
JPS6315223A (ja) * 1986-07-08 1988-01-22 Chisso Corp 液晶配向膜用塗布液及び加熱により形成された液晶配向膜
JPH0819234B2 (ja) * 1987-06-29 1996-02-28 チッソ株式会社 低熱膨脹性かつ高接着性のシリコン含有ポリイミド前駆体の製造法
JPS6416831A (en) * 1987-07-09 1989-01-20 Chisso Corp Solution of heat-resistant photosensitive material
JP2607104B2 (ja) * 1987-11-11 1997-05-07 チッソ株式会社 シリコン含有ポリイミド硬化物及びその製造法
JPH01156371A (ja) * 1987-12-14 1989-06-19 Chisso Corp カラーフイルター保護膜用ワニス
JPH0749524B2 (ja) * 1988-07-01 1995-05-31 旭硝子株式会社 ポリアミツク酸組成物およびその製造方法

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JPH03275722A (ja) 1991-12-06
EP0448359A1 (en) 1991-09-25
JP2606402B2 (ja) 1997-05-07

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