KR920004469A - 경화성 수지 용액 조성물, 그의 제조 방법 및 전자 부품용 보호막 - Google Patents

경화성 수지 용액 조성물, 그의 제조 방법 및 전자 부품용 보호막 Download PDF

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KR920004469A
KR920004469A KR1019910013517A KR910013517A KR920004469A KR 920004469 A KR920004469 A KR 920004469A KR 1019910013517 A KR1019910013517 A KR 1019910013517A KR 910013517 A KR910013517 A KR 910013517A KR 920004469 A KR920004469 A KR 920004469A
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organic group
curable resin
integer
aromatic ring
resin solution
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KR1019910013517A
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KR0163960B1 (ko
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히로시게 오끼노시마
히데또 가또오
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카나가와 치히로
신에쓰 가가꾸 고교 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
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  • Chemical & Material Sciences (AREA)
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  • Paints Or Removers (AREA)
  • Organic Insulating Materials (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용 없음

Description

경화성 수지 용액 조성물, 그의 제조 방법 및 전자 부품용 보호막
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 하기 일반식(Ⅰ)의 경화성 수지를 유기 용제에 용해시켜 이루어진 경화성 수지 용액 조성물.
    상기 식중, R1및 R2는 동일하거나 또는 상이할 수 있으며, 탄소 원자수 1 내지 10개의 비치환되거나 또는 치환된 1가 탄화 수소기이고, R3은 지방족 고리 또는 방향족 고리를 함유하는 3가 유기기이고, X는 2가 유기기이고, Y는 방향족 고리를 함유하는 4가 유기기이고, m은 1 내지 3의 정수이고, n은 1 이상의 정수이다.
  2. 하기 일반식(Ⅱ)의 폴리아미드와 하기 일반식(Ⅲ)의 실리콘 화합물을 유기 용제 중에서 반응시키는 것을 특징으로 하는 하기 일반식(Ⅰ)의 경화성 수지 용액 조성물의 제조방법.
    상기 식들 중, R1및 R2는 동일하거나 또는 상이할 수 있으며, 탄소 원자수 1 내지 10개의 비치환되거나 또는 치환된 1가 탄화 수소기이고, R3은 지방족 고리 또는 방향족 고리를 함유하는 3가 유기기이고, X는 2가 유기기이고, Y는 방향족 고리를 함유하는 4가 유기기이고, m은 1 내지 3의 정수이고, n은 1 이상의 정수이다.
  3. 하기 일반식(Ⅰ)의 경화성 수지 용액 조성물을 도포하여, 경화시켜서 이루어진 전자 부품용 보호막.
    상기 식중, R1및 R2는 동일하거나 또는 상이할 수 있으며, 탄소 원자수 1 내지 10개의 비치환되거나 또는 치환된 1가 탄화 수소기이고, R3은 지방족 고리 또는 방향족 고리를 함유하는 3가 유기기이고, X는 2가 유기기이고, Y는 방향족 고리를 함유하는 4가 유기기이고, m은 1 내지 3의 정수이고, n은 1 이상의 정수이다.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910013517A 1990-08-06 1991-08-05 경화성 수지 용액 조성물, 그의 제조 방법 및 전자 부품용 보호막 KR0163960B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2208836A JP2551214B2 (ja) 1990-08-06 1990-08-06 硬化性樹脂溶液組成物及びその製造方法並びに電子部品用保護膜
JP2-208836 1990-08-06

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KR920004469A true KR920004469A (ko) 1992-03-27
KR0163960B1 KR0163960B1 (ko) 1999-01-15

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KR1019910013517A KR0163960B1 (ko) 1990-08-06 1991-08-05 경화성 수지 용액 조성물, 그의 제조 방법 및 전자 부품용 보호막

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US (1) US5109058A (ko)
JP (1) JP2551214B2 (ko)
KR (1) KR0163960B1 (ko)
DE (1) DE4125908A1 (ko)

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Publication number Priority date Publication date Assignee Title
TWI612099B (zh) 2013-02-07 2018-01-21 鐘化股份有限公司 烷氧基矽烷改質聚醯胺酸溶液、使用其之積層體及可撓性裝置、與積層體之製造方法
US10308767B2 (en) 2014-08-12 2019-06-04 Kaneka Corporation Alkoxysilane-modified polyamic acid solution, laminate and flexible device using same, and laminate manufacturing method
WO2024157672A1 (ja) * 2023-01-23 2024-08-02 東レ株式会社 可溶性高分子化合物、可溶性高分子化合物の製造方法、樹脂組成物、樹脂組成物フィルム、硬化膜、および電子部品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3553282A (en) * 1969-09-08 1971-01-05 Gen Electric Siloxane containing polyamide acid blends
US4381396A (en) * 1982-07-07 1983-04-26 General Electric Company Silynorbornane anhydrides and method for making
GB8410766D0 (en) * 1983-06-23 1984-06-06 Gen Electric Curable silicone-polyimide block copolymers
JPS61293258A (ja) * 1985-06-20 1986-12-24 Nissan Chem Ind Ltd ポリイミド樹脂又はポリアミドイミド樹脂前駆体組成物
JPS6222830A (ja) * 1985-07-23 1987-01-31 Nissan Chem Ind Ltd 珪素含有ポリイミド樹脂の製造法
JPH0768347B2 (ja) * 1985-09-25 1995-07-26 株式会社日立製作所 有機ケイ素末端ポリイミド前駆体とポリイミドの製造方法
US4837299A (en) * 1986-12-31 1989-06-06 General Electric Company Process for making polyimides
US4782009A (en) * 1987-04-03 1988-11-01 General Electric Company Method of coating and imaging photopatternable silicone polyamic acid

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JPH0491130A (ja) 1992-03-24
KR0163960B1 (ko) 1999-01-15
US5109058A (en) 1992-04-28
DE4125908A1 (de) 1992-02-13
JP2551214B2 (ja) 1996-11-06

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