KR870007995A - 도전성 수지 페이스트 - Google Patents

도전성 수지 페이스트 Download PDF

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Publication number
KR870007995A
KR870007995A KR870001182A KR870001182A KR870007995A KR 870007995 A KR870007995 A KR 870007995A KR 870001182 A KR870001182 A KR 870001182A KR 870001182 A KR870001182 A KR 870001182A KR 870007995 A KR870007995 A KR 870007995A
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KR
South Korea
Prior art keywords
conductive
resin paste
conductive resin
paste according
resin
Prior art date
Application number
KR870001182A
Other languages
English (en)
Other versions
KR920002980B1 (ko
Inventor
미쯔오 야마자끼
이와오 마에까와
Original Assignee
요꼬하마 료오지
히다찌 가세이 고오교오 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 요꼬하마 료오지, 히다찌 가세이 고오교오 가부시기가이샤 filed Critical 요꼬하마 료오지
Publication of KR870007995A publication Critical patent/KR870007995A/ko
Application granted granted Critical
Publication of KR920002980B1 publication Critical patent/KR920002980B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D109/00—Coating compositions based on homopolymers or copolymers of conjugated diene hydrocarbons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)

Abstract

내용 없음

Description

도전성 수지 페이스트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 카르복실산말단기를 가지는 부타디엔의 단일중합체 또는 공중합체의 0.01-0.5 카르복실산 당량을 1 분자내에 2개 이상의 에폭시기를 가지는 에폭시수지의 1 에폭시당량과 반응시켜서 얻은 수지, 경화제 및 도전성 충전재로 구성되는 도전성 수지 페이스트.
  2. 제 1 항에 있어서, 도전성 충전재는 은분말, 금분말, 구리분말, 표면도 전성막으로 피복된 알루미나분말, 또는 표면도전성막으로 피복된 유리분말인 것을 특징으로 하는 도전성 수지 페이스트.
  3. 제 2 항에 있어서, 도전성충전재는 은분말인 것을 특징으로 하는 도전성 수지 페이스트.
  4. 제 1 항에 있어서, 상기 경화제는 페놀계수지, 이미다졸류, 디시안디아미드 또는 디카르복실산 디하이드라지드인 것을 특징으로 하는 도전성 수지 페이스트.
  5. 제 1 항에 있어서, 상기 도전성 충전재는 수지 및 도전성 충전재에 대하여 60 내지 95중량% 범위내의 양을 함유하는 것을 특징으로 하는 도전성 수지 페이스트.
  6. 제 1 항에 있어서, 경화촉진제를 함유하는 것을 특징으로 하는 도전성 수지 페이스트.
  7. 제 6 항에 있어서, 상기 경화 촉진제는 이미다졸 또는 3차 아민인 것을 특징으로 하는 도전성 수지 페이스트.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870001182A 1986-02-13 1987-02-13 도전성 수지 페이스트 KR920002980B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29782 1986-02-13
JP2978286 1986-02-13

Publications (2)

Publication Number Publication Date
KR870007995A true KR870007995A (ko) 1987-09-23
KR920002980B1 KR920002980B1 (ko) 1992-04-11

Family

ID=12285581

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870001182A KR920002980B1 (ko) 1986-02-13 1987-02-13 도전성 수지 페이스트

Country Status (5)

Country Link
US (1) US4732702A (ko)
JP (1) JPH07103350B2 (ko)
KR (1) KR920002980B1 (ko)
GB (1) GB2186577B (ko)
NL (1) NL8700189A (ko)

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US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
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US5188767A (en) * 1990-04-27 1993-02-23 Hitachi Chemical Co., Ltd. Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder
JPH0412595A (ja) * 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
JP2522588B2 (ja) * 1990-06-23 1996-08-07 株式会社日立製作所 リニアモ―タカ―の地上コイル用エポキシ樹脂組成物および該組成物でモ―ルドした地上コイル
US5386000A (en) * 1990-10-24 1995-01-31 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same
US5250600A (en) * 1992-05-28 1993-10-05 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same
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KR101020164B1 (ko) 2003-07-17 2011-03-08 허니웰 인터내셔날 인코포레이티드 진보된 마이크로전자적 응용을 위한 평탄화 막, 및 이를제조하기 위한 장치 및 방법
JP4549655B2 (ja) * 2003-11-18 2010-09-22 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 機能性塗料
JP2006080013A (ja) * 2004-09-10 2006-03-23 Mitsui Mining & Smelting Co Ltd 導電性ペースト及びその導電性ペーストを用いて得られるフレキシブルプリント配線板
ATE397647T1 (de) * 2006-03-06 2008-06-15 Umicore Ag & Co Kg Zusammensetzung zur befestigung von hochleistungshalbleiter
EP1935914A1 (de) * 2006-12-22 2008-06-25 Sika Technology AG Hydroxyester-vorverlängerte Epoxidgruppen terminierte Zähigkeitsverbesserer und Verfahren zu deren Herstellung
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Also Published As

Publication number Publication date
GB8701509D0 (en) 1987-02-25
JPS62275180A (ja) 1987-11-30
US4732702A (en) 1988-03-22
JPH07103350B2 (ja) 1995-11-08
GB2186577A (en) 1987-08-19
NL8700189A (nl) 1987-09-01
GB2186577B (en) 1989-11-08
KR920002980B1 (ko) 1992-04-11

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